10AS057H2F34I1HG - Arria 10 SX SoC FPGA 570K LE | Intel
MPN: 10AS057H2F34I1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6140.27 | $6,140.27 |
| 5 | $5912.55 | $29,562.75 |
| 10 | $5750.18 | $57,501.80 |
| 25 | $5520.4 | $138,010.00 |
| 50 | $5305.75 | $265,287.50 |
| 100 | $4980.3 | $498,030.00 |
Drop-in alternatives for 10AS057H2F34I1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS057H2F34I1SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS057H1F34I1HG
✅ Drop-In✓ In Stock
$3500 / Unit
View Datasheet →10AS057H2F34E2SG
✅ Drop-In✓ In Stock
$3250 / Unit
View Datasheet →10AS057H2F34E2LG
✅ Drop-In✓ In Stock
$2524.1 / Unit
View Datasheet →10AS057H2F34E1HG
✅ Drop-In✓ In Stock
$3050 / Unit
View Datasheet →10AS048H2F34I1HG
✅ Drop-In✓ In Stock
$2520 / Unit
View Datasheet →10AS057H2F34I1HG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Family | Arria 10 |
| Device Type | SoC FPGA (HPS + FPGA) |
| Logic Elements | 570,000 |
| Hard Processor Subsystem (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Package | 1152-FCBGA (F34), 35x35 mm |
| User I/O Count | 492 |
| Transceivers | Up to 28.05 Gbps |
| Process Technology | TSMC 20 nm |
| Operating Temperature | -40C to +100C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead Free | Yes |
| Supply Voltage Core | 0.85 V (typ) |
10AS057H2F34I1HG 1152-fcbga (f34), 35x35 mm Pin Configuration Guide
Complete pinout information for 10AS057H2F34I1HG (1152-fcbga (f34), 35x35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H2F34I1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H2F34I1HG is suitable for 6 applications: Wireless Baseband and Radio Unit Processing, Military Radar and Electronic Warfare, High-Performance Industrial Imaging and Machine Vision, Medical Imaging Acceleration (CT, MRI, Ultrasound), Test and Measurement Instrumentation, Broadcast Video Processing and IP Media Gateways.
Wireless Baseband and Radio Unit Processing
The 10AS057H2F34I1HG is engineered for wireless baseband processing in 4G LTE, 5G NR, and small-cell radio units where the dual ARM Cortex-A9 HPS runs protocol-stack software while the 570K-logic-element fabric implements PHY-layer DSP. Transceivers up to 28.05 Gbps enable CPRI and JESD204B/C fronthaul to RFICs, while the hardened PCIe Gen3 IP supports accelerator ASICs. The 1.5 GHz HPS frequency comfortably executes L1/L2 scheduling and MAC logic, and the industrial temperature range supports outdoor tower-mounted deployments with conduction cooling.
Recommended
Military Radar and Electronic Warfare
Arria 10 SX SoC FPGAs including the 10AS057H2F34I1HG serve as the compute backbone for phased-array radar, SIGINT, and electronic-countermeasure systems where deterministic, low-latency signal processing is required. The variable-precision DSP blocks with hardened IEEE 754 floating point accelerate FFTs, beamforming, and pulse-Doppler processing, while the dual ARM Cortex-A9 HPS handles control-plane tasks, target tracking, and operator interfaces. The industrial temperature range and 28 Gbps transceivers support ruggedized, defense-grade platforms where a single SoC replaces a CPU+ASIC+FPGA stack.
Recommended
High-Performance Industrial Imaging and Machine Vision
The 10AS057H2F34I1HG integrates 570K logic elements with multi-Gbps transceivers ideal for high-line-scan and area-scan machine-vision systems requiring simultaneous sensor aggregation and real-time preprocessing. The Cortex-A9 HPS runs Linux-based vision pipelines (OpenCV, GStreamer) while the FPGA fabric handles Bayer demosaicing, lens distortion correction, and 10/25 GigE Vision packet assembly. The 28 Gbps transceivers support CoaXPress-12 and 25 GigE Vision aggregation at full sensor bandwidth, and the industrial temperature rating suits factory-floor deployment.
Recommended
Medical Imaging Acceleration (CT, MRI, Ultrasound)
The 10AS057H2F34I1HG accelerates backprojection, beamforming, and image-reconstruction algorithms in CT, MRI, and ultrasound systems where both low-latency DSP and embedded CPU control are required. The hardened floating-point DSP blocks deliver up to 1.5 TFLOPS, suitable for FDK reconstruction and back-end filtering, while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and acquisition control. The 1152-FCBGA F34 package supports dense PCB layouts typical of cart-based and stationary imaging systems.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators use the 10AS057H2F34I1HG as the central processing element, leveraging the 570K LE fabric for real-time acquisition pipelines and the dual ARM Cortex-A9 HPS for UI, networking, and remote-control software. Transceivers up to 28 Gbps enable 100 GbE aggregation for distributed acquisition systems, while the hardened PCIe Gen3 IP supports high-bandwidth ADC/DAC companion cards. Industrial temperature and the F34 FCBGA footprint suit dense multi-board chassis designs.
Recommended
Broadcast Video Processing and IP Media Gateways
The 10AS057H2F34I1HG handles real-time HEVC/H.264 codec acceleration, video stitching, and IP-media gateway functions in broadcast production trucks and headend systems. The FPGA fabric implements multi-stream video pipeline stages while the dual Cortex-A9 HPS runs SMPTE ST 2059 / PTP timing, control plane, and web-based management interfaces. Transceivers up to 28 Gbps support 12G-SDI aggregation and SMPTE ST 2022-6 uncompressed IP video at full bandwidth. Industrial temperature supports outdoor broadcast venues and mobile production.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H2F34I1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H2F34I1SG | 10AS057H1F34I1HG | 10AS057H2F34E2SG | 10AS057H2F34E2LG | 10AS057H2F34E1HG | 10AS048H2F34I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34, 35x35 mm) | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same |
| Logic Elements | 570,000 | 570,000 - same | 570,000 - same | 570,000 - same | 570,000 - same | 570,000 - same | 480,000 (-16%) |
| Speed Grade | H2 (high-speed) | S (slower, -1 bin) | H1 (lower-power) | S (slower, -1 bin) | L (lowest, -2 bin) | H1 (lower-power) | H2 (high-speed) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) |
| HPS (ARM Cortex-A9) | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz |
| User I/O | 492 | 492 - same | 492 - same | 492 - same | 492 - same | 492 - same | 492 - same |
| Transceivers (max Gbps) | 28.05 Gbps | 28.05 Gbps - same | 17.4 Gbps (reduced channels) | 28.05 Gbps - same | 28.05 Gbps - same | 17.4 Gbps (reduced channels) | 28.05 Gbps - same |
Key Differentiators
- Highest speed grade (H2) in the Arria 10 SX 570K-LE F34 family (vs 10AS057H2F34I1SG)
- Full transceiver count (H2 suffix) vs reduced channel count (vs 10AS057H1F34I1HG)
- Industrial temperature grade for ruggedized deployment (vs 10AS057H2F34E2SG)
- Full 570K logic-element capacity vs 480K in lower-resource siblings (vs 10AS048H2F34I1HG)
Design Notes
The 1152-FCBGA F34 package (35x35 mm, 1.0 mm ball pitch) requires high-density PCB fabrication with microvia stack-ups, laser-drilled vias, and tight impedance control for the 28 Gbps transceiver channels. Use Intel/Altera-recommended 12-layer stack-ups with dedicated ground planes under the BGA field. Decoupling must follow the Quartus Prime early-pin-out-decoupling-cap-finder results, with bulk, mid-range, and high-frequency capacitors placed as close to the die as the layout allows to meet simultaneous-switching-noise margins.
Estimated: at full utilization (570K LE, 28 Gbps transceivers active, dual HPS cores at 1.5 GHz), the Arria 10 SX 10AS057H2F34I1HG dissipates approximately 20-25 W. With the F34 FCBGA thermal resistance around 0.8 C/W (theta_JB), the junction-to-PCB thermal path is dominant. A thermal-management plan must include a high-performance lid, thermal interface material, and chassis-level heat-spreader or heatsink sized for the industrial 100C junction limit at the worst-case ambient.
The HPS boot configuration (BSEL pins, eFuses, clock source) must be finalized before Quartus Prime pinout assignment, as changing it late in the design cycle forces a re-spin of the PCB. Designers often overlook the need for separate power-rail sequencing (0.85 V core, 1.1 V HPS, 1.8 V/2.5 V/3.3 V I/O, transceiver PLLs), each requiring a dedicated regulator with monotonic startup per Intel power-management recommendations. Skipping proper sequencing can cause inrush failures or HPS boot corruption that is hard to diagnose.
DDR4/3 external memory interfaces must be routed with matched-length, fly-by topology per the Intel EMIF Toolkit guidelines, with each byte group kept within 5 ps of skew. Transceiver channels must preserve 100-ohm differential impedance, with continuous reference planes and minimum via transitions. The HPS SDRAM controller has its own dedicated DQS/DQ routing rules separate from the FPGA fabric EMIF - never reuse routing templates between the two subsystems.
Compliance Information
RoHS and lead-free confirmed via Altera/Intel trade compliance data. Reach compliance stated on the product ordering page. Halogen-free status should be verified against the latest Intel material declaration. AEC-Q100 is not applicable to FPGAs (automotive qualification follows a separate Q-100 flow if required).
