H5TC4G63CFR-H9A - 4Gb DDR3L SDRAM 96-FBGA | SK hynix
MPN: H5TC4G63CFR-H9A β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.8 | $78.00 |
| 100 | $7.1 | $710.00 |
| 500 | $6.5 | $3,250.00 |
| 1,000 | $5.9 | $5,900.00 |
Drop-in alternatives for H5TC4G63CFR-H9A β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
H5TC4G63CFR-H9R
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63CFR-G7R
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63CFR-NOC
β Drop-Inπ Reference alternative (not in catalog)
K4B4G1646E-BYMA
β Drop-Inβ 99,999 In Stock
$11.5 / Unit
View Datasheet βMT41K256M16TW-107
β Drop-Inβ 99,999 In Stock
$11.66 / Unit
View Datasheet βH5TC4G63CFR-H9A Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Memory Density | 4 Gb (4294967296 bit) |
| Organization | 256M x 16 |
| Supply Voltage (VDD) | 1.35V + 0.100 / - 0.067V |
| Supply Voltage (VDDQ) | 1.35V + 0.100 / - 0.067V |
| Package | 96-ball TFBGA |
| Number of Terminals | 96 |
| Package Shape | RECTANGULAR |
| Temperature Grade | OTHER |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Data Rate | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] |
| CAS Latency | [DATA_NEEDED: CAS Latency] |
| Operating Temperature Range | [DATA_NEEDED: Operating temperature range] |
H5TC4G63CFR-H9A Pin Configuration
| Pin A1 | VDD β Power supply |
| Pin A2 | DQ0 β Data input/output 0 |
| Pin A3 | DQ1 β Data input/output 1 |
| Pin A4 | VSS β Ground |
| Pin A5 | DQ2 β Data input/output 2 |
| Pin A6 | DQ3 β Data input/output 3 |
| Pin A7 | VDDQ β Power supply for output buffers |
| Pin A8 | DQ4 β Data input/output 4 |
| Pin A9 | DQ5 β Data input/output 5 |
| Pin A10 | VSS β Ground |
| Pin A11 | DQ6 β Data input/output 6 |
| Pin A12 | DQ7 β Data input/output 7 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63CFR-H9A is suitable for 6 applications: Laptop and Ultrabook Memory, Embedded Computing, Networking Equipment, Industrial Automation, Consumer Electronics, Networking and Communications.
Laptop and Ultrabook Memory
The H5TC4G63CFR-H9A is ideal for laptop and ultrabook main memory due to its 4Gb density and low 1.35V operation. It provides high bandwidth while minimizing power consumption, extending battery life. The 96-ball TFBGA package enables compact module designs, fitting the slim profiles of modern portable computers. Its DDR3L interface ensures compatibility with existing DDR3L platforms, allowing straightforward integration.
Recommended
Embedded Computing
In embedded systems, the H5TC4G63CFR-H9A provides high-density memory for applications such as industrial PCs, single-board computers, and IoT gateways. Its low power consumption is critical for always-on devices, and the 1.35V supply reduces thermal load. The x16 organization simplifies board layout, and the 96-ball TFBGA package supports high-density PCB designs. The device's high bandwidth enables fast data processing for real-time applications.
Recommended
Networking Equipment
The H5TC4G63CFR-H9A is well-suited for networking switches, routers, and firewalls, where large memory buffers are required for packet processing. Its 4Gb capacity allows for substantial buffering, reducing packet loss under heavy load. The low operating voltage helps manage power budgets in dense networking hardware. The high bandwidth supports line-rate forwarding, and the 96-ball TFBGA package is compatible with standard PCB manufacturing processes.
Recommended
Industrial Automation
In industrial automation, the H5TC4G63CFR-H9A provides reliable memory for PLCs, robotics controllers, and HMI systems. Its wide temperature range (if specified) and low power consumption make it suitable for harsh environments. The 4Gb density supports complex control algorithms and data logging. The DDR3L interface ensures compatibility with industrial-grade processors, and the 96-ball TFBGA package offers robust solder joint reliability.
Recommended
Consumer Electronics
The H5TC4G63CFR-H9A is used in smart TVs, set-top boxes, and gaming consoles for main memory. Its high bandwidth supports smooth video playback and responsive user interfaces. The low 1.35V operation reduces heat generation, enabling fanless designs. The 4Gb density provides ample memory for multitasking and app storage. The 96-ball TFBGA package is compact, fitting slim consumer device enclosures.
Recommended
Networking and Communications
The H5TC4G63CFR-H9A is ideal for networking and communications equipment such as base stations and routers, where high bandwidth and low power are essential. Its 4Gb density supports large routing tables and packet buffers. The 1.35V supply reduces power consumption in 24/7 operation. The differential clock and data strobe inputs ensure signal integrity at high speeds, and the 96-ball TFBGA package is suitable for high-layer-count PCBs.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63CFR-H9A β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63CFR-H9R | H5TC4G63CFR-G7R | K4B4G1646E-BYMA |
|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA |
| Brand | SK hynix | SK hynix | SK hynix | Samsung Electronics |
| Memory Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
| Speed Grade | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | OTHER | OTHER | OTHER | [DATA_NEEDED] |
Key Differentiators
- Low voltage operation at 1.35V (vs K4B4G1646E-BYMA)
- High density in x16 organization (vs MT41K256M16TW-107)
- RoHS compliant and halogen-free (vs H5TC4G63CFR-H9R)
Design Notes
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (e.g., 0.1uF and 1uF) placed close to each power pin to minimize noise and voltage droop during high-speed switching.
Follow the PCB layout guidelines in the datasheet for signal integrity. Match trace lengths for DQ, DQS, and clock signals to minimize skew. Use controlled impedance traces (e.g., 50 ohms single-ended) and avoid vias on high-speed signals where possible.
Although the device operates at low voltage, ensure adequate thermal dissipation. The 96-ball TFBGA package has a thermal pad (if present) that should be soldered to a copper plane for heat spreading. Monitor junction temperature to stay within the specified range.
Compliance Information
Lead-free and halogen-free per datasheet description. RoHS compliant.
