H5TC4G63CFR-xxI - 4Gb DDR3L SDRAM | SK Hynix
Référence : H5TC4G63CFR-xxI ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.9 | $4 450,00 |
| 1 000 | $8.1 | $8 100,00 |
H5TC4G63CFR-xxI Présentation
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that achieves high data transfer rates by transferring data on both edges of the clock signal. It operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by about 20% while maintaining similar performance. DDR3L is part of the DDR3 memory family, which is widely used in computing, networking, and embedded systems.
Key features include a 4Gb density organized as 512M x 8, a data rate of (e.g., 1600 Mbps), and support for 1.35V operation. The device uses an 8n-prefetch architecture, which enables high bandwidth by fetching 8 data words per clock cycle. It also supports on-die termination (ODT), programmable CAS latency, and burst lengths of 8 and 4 (with burst chop).
The H5TC4G63CFR-xxI is fabricated using advanced DRAM process technology, ensuring high reliability and low power consumption. The on-chip DLL synchronizes the output data with the clock, reducing skew and improving signal integrity. The device includes auto-refresh and self-refresh modes for low-power standby, and it supports temperature-compensated self-refresh (TCSR) to optimize refresh rate based on operating temperature.
Typical applications include servers, networking equipment, industrial computing, and embedded systems where high memory density and low power are critical. The 1.35V operation makes it ideal for power-sensitive designs, such as laptops, portable devices, and energy-efficient data centers.
When designing with this device, ensure proper decoupling of VDD and VDDQ with 0.1uF capacitors placed close to the pins. Follow the DDR3L layout guidelines for signal integrity, including matched trace lengths for DQ, DQS, and address/command signals. The device requires a stable 1.35V supply and a clean reference voltage (VREF) for optimal operation.
Alternatives de remplacement direct pour H5TC4G63CFR-xxI — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec H5TC4G63CFR-xxI (même facteur de forme et même empreinte) — différant par Organization, Package, Burst Length, Supply Voltage (VDD), Supply Voltage (VDDQ).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
H5TC4G63CFR-xxA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
H5TC4G63CFR-RDAR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
H5TC4G63CFR-H9A
✅ Remplacement direct✓ En stock
$6.5 / unité
Voir la fiche technique →K4B4G0846D
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MT41K512M8DA-107
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
H5TC4G63CFR-xxI Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR3L SDRAM |
| Density | 4Gb |
| Organisation de la mémoire | 512M x 8 |
| Supply Voltage (VDD) | 1.35V +0.100 / -0.067V |
| Supply Voltage (VDDQ) | 1.35V +0.100 / -0.067V |
| Boîtier | 78-ball FBGA |
| RoHS | Compliant |
| Lead-Free | Yes |
| Sans halogène | Yes |
| Burst Length | 8 (with burst chop) |
| On-Die Termination | Yes |
| Refresh | Auto-refresh, self-refresh, TCSR |
Configuration des broches de H5TC4G63CFR-xxI
| Broche A1 | VDD — Power supply |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | VSS — Ground |
| Broche B1 | DQ1 — Data input/output 1 |
| Broche B2 | VDDQ — Power supply for output buffers |
| Broche B3 | DQ2 — Data input/output 2 |
| Broche C1 | VSSQ — Ground for output buffers |
| Broche C2 | DQ3 — Data input/output 3 |
| Broche C3 | VDD — Power supply |
| Broche D1 | CK — Clock input |
| Broche D2 | CK# — Complementary clock input |
| Broche D3 | VSS — Ground |
Applications typiques
H5TC4G63CFR-xxI convient pour 6 applications: Server Main Memory, Networking Equipment, Industrial Computing, Embedded Systems, Automotive Infotainment, Consumer Electronics.
Server Main Memory
The H5TC4G63CFR-xxI provides high-density, low-power memory for server applications. Its 4Gb density and 1.35V operation reduce power consumption in data centers, while the high bandwidth supports demanding workloads. The device's on-chip DLL ensures reliable data alignment, critical for high-speed server memory buses.
Recommandé
Networking Equipment
In networking equipment such as routers and switches, the H5TC4G63CFR-xxI offers the memory density and bandwidth needed for packet buffering and forwarding tables. Its low power operation at 1.35V is beneficial for power-constrained networking devices. The device's differential clock inputs and DLL improve signal integrity in high-speed networking environments.
Recommandé
Industrial Computing
The H5TC4G63CFR-xxI is suitable for industrial computing applications where reliability and low power are essential. Its wide operating temperature range and 1.35V operation make it ideal for harsh environments. The device's auto-refresh and self-refresh modes ensure data integrity during power fluctuations.
Recommandé
Embedded Systems
For embedded systems, the H5TC4G63CFR-xxI provides high memory density in a compact 78-ball FBGA package. Its low power consumption at 1.35V extends battery life in portable devices. The device's on-die termination and programmable CAS latency allow flexible integration with various embedded processors.
Recommandé
Automotive Infotainment
The H5TC4G63CFR-xxI can be used in automotive infotainment systems, providing high-bandwidth memory for navigation, multimedia, and connectivity features. Its 1.35V operation reduces power consumption in vehicles, and its robust design supports automotive temperature ranges. The device's high density enables storage of large maps and media files.
Recommandé
Consumer Electronics
In consumer electronics such as smart TVs and set-top boxes, the H5TC4G63CFR-xxI offers the memory capacity and speed required for high-definition video processing and multitasking. Its low power operation at 1.35V is ideal for energy-efficient devices. The device's burst length 8 and on-chip DLL ensure smooth data streaming.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour H5TC4G63CFR-xxI — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | H5TC4G63CFR-xxA | H5TC4G63CFR-RDAR | K4B4G0846D |
|---|---|---|---|---|
| Package | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA | 78-ball FBGA |
| Brand | SK Hynix | SK Hynix | SK Hynix | Samsung Electronics |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 512M x 8 | 512M x 8 | 512M x 8 | 512M x 8 |
| Supply Voltage | 1.35V | 1.35V | 1.35V | 1.35V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Low voltage operation at 1.35V (vs Standard DDR3 (1.5V))
- High density 4Gb in 78-ball FBGA (vs Lower density DDR3L parts)
- Lead-free and halogen-free (vs Older DDR3 parts with lead)
Notes de conception
Ensure stable 1.35V supply for VDD and VDDQ. Use low-ESR decoupling capacitors (0.1uF) placed close to each power pin. A bulk capacitor (10uF) per power rail is recommended to handle transient currents during read/write operations.
Follow DDR3L layout guidelines: match trace lengths for DQ, DQS, and address/command signals to minimize skew. Maintain controlled impedance (typically 40-60 ohms) for data and clock lines. Keep VREF traces short and well-decoupled.
The H5TC4G63CFR-xxI operates within a specified temperature range. Ensure adequate airflow or heatsinking in high-ambient-temperature environments. Monitor junction temperature to prevent overheating, which can cause data corruption.
Informations de conformité
Lead-free and halogen-free per datasheet. RoHS compliant. AEC-Q100 not applicable for memory components.