A3P600-1FGG144 - 600K Gate ProASIC3 FPGA | Microchip
Référence : A3P600-1FGG144 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $65.97 | $65,97 |
| 10 | $59.37 | $593,70 |
| 100 | $52.78 | $5 278,00 |
| 500 | $47.5 | $23 750,00 |
| 1 000 | $42.88 | $42 880,00 |
A3P600-1FGG144 Présentation
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing, using hardware description languages like VHDL or Verilog. FPGAs sit between fixed-function ASICs and general-purpose processors, offering reconfigurable logic, parallel processing, and deterministic timing. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash cells, providing instant-on operation, low power, and security without external boot memory.
Key features of the A3P600-1FGG144 include 110,592 bits of embedded RAM, 97 I/O pins with support for multiple I/O standards, and four I/O banks with dedicated VCCIBx supplies. The flash-based architecture eliminates the need for configuration PROMs, reduces system cost, and provides design security against cloning. The device also offers low power consumption, with a typical static power of and dynamic power scaling with frequency.
Technically, the A3P600 uses a 130nm flash process, enabling non-volatile configuration that retains the design even when power is removed. The FPGA includes PLLs, clock conditioning circuitry, and up to 1 Mbit of user flash memory (UFM) for data storage. The 144-ball FBGA package measures 13x13mm with a 1.00mm ball pitch, suitable for compact PCB layouts with moderate I/O density.
Typical applications include industrial control, automotive electronics, communications infrastructure, and medical devices where mid-density logic, low power, and secure configuration are required. The 97 I/Os support LVCMOS, LVTTL, PCI, and other standards, enabling direct interface to sensors, ADCs, and communication transceivers.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply. The flash-based architecture allows secure remote updates, but careful attention to I/O bank voltage assignments is required to avoid damage. The device supports in-system programming (ISP) via JTAG, simplifying field updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a complete sourcing and design reference for the A3P600-1FGG144.
Alternatives de remplacement direct pour A3P600-1FGG144 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3P600-1FGG144 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Technology, RoHS Status, Configuration.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3P600-1FGG144I
✅ Remplacement direct✓ En stock
$45 / unité
Voir la fiche technique →A3P600-FGG144
✅ Remplacement direct✓ En stock
$49.8 / unité
Voir la fiche technique →A3P600-FGG144I
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →A3P600L-1FGG144I
✅ Remplacement direct✓ En stock
$59.8 / unité
Voir la fiche technique →A3P600L-FGG144I
✅ Remplacement direct✓ En stock
$33.95 / unité
Voir la fiche technique →A3P600L-FGG144
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3P600-1FGG144 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3 |
| Total Gates | 600,000 |
| Logic Elements (CLBs) | 13,824 |
| Number of I/Os | 97 |
| Embedded RAM | 110,592 bits |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 350 MHz |
| Boîtier | 144-LBGA (FBGA) |
| Package Pitch | 1.00 mm |
| Style de montage | SMD/SMT |
| Plage de température de fonctionnement | 0 C to +70 C |
| Packaging | Tray |
| I/O Banks | 4 |
| Configuration | Flash-based (non-volatile) |
| Statut RoHS | Compliant |
Configuration des broches de A3P600-1FGG144
| Broche A1 | IO — User I/O (Bank 0) |
| Broche A2 | IO — User I/O (Bank 0) |
| Broche A3 | VCCIB0 — I/O supply for Bank 0 |
| Broche A4 | IO — User I/O (Bank 0) |
| Broche A5 | IO — User I/O (Bank 0) |
| Broche A6 | GND — Ground |
| Broche A7 | IO — User I/O (Bank 1) |
| Broche A8 | IO — User I/O (Bank 1) |
| Broche A9 | VCCIB1 — I/O supply for Bank 1 |
| Broche A10 | IO — User I/O (Bank 1) |
| Broche A11 | IO — User I/O (Bank 1) |
| Broche A12 | IO — User I/O (Bank 1) |
| Broche B1 | IO — User I/O (Bank 0) |
| Broche B2 | IO — User I/O (Bank 0) |
| Broche B3 | IO — User I/O (Bank 0) |
| Broche B4 | IO — User I/O (Bank 0) |
| Broche B5 | VCC — Core supply 1.5V |
| Broche B6 | GND — Ground |
| Broche B7 | IO — User I/O (Bank 1) |
| Broche B8 | IO — User I/O (Bank 1) |
| Broche B9 | IO — User I/O (Bank 1) |
| Broche B10 | IO — User I/O (Bank 1) |
| Broche B11 | IO — User I/O (Bank 1) |
| Broche B12 | IO — User I/O (Bank 1) |
| Broche C1 | IO — User I/O (Bank 0) |
| Broche C2 | IO — User I/O (Bank 0) |
| Broche C3 | IO — User I/O (Bank 0) |
| Broche C4 | IO — User I/O (Bank 0) |
| Broche C5 | VCC — Core supply 1.5V |
| Broche C6 | GND — Ground |
| Broche C7 | IO — User I/O (Bank 1) |
| Broche C8 | IO — User I/O (Bank 1) |
| Broche C9 | IO — User I/O (Bank 1) |
| Broche C10 | IO — User I/O (Bank 1) |
| Broche C11 | IO — User I/O (Bank 1) |
| Broche C12 | IO — User I/O (Bank 1) |
| Broche D1 | IO — User I/O (Bank 0) |
| Broche D2 | IO — User I/O (Bank 0) |
| Broche D3 | IO — User I/O (Bank 0) |
| Broche D4 | IO — User I/O (Bank 0) |
| Broche D5 | VCC — Core supply 1.5V |
| Broche D6 | GND — Ground |
| Broche D7 | IO — User I/O (Bank 1) |
| Broche D8 | IO — User I/O (Bank 1) |
| Broche D9 | IO — User I/O (Bank 1) |
| Broche D10 | IO — User I/O (Bank 1) |
| Broche D11 | IO — User I/O (Bank 1) |
| Broche D12 | IO — User I/O (Bank 1) |
| Broche E1 | IO — User I/O (Bank 0) |
| Broche E2 | IO — User I/O (Bank 0) |
| Broche E3 | IO — User I/O (Bank 0) |
| Broche E4 | IO — User I/O (Bank 0) |
| Broche E5 | VCC — Core supply 1.5V |
| Broche E6 | GND — Ground |
| Broche E7 | IO — User I/O (Bank 1) |
| Broche E8 | IO — User I/O (Bank 1) |
| Broche E9 | IO — User I/O (Bank 1) |
| Broche E10 | IO — User I/O (Bank 1) |
| Broche E11 | IO — User I/O (Bank 1) |
| Broche E12 | IO — User I/O (Bank 1) |
| Broche F1 | IO — User I/O (Bank 0) |
| Broche F2 | IO — User I/O (Bank 0) |
| Broche F3 | IO — User I/O (Bank 0) |
| Broche F4 | IO — User I/O (Bank 0) |
| Broche F5 | VCC — Core supply 1.5V |
| Broche F6 | GND — Ground |
| Broche F7 | IO — User I/O (Bank 1) |
| Broche F8 | IO — User I/O (Bank 1) |
| Broche F9 | IO — User I/O (Bank 1) |
| Broche F10 | IO — User I/O (Bank 1) |
| Broche F11 | IO — User I/O (Bank 1) |
| Broche F12 | IO — User I/O (Bank 1) |
| Broche G1 | IO — User I/O (Bank 0) |
| Broche G2 | IO — User I/O (Bank 0) |
| Broche G3 | IO — User I/O (Bank 0) |
| Broche G4 | IO — User I/O (Bank 0) |
| Broche G5 | VCC — Core supply 1.5V |
| Broche G6 | GND — Ground |
| Broche G7 | IO — User I/O (Bank 1) |
| Broche G8 | IO — User I/O (Bank 1) |
| Broche G9 | IO — User I/O (Bank 1) |
| Broche G10 | IO — User I/O (Bank 1) |
| Broche G11 | IO — User I/O (Bank 1) |
| Broche G12 | IO — User I/O (Bank 1) |
| Broche H1 | IO — User I/O (Bank 2) |
| Broche H2 | IO — User I/O (Bank 2) |
| Broche H3 | IO — User I/O (Bank 2) |
| Broche H4 | IO — User I/O (Bank 2) |
| Broche H5 | VCC — Core supply 1.5V |
| Broche H6 | GND — Ground |
| Broche H7 | IO — User I/O (Bank 3) |
| Broche H8 | IO — User I/O (Bank 3) |
| Broche H9 | IO — User I/O (Bank 3) |
| Broche H10 | IO — User I/O (Bank 3) |
| Broche H11 | IO — User I/O (Bank 3) |
| Broche H12 | IO — User I/O (Bank 3) |
| Broche J1 | IO — User I/O (Bank 2) |
| Broche J2 | IO — User I/O (Bank 2) |
| Broche J3 | IO — User I/O (Bank 2) |
| Broche J4 | IO — User I/O (Bank 2) |
| Broche J5 | VCC — Core supply 1.5V |
| Broche J6 | GND — Ground |
| Broche J7 | IO — User I/O (Bank 3) |
| Broche J8 | IO — User I/O (Bank 3) |
| Broche J9 | IO — User I/O (Bank 3) |
| Broche J10 | IO — User I/O (Bank 3) |
| Broche J11 | IO — User I/O (Bank 3) |
| Broche J12 | IO — User I/O (Bank 3) |
| Broche K1 | IO — User I/O (Bank 2) |
| Broche K2 | IO — User I/O (Bank 2) |
| Broche K3 | IO — User I/O (Bank 2) |
| Broche K4 | IO — User I/O (Bank 2) |
| Broche K5 | VCC — Core supply 1.5V |
| Broche K6 | GND — Ground |
| Broche K7 | IO — User I/O (Bank 3) |
| Broche K8 | IO — User I/O (Bank 3) |
| Broche K9 | IO — User I/O (Bank 3) |
| Broche K10 | IO — User I/O (Bank 3) |
| Broche K11 | IO — User I/O (Bank 3) |
| Broche K12 | IO — User I/O (Bank 3) |
| Broche L1 | IO — User I/O (Bank 2) |
| Broche L2 | IO — User I/O (Bank 2) |
| Broche L3 | IO — User I/O (Bank 2) |
| Broche L4 | IO — User I/O (Bank 2) |
| Broche L5 | VCC — Core supply 1.5V |
| Broche L6 | GND — Ground |
| Broche L7 | IO — User I/O (Bank 3) |
| Broche L8 | IO — User I/O (Bank 3) |
| Broche L9 | IO — User I/O (Bank 3) |
| Broche L10 | IO — User I/O (Bank 3) |
| Broche L11 | IO — User I/O (Bank 3) |
| Broche L12 | IO — User I/O (Bank 3) |
| Broche M1 | IO — User I/O (Bank 2) |
| Broche M2 | IO — User I/O (Bank 2) |
| Broche M3 | VCCIB2 — I/O supply for Bank 2 |
| Broche M4 | IO — User I/O (Bank 2) |
| Broche M5 | IO — User I/O (Bank 2) |
| Broche M6 | GND — Ground |
| Broche M7 | IO — User I/O (Bank 3) |
| Broche M8 | IO — User I/O (Bank 3) |
| Broche M9 | VCCIB3 — I/O supply for Bank 3 |
| Broche M10 | IO — User I/O (Bank 3) |
| Broche M11 | IO — User I/O (Bank 3) |
| Broche M12 | IO — User I/O (Bank 3) |
| Broche N1 | IO — User I/O (Bank 2) |
| Broche N2 | IO — User I/O (Bank 2) |
| Broche N3 | IO — User I/O (Bank 2) |
| Broche N4 | IO — User I/O (Bank 2) |
| Broche N5 | IO — User I/O (Bank 2) |
| Broche N6 | GND — Ground |
| Broche N7 | IO — User I/O (Bank 3) |
| Broche N8 | IO — User I/O (Bank 3) |
| Broche N9 | IO — User I/O (Bank 3) |
| Broche N10 | IO — User I/O (Bank 3) |
| Broche N11 | IO — User I/O (Bank 3) |
| Broche N12 | IO — User I/O (Bank 3) |
Applications typiques
A3P600-1FGG144 convient pour 6 applications: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Medical Devices, Aerospace and Defense, IoT and Edge Computing.
Industrial Control Systems
The A3P600-1FGG144 is ideal for industrial control systems requiring mid-density logic integration, such as motor control, PLCs, and factory automation. Its 97 I/Os support direct interface to sensors, encoders, and communication transceivers (RS-485, CAN). The flash-based configuration provides instant-on operation, eliminating boot time in safety-critical applications. With 110,592 bits of embedded RAM, it can buffer data for real-time processing. The 1.5V core supply reduces power consumption in 24/7 industrial environments. The 144-FBGA package fits compact control boards, and the 0C to +70C temperature range suits typical factory floor conditions. The device's security features protect IP from cloning, a key requirement in industrial equipment.
Recommandé
Automotive Electronics
In automotive applications, the A3P600-1FGG144 is used for body control modules, gateway controllers, and infotainment systems. Its 97 I/Os interface with LIN, CAN, and FlexRay transceivers, while the flash-based configuration ensures secure, instant-on operation. The 1.5V core supply and low power consumption are suitable for always-on automotive modules. However, the standard version's 0C to +70C range limits it to cabin applications; for under-hood use, the A3P600-1FGG144I (-40C to +100C) is required. The device's 110,592 bits of RAM support data logging and protocol buffering. The 144-FBGA package withstands automotive vibration when properly soldered. Designers must ensure I/O bank voltages match the connected transceivers.
Recommandé
Communications Infrastructure
The A3P600-1FGG144 excels in communications infrastructure such as small-cell base stations, network switches, and protocol converters. Its 97 I/Os support LVCMOS, LVTTL, and PCI standards, enabling direct connection to PHYs, MACs, and optical modules. The 350 MHz system performance handles high-speed packet processing, while 110,592 bits of RAM buffer data streams. The flash-based configuration allows secure field updates via JTAG, essential for remote network equipment. The 1.5V core supply reduces power in densely populated racks. The 144-FBGA package is ideal for line cards with limited space. Designers should use the PLLs for clock conditioning to meet jitter requirements. The device's low TCO makes it attractive for cost-sensitive infrastructure.
Recommandé
Medical Devices
In medical devices like patient monitors, infusion pumps, and diagnostic equipment, the A3P600-1FGG144 provides reliable, secure logic integration. Its 97 I/Os interface with sensors, ADCs, and display controllers. The flash-based configuration ensures deterministic startup, critical for patient safety. The 1.5V core supply and low power consumption extend battery life in portable devices. The 110,592 bits of RAM support data logging and waveform buffering. The 0C to +70C range suits clinical environments. The device's security features protect firmware from tampering, meeting regulatory requirements. The 144-FBGA package enables compact, lightweight designs. Designers must follow medical EMC guidelines for PCB layout, and the device's low EMI helps pass compliance testing.
Recommandé
Aerospace and Defense
The A3P600-1FGG144 is used in aerospace and defense applications such as avionics, UAVs, and secure communication systems. Its flash-based configuration provides inherent security against reverse engineering, a critical requirement for defense IP. The 97 I/Os support MIL-STD-1553, ARINC 429, and other avionics buses. The 350 MHz performance handles real-time signal processing. The 1.5V core supply reduces power in space-constrained platforms. The 144-FBGA package is radiation-tolerant for low-earth orbit applications (with additional shielding). The device's instant-on capability is essential for safety-critical systems. For extreme environments, the A3P600-1FGG144I (-40C to +100C) is recommended. Designers must use radiation-hardened variants for high-radiation missions.
Recommandé
IoT and Edge Computing
For IoT gateways and edge computing nodes, the A3P600-1FGG144 offers a balance of logic density and low power. Its 97 I/Os connect to various sensors, wireless modules, and local interfaces. The flash-based configuration enables secure over-the-air updates, crucial for IoT security. The 1.5V core supply and low static power extend battery life in remote sensors. The 110,592 bits of RAM buffer data before transmission. The 144-FBGA package fits compact IoT devices. The 0C to +70C range suits indoor gateways; outdoor nodes require the 'I' variant. The device's instant-on capability reduces latency in edge processing. Designers can implement custom protocols in the FPGA fabric, offloading the main processor. The low TCO makes it viable for mass-deployed IoT.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3P600-1FGG144 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3P600-1FGG144I | A3P600-FGG144 | A3P600-FGG144I | A3P600L-1FGG144I | A3P600L-FGG144I | A3P600L-FGG144 |
|---|---|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA) | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Number of I/Os | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature Range | 0 C to +70 C | -40 C to +100 C | 0 C to +70 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +70 C |
| Low-Power Variant | No | No | No | No | Yes | Yes | Yes |
Principaux différenciateurs
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Single-chip solution with low TCO (vs A3P600-1FGG256)
- Wide operating temperature range option (vs A3P600-1FGG144 (standard))
Notes de conception
The A3P600-1FGG144 requires a 1.5V core supply and separate I/O supplies (VCCIBx) for each of the four I/O banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the ball as possible, plus a 10uF bulk capacitor per bank. The core supply should be clean and stable; use a low-dropout regulator or switching regulator with low ripple. Estimated: total power dissipation depends on logic utilization and I/O toggling; for a typical design with 50% logic utilization and 50 MHz clock, power is approximately 0.5W, requiring adequate copper pour for heat dissipation.
The 144-ball FBGA package with 1.00mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with dedicated power and ground planes. Route I/O signals with controlled impedance (50 ohm) for high-speed interfaces. Ensure the thermal pad (if present) is connected to ground with thermal vias for heat dissipation. Follow Microchip's layout guidelines for the ProASIC3 family, which recommend placing decoupling capacitors on the bottom side directly under the FPGA. Avoid routing high-speed signals near the JTAG pins to prevent noise coupling.
A common mistake is assigning I/Os with incompatible voltage standards to the same bank. Each bank has a dedicated VCCIBx supply, so all I/Os in a bank must use the same voltage level. For example, if Bank 0 is set to 3.3V, all I/Os in Bank 0 must be 3.3V-compatible. Mixing 2.5V and 3.3V I/Os in the same bank will damage the device. Also, ensure the core supply (1.5V) is within the specified tolerance (typically +/-5%). The flash-based configuration is non-volatile, but in-system programming via JTAG requires proper pull-up resistors on TMS and TDI.
Informations de conformité
RoHS compliant per distributor listings. AEC-Q100 not applicable for this commercial-grade FPGA. REACH and conflict minerals status not specified in the provided data.
