Intel

10AS057H2F34E1HG - Arria 10 SX SoC FPGA 570K LE | Intel | FCBGA-1152

MPN: 10AS057H2F34E1HG ✓ Active
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1152-ball FCBGA (F34), 35x35 mm Package H2 Speed Multi-port SDRAM controller (hardened) Memory
From $3050 USD / Unit
MOQ: 1 |
Price updated: 2026-09-04
Volume Pricing
Qty Unit Price Extended
1 $3450.08 $3,450.08
10 $3325.5 $33,255.00
25 $3210 $80,250.00
100 $3050 $305,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 10AS057H2F34E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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10AS057H1F34I1HG

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📦 1152-ball FCBGA (F34)
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📦 1152-ball FCBGA (F34)
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10AS048H2F34E1HG

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10AS048H2F34E2SG

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10AS048H1F34I1HG

✅ Drop-In ⚠️ 参数待验证
Intel
📦 1152-ball FCBGA (F34)
Arria 10 SX · System-on-Chip (SoC) FPGA · 480,000 · Dual-core ARM Cortex-A9 MPCore with CoreSight · 1.5 GHz · 20 nm · 0.9 V · 492 user I/O

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10AS057H2F34E1HG Maximum Ratings & Electrical Characteristics

Series Arria 10 SX
Device Type SoC FPGA (FPGA + Hard ARM Cortex-A9 MPCore)
Logic Elements 570K
Processor Cores Dual-core ARM Cortex-A9 MPCore with CoreSight
Process Technology 20 nm TSMC
Package 1152-ball FCBGA (F34), 35x35 mm
Speed Grade H2
Package Code F34
Mounting Type Surface Mount (BGA)
User I/O Count 492 (per datasheet)
RoHS Status Compliant
MSL Level 3 (per JEDEC J-STD-020, reflow 260C)
Hard Memory Controller Multi-port SDRAM controller (hardened)
FPGA Fabric Family Arria 10 (20 nm)

10AS057H2F34E1HG f34 Pin Configuration Guide

Complete pinout information for 10AS057H2F34E1HG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

f34 package pinout diagram for 10AS057H2F34E1HG

No detailed pinout data available for 10AS057H2F34E1HG.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10AS057H2F34E1HG Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10AS057H2F34E1HG is suitable for 6 applications: High-Bandwidth Communications Infrastructure, Industrial Motor Control and Robotics, Military and Aerospace Signal Processing, Medical Imaging Systems, ASIC Prototyping and Emulation, Broadcast Video Processing.

🌐

High-Bandwidth Communications Infrastructure

The 10AS057H2F34E1HG is well suited to communications infrastructure such as 100G/400G line cards, OTN framer/mapper designs, and CPRI front-haul processing. The Arria 10 SX device's hardened dual-core ARM Cortex-A9 subsystem handles control-plane protocols (NETCONF, gRPC, SNMP), while the 570K LE fabric implements high-speed data-path functions, packet classification, and traffic shaping. The H2 speed grade delivers the timing margin required for 25.8 Gbps transceiver operation. Integrated multi-port SDRAM controllers with ECC support simplify DDR4/DDR3 buffering of packets and statistics, eliminating external memory controller chips and reducing board complexity. Designers can run a Linux OS on the HPS while offloading hot-path work to FPGA accelerators via the AXI/CCIX coherent interconnect, achieving line-rate throughput without sacrificing control-plane flexibility.

🏭

Industrial Motor Control and Robotics

The 10AS057H2F34E1HG suits multi-axis industrial motor drives and collaborative robotics controllers that demand deterministic real-time response. The FPGA fabric implements multi-axis field-oriented control (FOC) loops, current sensing signal conditioning, and high-resolution PWM generation at switching frequencies up to 100 kHz. The hard ARM Cortex-A9 cores run EtherCAT, PROFINET, or EtherNet/IP master stacks and the LinuxCNC/RT-Linux real-time kernel for trajectory planning. With 570K logic elements the device supports 6-8 axes of high-performance FOC plus integrated functional safety logic (STO, SBC, SLS) using the Arria 10's SEU-aware logic and lockstep-capable HPS. The 1152-ball FCBGA exposes 492 user I/Os, providing ample LVDS, GPIO, and high-speed interfaces for encoder feedback, resolver excitation, and isolated communications. Designers should provision robust thermal management via thermal vias and a heatspreader for continuous full-load motor drive operation.

✈️

Military and Aerospace Signal Processing

The 10AS057H2F34E1HG fits defense and aerospace signal-processing platforms including radar front-end preprocessing, electronic warfare (EW) sub-systems, and secure communications modems. Its 570K LE fabric implements wide-bandwidth digital down-conversion, pulse compression, adaptive beamforming, and FFT-based spectrum analysis at sample rates exceeding 1 GSPS using the hardened DSP blocks. The integrated ARM Cortex-A9 cores run a secure Linux or VxWorks instance handling crypto offload and protocol stack management. Extended temperature grade variants of the F34 package support avionics and ground-vehicle environments. Designers should pair the device with radiation-tolerant external memory (DDR3L with ECC) and follow the Arria 10 device handbook's SEU-mitigation recommendations, including TMR scrubbing and watchdog schemes. The high unit price reflects the die's mixed signal integrity, hardened IP blocks, and extended qualification flow required by defense programs.

💊

Medical Imaging Systems

The 10AS057H2F34E1HG is deployed in high-end medical imaging modalities including ultrasound beamformers, CT reconstruction pipelines, and MRI RF receivers. The FPGA fabric performs real-time beam steering, channel summation, and back-end image reconstruction (filtered back-projection or iterative methods) at the throughput required for clinical imaging frame rates. The hard ARM Cortex-A9 cores run the user interface, DICOM stack, and post-processing algorithms on Linux. The 570K LE density supports 64-128 channel ultrasound systems or single-slice CT reconstruction at full rate. Multi-port SDRAM controllers with ECC protect patient-data integrity during real-time processing. The integrated SoC architecture reduces the bill of materials compared to FPGA-plus-external-CPU designs, which is critical for medical device cost targets and IEC 60601-1 compliance verification. Confirm extended-grade qualification for clinical deployment.

🖥️

ASIC Prototyping and Emulation

The 10AS057H2F34E1HG is widely used as a building block in ASIC and SoC prototyping because the Arria 10 family offers multi-vendor FPGA-based prototyping flows. Engineers map large ASIC partitions onto the 570K LE fabric, partitioning clocks and debug instrumentation to validate RTL at near-ASIC speeds before tape-out. The integrated ARM Cortex-A9 hard cores also enable prototype verification of heterogeneous SoCs that mix custom logic with ARM-based subsystems. The 1152-ball F34 package exposes the high I/O count needed for daughter-card interconnect and speed-bridge adapters to other FPGAs in multi-FPGA prototyping racks. Designers should plan for the Quartus Prime Pro design flow, time-budget partitioning, and remote-update via the HPS to iterate quickly on prototyping bring-up. The same device doubles as a low-volume production platform when the target ASIC is delayed.

📺

Broadcast Video Processing

The 10AS057H2F34E1HG serves broadcast video infrastructure including contribution encoders, IP gateways (SMPTE ST 2110), and playout servers where real-time video processing meets streaming and control workloads. The FPGA fabric implements UHD HDR/SDR conversion, frame-rate conversion, motion-compensated deinterlacing, and ST 2110 packetization/encapsulation at multi-Gbps data rates. The hard ARM Cortex-A9 cores run a Linux control plane with SMPTE NMOS IS-04/IS-05 for device discovery and connection management. The multi-port SDRAM controller with ECC supports line buffers for full-bandwidth UHD processing. The Arria 10 SX SoC integration eliminates the external processor that legacy broadcast designs required, reducing BOM and synchronization complexity. Designers should follow the Arria 10 transceiver guidelines for 12G-SDI and 25G Ethernet PHY integration.

What type of device is the 10AS057H2F34E1HG?
The 10AS057H2F34E1HG is an Intel Arria 10 SX System-on-Chip FPGA that integrates 570K logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system and CoreSight debug. It is built on TSMC's 20 nm process and ships in a 1152-ball FCBGA (F34) package. SoC FPGAs merge a programmable logic fabric with hard processor cores on a single die for embedded compute applications.
How many logic elements does the 10AS057H2F34E1HG have?
The 10AS057H2F34E1HG contains 570K Arria 10 logic elements. This positions it in the mid-density tier of the Arria 10 SX family. According to the Altera (now Intel) ordering information, the 570K-LE variant targets designs that need substantial DSP and transceiver resources without paying for the largest 1.15M-LE devices in the family.
What package does the 10AS057H2F34E1HG use?
The 10AS057H2F34E1HG uses a 1152-ball Flip-Chip BGA package (F34 package code) measuring 35x35 mm. The F34 suffix in the part number encodes the package variant. This FCBGA is shared by other Arria 10 SX 570K LE devices, enabling PCB layout reuse across speed grade and temperature grade options.
Where can I buy the 10AS057H2F34E1HG?
The 10AS057H2F34E1HG is available from authorized distributors including DigiKey, Mouser, and Intel-direct channels. Heisener lists approximately 7,700-7,800 pieces in stock as of 2026-09-05. Given its high unit price, requesting a formal quotation is recommended for prototype and production volumes.
What is the price of the 10AS057H2F34E1HG?
The 10AS057H2F34E1HG unit price is approximately USD 3,450.08 per piece at quantity 1 as of 2026-09-05, per Heisener listings. Pricing varies with quantity breaks; large-volume orders should obtain a formal quote from Intel or an authorized distributor. Distributors often show slightly different real-time stock-adjusted pricing on their product pages.
What is the lead time for the 10AS057H2F34E1HG?
The lead time for the 10AS057H2F34E1HG is listed as 'To Be Confirmed' by Heisener as of 2026-09-05, with estimated delivery windows of approximately 1-3 weeks from order confirmation. Lead times for Arria 10 SX devices are highly allocation-sensitive; place orders early in the design cycle and confirm with the distributor before locking your BOM.
10AS057H2F34E1HG vs 10AS057H2F34E2SG - what is the difference?
Both parts share the same 570K LE Arria 10 SX die and the F34 1152-ball FCBGA package. The 'E' versus 'E2' suffix and '1' versus '2' position code denote different ordering codes that typically differ in speed grade, temperature grade, or transceiver compliance options. Both are drop-in compatible at the BGA footprint but designers must verify the speed/transceiver grade matches their application requirements before substitution.
What is the best drop-in replacement for the 10AS057H2F34E1HG?
The best drop-in replacement is another 10AS057N3F40 or 10AS057H2F34 variant such as the 10AS057H2F34E2SG, which shares the F34 1152-ball FCBGA footprint. Same-family variants with different speed grades (H1, H2, H3) or temperature grades (E for extended, I for industrial) are pin-compatible. Always confirm the device variant supports your required transceiver data rates and DSP configuration.
Can the 10AS057H1F34E1HG replace the 10AS057H2F34E1HG?
The 10AS057H1F34E1HG is a valid drop-in replacement for the 10AS057H2F34E1HG at the 1152-ball FCBGA footprint, but it uses the H1 speed grade instead of H2. The H1 grade offers slightly lower timing performance than H2. If your design margins accommodate H1 timing closure and DSP/transceiver specifications, the swap is straightforward; otherwise the H2 part should be retained.
When should I choose 10AS057H2F34E1HG over the Arria 10 GX FPGA?
Choose the 10AS057H2F34E1HG (Arria 10 SX) when you need an integrated hard ARM Cortex-A9 processor subsystem on the same die as the FPGA fabric. Choose an Arria 10 GX (non-SoC) device when you have an external host processor or do not need the ARM cores. The SX variant reduces board area, BOM cost, and inter-chip latency for designs that previously combined an FPGA with a separate CPU.
Where can I download the 10AS057H2F34E1HG datasheet PDF?
The official 10AS057H2F34E1HG product page is published at https://www.altera.com/products/fpga/arria/10/sx/10as057-f34/10AS057H2F34E1HG and contains links to the Arria 10 SX device datasheet (PDF) and device handbook. Intel's FPGA documentation index also hosts the full Arria 10 family datasheet and pin connection guidelines for the F34 package.
Where can I find the 10AS057H2F34E1HG pinout?
The pinout for the 10AS057H2F34E1HG is documented in the Arria 10 SX device handbook and the F34 package pin connection guidelines PDF on the Intel FPGA website. Because this is a 1152-ball BGA, the official pinout file is typically delivered in CSV/QSF format for use with the Quartus Prime Pin Planner tool. Download both the pin connection guidelines and the device datasheet before PCB layout.
What is the operating temperature range of the 10AS057H2F34E1HG?
The operating temperature range for the 10AS057H2F34E1HG depends on the temperature grade ordered. The 'E' suffix in the part number typically denotes an extended grade, while an 'I' suffix indicates the industrial grade. Refer to the Arria 10 SX datasheet for the exact junction temperature range and recommended ambient operating conditions for the ordered variant.
What software tools support the 10AS057H2F34E1HG?
The 10AS057H2F34E1HG is supported by Intel Quartus Prime design software (Pro and Standard editions depending on license), with the Arria 10 device family included. Quartus provides synthesis, place-and-route, timing analysis, the Platform Designer (Qsys) for HPS configuration, and the SoC EDS toolkit for ARM Cortex-A9 software development on the hard processor subsystem.
What are the key specifications of the 10AS057H2F34E1HG that engineers should know?
The 10AS057H2F34E1HG integrates 570K Arria 10 logic elements with a dual-core ARM Cortex-A9 MPCore hard processor system on TSMC's 20 nm process. It ships in a 1152-ball FCBGA package (F34 code, 35x35 mm), exposes 492 user I/Os, and runs at H2 speed grade. According to Intel ordering information, the part supports multi-port SDRAM controllers, high-speed transceivers, and DSP blocks targeted at communications, industrial, and defense applications.
What is the best Xilinx equivalent for the 10AS057H2F34E1HG?
There is no pin-compatible Xilinx equivalent for the 10AS057H2F34E1HG because the 1152-ball F34 FCBGA footprint is Intel/Altera-proprietary. Functional Xilinx alternatives in the SoC FPGA category include Zynq-7000 and Zynq UltraScale+ devices, but they require a different PCB footprint and a different toolchain (Vivado). Plan a board redesign if you intend to migrate between vendors.

Engineering reference data for 10AS057H2F34E1HG — comparison, design guidance, and compliance information.

Selection Guide

Choose the 10AS057H2F34E1HG when your design needs 570K Arria 10 logic elements combined with a hard dual-core ARM Cortex-A9 processor subsystem in the F34 1152-ball FCBGA, and you require the H2 speed grade for higher timing margin (25.8 Gbps transceivers, 500 MHz fabric clocks). If your design closes timing at H1 or uses fewer than ~400K LE, the lower-cost 10AS057H1F34E1HG (H1, same F34 FCBGA) is a direct drop-in. For cost-sensitive applications that fit within 480K LE, the 10AS048H2F34E1HG shares the F34 footprint. Choose 10AS032H2F34I1HG only when the 320K LE budget suffices and industrial temperature is required. All six alternatives share the same F34 FCBGA ball pattern, so PCB rework is never required when swapping among them.

Comparison with Alternatives

Parameter This Product 10AS057H1F34E1HG 10AS057H1F34I1HG 10AS048H2F34E1HG 10AS032H2F34I1HG 10AS048H2F34E2SG 10AS048H1F34I1HG
Brand Intel Intel Intel Intel Intel Intel Intel
Package 1152-ball FCBGA (F34) 1152-ball FCBGA (F34) - same 1152-ball FCBGA (F34) - same 1152-ball FCBGA (F34) - same 1152-ball FCBGA (F34) - same 1152-ball FCBGA (F34) - same 1152-ball FCBGA (F34) - same
Logic Elements 570K 570K 570K 480K (-16%) 320K (-44%) 480K (-16%) 480K (-16%)
Speed Grade H2 H1 (lower performance) H1 (lower performance) H2 (same) H2 (same) H2 (same) H1 (lower performance)
Temperature Grade Extended (E) Extended (E) Industrial (I) Extended (E) Industrial (I) Extended (E) Industrial (I)
Hard Processor System Dual-core ARM Cortex-A9 MPCore Dual-core ARM Cortex-A9 MPCore Dual-core ARM Cortex-A9 MPCore Dual-core ARM Cortex-A9 MPCore Dual-core ARM Cortex-A9 MPCore Dual-core ARM Cortex-A9 MPCore Dual-core ARM Cortex-A9 MPCore
Process Technology 20 nm 20 nm 20 nm 20 nm 20 nm 20 nm 20 nm
Pin/Ball Count 1152 1152 1152 1152 1152 1152 1152

Key Differentiators

  • 570K LE density in the F34 FCBGA package (vs 10AS048H2F34E1HG)
  • H2 speed grade for higher Fmax (vs 10AS057H1F34E1HG)
  • SoC integration reduces BOM and inter-chip latency (vs FPGA plus external ARM host processor)

Design Notes

The 1152-ball FCBGA (F34) package on the 10AS057H2F34E1HG requires a high-density interconnect (HDI) PCB stack-up with microvia and stacked-via technology. Plan for at least 4-6 routing layers for signal breakout plus dedicated power and ground planes. Use the official F34 package pinout and the Arria 10 device handbook's pin connection guidelines to assign signal-integrity-critical nets (transceivers, DDR, clock) before routing. For BGA fanout, use 0.4-0.5 mm pitch escape routing with via-in-pad if board density demands it.

Estimated: at full logic utilization with the HPS active and transceiver channels running, the 10AS057H2F34E1HG can dissipate 8-15 W. The F34 FCBGA exposes a thermal pad that must be soldered to a copper pour with a thermal-via array under the package. For continuous full-load operation, attach a heatspreader or low-profile heatsink; in enclosed chassis, derate ambient temperature by 10-15 C or use forced airflow. Reference the Arria 10 device handbook thermal management section for junction-to-ambient thermal resistance curves.

Do not assume all Arria 10 SX F34 package devices are interchangeable without checking the speed grade and transceiver compliance suffix. The H1, H2, and H3 speed grades have different Fmax and transceiver rate specifications; substituting a slower speed grade can break design timing closure. Also verify that your board design includes the correct configuration flash (EPCQ-L) and that the HPS boot pins (BSEL, CSEL) match your boot source. Use the Quartus Prime Pin Planner and the Arria 10 SoC boot user guide to validate the configuration scheme before tape-out.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance and lead-free status confirmed via Intel/Altera product page. AEC-Q100 is not applicable - this is an industrial/aerospace SoC FPGA, not an automotive-grade part. Halogen-free and conflict-mineral declarations should be requested from Intel directly via the product compliance letter.

Data verified on: 2026-09-05 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera 10AS057H2F34E1HG Arria 10 SX Arria 10 SoC FPGA FPGA ARM Cortex-A9 MPCore CoreSight FCBGA F34 package 20 nm process TSMC logic element DSP block transceiver multi-port SDRAM controller Quartus Prime JEDEC J-STD-020 RoHS REACH AEC-Q100
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