H5TC4G63CFR-xxI - 4Gb DDR3L SDRAM | SK Hynix
MPN: H5TC4G63CFR-xxI β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.1 | $8,100.00 |
Drop-in alternatives for H5TC4G63CFR-xxI β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
H5TC4G63CFR-xxA
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63CFR-RDAR
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63CFR-H9A
β Drop-Inβ 99,999 In Stock
$5.9 / Unit
View Datasheet βK4B4G0846D
β Drop-Inπ Reference alternative (not in catalog)
MT41K512M8DA-107
β Drop-Inπ Reference alternative (not in catalog)
H5TC4G63CFR-xxI Maximum Ratings & Electrical Characteristics
| Memory Type | DDR3L SDRAM |
| Density | 4Gb |
| Organization | 512M x 8 |
| Supply Voltage (VDD) | 1.35V +0.100 / -0.067V |
| Supply Voltage (VDDQ) | 1.35V +0.100 / -0.067V |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] |
| Package | 78-ball FBGA |
| RoHS | Compliant |
| Lead-Free | Yes |
| Halogen-Free | Yes |
| Data Rate | [DATA_NEEDED: speed grade] |
| CAS Latency | [DATA_NEEDED: CAS latency] |
| Burst Length | 8 (with burst chop) |
| On-Die Termination | Yes |
| Refresh | Auto-refresh, self-refresh, TCSR |
H5TC4G63CFR-xxI Pin Configuration
| Pin A1 | VDD β Power supply |
| Pin A2 | DQ0 β Data input/output 0 |
| Pin A3 | VSS β Ground |
| Pin B1 | DQ1 β Data input/output 1 |
| Pin B2 | VDDQ β Power supply for output buffers |
| Pin B3 | DQ2 β Data input/output 2 |
| Pin C1 | VSSQ β Ground for output buffers |
| Pin C2 | DQ3 β Data input/output 3 |
| Pin C3 | VDD β Power supply |
| Pin D1 | CK β Clock input |
| Pin D2 | CK# β Complementary clock input |
| Pin D3 | VSS β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5TC4G63CFR-xxI is suitable for 6 applications: Server Main Memory, Networking Equipment, Industrial Computing, Embedded Systems, Automotive Infotainment, Consumer Electronics.
Server Main Memory
The H5TC4G63CFR-xxI provides high-density, low-power memory for server applications. Its 4Gb density and 1.35V operation reduce power consumption in data centers, while the high bandwidth supports demanding workloads. The device's on-chip DLL ensures reliable data alignment, critical for high-speed server memory buses.
Recommended
Networking Equipment
In networking equipment such as routers and switches, the H5TC4G63CFR-xxI offers the memory density and bandwidth needed for packet buffering and forwarding tables. Its low power operation at 1.35V is beneficial for power-constrained networking devices. The device's differential clock inputs and DLL improve signal integrity in high-speed networking environments.
Recommended
Industrial Computing
The H5TC4G63CFR-xxI is suitable for industrial computing applications where reliability and low power are essential. Its wide operating temperature range and 1.35V operation make it ideal for harsh environments. The device's auto-refresh and self-refresh modes ensure data integrity during power fluctuations.
Recommended
Embedded Systems
For embedded systems, the H5TC4G63CFR-xxI provides high memory density in a compact 78-ball FBGA package. Its low power consumption at 1.35V extends battery life in portable devices. The device's on-die termination and programmable CAS latency allow flexible integration with various embedded processors.
Recommended
Automotive Infotainment
The H5TC4G63CFR-xxI can be used in automotive infotainment systems, providing high-bandwidth memory for navigation, multimedia, and connectivity features. Its 1.35V operation reduces power consumption in vehicles, and its robust design supports automotive temperature ranges. The device's high density enables storage of large maps and media files.
Recommended
Consumer Electronics
In consumer electronics such as smart TVs and set-top boxes, the H5TC4G63CFR-xxI offers the memory capacity and speed required for high-definition video processing and multitasking. Its low power operation at 1.35V is ideal for energy-efficient devices. The device's burst length 8 and on-chip DLL ensure smooth data streaming.
Recommended
Recommended Products Summary
Engineering reference data for H5TC4G63CFR-xxI β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5TC4G63CFR-xxA | H5TC4G63CFR-RDAR | K4B4G0846D |
|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| Data Rate | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Low voltage operation at 1.35V (vs Standard DDR3 (1.5V))
- High density 4Gb in 78-ball FBGA (vs Lower density DDR3L parts)
- Lead-free and halogen-free (vs Older DDR3 parts with lead)
Design Notes
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (0.1uF) placed close to each power pin. A bulk capacitor (10uF) per power rail is recommended to handle transient currents during read/write operations.
Follow DDR3L layout guidelines: match trace lengths for DQ, DQS, and address/command signals to minimize skew. Maintain controlled impedance (typically 40-60 ohms) for data and clock lines. Keep VREF traces short and well-decoupled.
The H5TC4G63CFR-xxI operates within a specified temperature range. Ensure adequate airflow or heatsinking in high-ambient-temperature environments. Monitor junction temperature to prevent overheating, which can cause data corruption.
Compliance Information
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for memory components.