10AS057H2F34E1HG - Arria 10 SX SoC FPGA 570K LE | Intel | FCBGA-1152
MPN: 10AS057H2F34E1HG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3450.08 | $3,450.08 |
| 10 | $3325.5 | $33,255.00 |
| 25 | $3210 | $80,250.00 |
| 100 | $3050 | $305,000.00 |
Drop-in alternatives for 10AS057H2F34E1HG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS057H1F34E1HG
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View Datasheet →10AS057H2F34E1HG Maximum Ratings & Electrical Characteristics
| Series | Arria 10 SX |
| Device Type | SoC FPGA (FPGA + Hard ARM Cortex-A9 MPCore) |
| Logic Elements | 570K |
| Processor Cores | Dual-core ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm TSMC |
| Package | 1152-ball FCBGA (F34), 35x35 mm |
| Speed Grade | H2 |
| Package Code | F34 |
| Mounting Type | Surface Mount (BGA) |
| User I/O Count | 492 (per datasheet) |
| RoHS Status | Compliant |
| MSL Level | 3 (per JEDEC J-STD-020, reflow 260C) |
| Hard Memory Controller | Multi-port SDRAM controller (hardened) |
| FPGA Fabric Family | Arria 10 (20 nm) |
10AS057H2F34E1HG f34 Pin Configuration Guide
Complete pinout information for 10AS057H2F34E1HG (f34 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H2F34E1HG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H2F34E1HG is suitable for 6 applications: High-Bandwidth Communications Infrastructure, Industrial Motor Control and Robotics, Military and Aerospace Signal Processing, Medical Imaging Systems, ASIC Prototyping and Emulation, Broadcast Video Processing.
High-Bandwidth Communications Infrastructure
The 10AS057H2F34E1HG is well suited to communications infrastructure such as 100G/400G line cards, OTN framer/mapper designs, and CPRI front-haul processing. The Arria 10 SX device's hardened dual-core ARM Cortex-A9 subsystem handles control-plane protocols (NETCONF, gRPC, SNMP), while the 570K LE fabric implements high-speed data-path functions, packet classification, and traffic shaping. The H2 speed grade delivers the timing margin required for 25.8 Gbps transceiver operation. Integrated multi-port SDRAM controllers with ECC support simplify DDR4/DDR3 buffering of packets and statistics, eliminating external memory controller chips and reducing board complexity. Designers can run a Linux OS on the HPS while offloading hot-path work to FPGA accelerators via the AXI/CCIX coherent interconnect, achieving line-rate throughput without sacrificing control-plane flexibility.
Recommended
Industrial Motor Control and Robotics
The 10AS057H2F34E1HG suits multi-axis industrial motor drives and collaborative robotics controllers that demand deterministic real-time response. The FPGA fabric implements multi-axis field-oriented control (FOC) loops, current sensing signal conditioning, and high-resolution PWM generation at switching frequencies up to 100 kHz. The hard ARM Cortex-A9 cores run EtherCAT, PROFINET, or EtherNet/IP master stacks and the LinuxCNC/RT-Linux real-time kernel for trajectory planning. With 570K logic elements the device supports 6-8 axes of high-performance FOC plus integrated functional safety logic (STO, SBC, SLS) using the Arria 10's SEU-aware logic and lockstep-capable HPS. The 1152-ball FCBGA exposes 492 user I/Os, providing ample LVDS, GPIO, and high-speed interfaces for encoder feedback, resolver excitation, and isolated communications. Designers should provision robust thermal management via thermal vias and a heatspreader for continuous full-load motor drive operation.
Recommended
Military and Aerospace Signal Processing
The 10AS057H2F34E1HG fits defense and aerospace signal-processing platforms including radar front-end preprocessing, electronic warfare (EW) sub-systems, and secure communications modems. Its 570K LE fabric implements wide-bandwidth digital down-conversion, pulse compression, adaptive beamforming, and FFT-based spectrum analysis at sample rates exceeding 1 GSPS using the hardened DSP blocks. The integrated ARM Cortex-A9 cores run a secure Linux or VxWorks instance handling crypto offload and protocol stack management. Extended temperature grade variants of the F34 package support avionics and ground-vehicle environments. Designers should pair the device with radiation-tolerant external memory (DDR3L with ECC) and follow the Arria 10 device handbook's SEU-mitigation recommendations, including TMR scrubbing and watchdog schemes. The high unit price reflects the die's mixed signal integrity, hardened IP blocks, and extended qualification flow required by defense programs.
Recommended
Medical Imaging Systems
The 10AS057H2F34E1HG is deployed in high-end medical imaging modalities including ultrasound beamformers, CT reconstruction pipelines, and MRI RF receivers. The FPGA fabric performs real-time beam steering, channel summation, and back-end image reconstruction (filtered back-projection or iterative methods) at the throughput required for clinical imaging frame rates. The hard ARM Cortex-A9 cores run the user interface, DICOM stack, and post-processing algorithms on Linux. The 570K LE density supports 64-128 channel ultrasound systems or single-slice CT reconstruction at full rate. Multi-port SDRAM controllers with ECC protect patient-data integrity during real-time processing. The integrated SoC architecture reduces the bill of materials compared to FPGA-plus-external-CPU designs, which is critical for medical device cost targets and IEC 60601-1 compliance verification. Confirm extended-grade qualification for clinical deployment.
Recommended
ASIC Prototyping and Emulation
The 10AS057H2F34E1HG is widely used as a building block in ASIC and SoC prototyping because the Arria 10 family offers multi-vendor FPGA-based prototyping flows. Engineers map large ASIC partitions onto the 570K LE fabric, partitioning clocks and debug instrumentation to validate RTL at near-ASIC speeds before tape-out. The integrated ARM Cortex-A9 hard cores also enable prototype verification of heterogeneous SoCs that mix custom logic with ARM-based subsystems. The 1152-ball F34 package exposes the high I/O count needed for daughter-card interconnect and speed-bridge adapters to other FPGAs in multi-FPGA prototyping racks. Designers should plan for the Quartus Prime Pro design flow, time-budget partitioning, and remote-update via the HPS to iterate quickly on prototyping bring-up. The same device doubles as a low-volume production platform when the target ASIC is delayed.
Recommended
Broadcast Video Processing
The 10AS057H2F34E1HG serves broadcast video infrastructure including contribution encoders, IP gateways (SMPTE ST 2110), and playout servers where real-time video processing meets streaming and control workloads. The FPGA fabric implements UHD HDR/SDR conversion, frame-rate conversion, motion-compensated deinterlacing, and ST 2110 packetization/encapsulation at multi-Gbps data rates. The hard ARM Cortex-A9 cores run a Linux control plane with SMPTE NMOS IS-04/IS-05 for device discovery and connection management. The multi-port SDRAM controller with ECC supports line buffers for full-bandwidth UHD processing. The Arria 10 SX SoC integration eliminates the external processor that legacy broadcast designs required, reducing BOM and synchronization complexity. Designers should follow the Arria 10 transceiver guidelines for 12G-SDI and 25G Ethernet PHY integration.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H2F34E1HG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H1F34E1HG | 10AS057H1F34I1HG | 10AS048H2F34E1HG | 10AS032H2F34I1HG | 10AS048H2F34E2SG | 10AS048H1F34I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FCBGA (F34) | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same | 1152-ball FCBGA (F34) - same |
| Logic Elements | 570K | 570K | 570K | 480K (-16%) | 320K (-44%) | 480K (-16%) | 480K (-16%) |
| Speed Grade | H2 | H1 (lower performance) | H1 (lower performance) | H2 (same) | H2 (same) | H2 (same) | H1 (lower performance) |
| Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) | Extended (E) | Industrial (I) |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore | Dual-core ARM Cortex-A9 MPCore |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Pin/Ball Count | 1152 | 1152 | 1152 | 1152 | 1152 | 1152 | 1152 |
Key Differentiators
- 570K LE density in the F34 FCBGA package (vs 10AS048H2F34E1HG)
- H2 speed grade for higher Fmax (vs 10AS057H1F34E1HG)
- SoC integration reduces BOM and inter-chip latency (vs FPGA plus external ARM host processor)
Design Notes
The 1152-ball FCBGA (F34) package on the 10AS057H2F34E1HG requires a high-density interconnect (HDI) PCB stack-up with microvia and stacked-via technology. Plan for at least 4-6 routing layers for signal breakout plus dedicated power and ground planes. Use the official F34 package pinout and the Arria 10 device handbook's pin connection guidelines to assign signal-integrity-critical nets (transceivers, DDR, clock) before routing. For BGA fanout, use 0.4-0.5 mm pitch escape routing with via-in-pad if board density demands it.
Estimated: at full logic utilization with the HPS active and transceiver channels running, the 10AS057H2F34E1HG can dissipate 8-15 W. The F34 FCBGA exposes a thermal pad that must be soldered to a copper pour with a thermal-via array under the package. For continuous full-load operation, attach a heatspreader or low-profile heatsink; in enclosed chassis, derate ambient temperature by 10-15 C or use forced airflow. Reference the Arria 10 device handbook thermal management section for junction-to-ambient thermal resistance curves.
Do not assume all Arria 10 SX F34 package devices are interchangeable without checking the speed grade and transceiver compliance suffix. The H1, H2, and H3 speed grades have different Fmax and transceiver rate specifications; substituting a slower speed grade can break design timing closure. Also verify that your board design includes the correct configuration flash (EPCQ-L) and that the HPS boot pins (BSEL, CSEL) match your boot source. Use the Quartus Prime Pin Planner and the Arria 10 SoC boot user guide to validate the configuration scheme before tape-out.
Compliance Information
RoHS compliance and lead-free status confirmed via Intel/Altera product page. AEC-Q100 is not applicable - this is an industrial/aerospace SoC FPGA, not an automotive-grade part. Halogen-free and conflict-mineral declarations should be requested from Intel directly via the product compliance letter.