A3P600-1FGG144 - 600K Gate ProASIC3 FPGA | Microchip
Teilenummer: A3P600-1FGG144 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $65.97 | $65,97 |
| 10 | $59.37 | $593,70 |
| 100 | $52.78 | $5.278,00 |
| 500 | $47.5 | $23.750,00 |
| 1.000 | $42.88 | $42.880,00 |
A3P600-1FGG144 Übersicht
A Field Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer after manufacturing, using hardware description languages like VHDL or Verilog. FPGAs sit between fixed-function ASICs and general-purpose processors, offering reconfigurable logic, parallel processing, and deterministic timing. The ProASIC3 family is a flash-based FPGA, meaning configuration is stored in non-volatile flash cells, providing instant-on operation, low power, and security without external boot memory.
Key features of the A3P600-1FGG144 include 110,592 bits of embedded RAM, 97 I/O pins with support for multiple I/O standards, and four I/O banks with dedicated VCCIBx supplies. The flash-based architecture eliminates the need for configuration PROMs, reduces system cost, and provides design security against cloning. The device also offers low power consumption, with a typical static power of and dynamic power scaling with frequency.
Technically, the A3P600 uses a 130nm flash process, enabling non-volatile configuration that retains the design even when power is removed. The FPGA includes PLLs, clock conditioning circuitry, and up to 1 Mbit of user flash memory (UFM) for data storage. The 144-ball FBGA package measures 13x13mm with a 1.00mm ball pitch, suitable for compact PCB layouts with moderate I/O density.
Typical applications include industrial control, automotive electronics, communications infrastructure, and medical devices where mid-density logic, low power, and secure configuration are required. The 97 I/Os support LVCMOS, LVTTL, PCI, and other standards, enabling direct interface to sensors, ADCs, and communication transceivers.
When designing with this device, ensure proper decoupling of the 1.5V core supply and each VCCIBx bank supply. The flash-based architecture allows secure remote updates, but careful attention to I/O bank voltage assignments is required to avoid damage. The device supports in-system programming (ISP) via JTAG, simplifying field updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a complete sourcing and design reference for the A3P600-1FGG144.
Drop-in-Alternativen für A3P600-1FGG144 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit A3P600-1FGG144 (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Technology, RoHS Status, Configuration.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
A3P600-1FGG144I
✅ Drop-In✓ Auf Lager
$45 / Stück
Datenblatt ansehen →A3P600-FGG144
✅ Drop-In✓ Auf Lager
$49.8 / Stück
Datenblatt ansehen →A3P600-FGG144I
✅ Drop-In✓ Auf Lager
$27.2 / Stück
Datenblatt ansehen →A3P600L-1FGG144I
✅ Drop-In✓ Auf Lager
$59.8 / Stück
Datenblatt ansehen →A3P600L-FGG144I
✅ Drop-In✓ Auf Lager
$33.95 / Stück
Datenblatt ansehen →A3P600L-FGG144
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →A3P600-1FGG144 Grenzwerte & elektrische Eigenschaften
| Family | ProASIC3 |
| Total Gates | 600,000 |
| Logic Elements (CLBs) | 13,824 |
| Number of I/Os | 97 |
| Embedded RAM | 110,592 bits |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 350 MHz |
| Gehäuse | 144-LBGA (FBGA) |
| Package Pitch | 1.00 mm |
| Montagestil | SMD/SMT |
| Betriebstemperaturbereich | 0 C to +70 C |
| Packaging | Tray |
| I/O Banks | 4 |
| Configuration | Flash-based (non-volatile) |
| RoHS-Status | Compliant |
A3P600-1FGG144 Pin-Konfiguration
| Pin A1 | IO — User I/O (Bank 0) |
| Pin A2 | IO — User I/O (Bank 0) |
| Pin A3 | VCCIB0 — I/O supply for Bank 0 |
| Pin A4 | IO — User I/O (Bank 0) |
| Pin A5 | IO — User I/O (Bank 0) |
| Pin A6 | GND — Ground |
| Pin A7 | IO — User I/O (Bank 1) |
| Pin A8 | IO — User I/O (Bank 1) |
| Pin A9 | VCCIB1 — I/O supply for Bank 1 |
| Pin A10 | IO — User I/O (Bank 1) |
| Pin A11 | IO — User I/O (Bank 1) |
| Pin A12 | IO — User I/O (Bank 1) |
| Pin B1 | IO — User I/O (Bank 0) |
| Pin B2 | IO — User I/O (Bank 0) |
| Pin B3 | IO — User I/O (Bank 0) |
| Pin B4 | IO — User I/O (Bank 0) |
| Pin B5 | VCC — Core supply 1.5V |
| Pin B6 | GND — Ground |
| Pin B7 | IO — User I/O (Bank 1) |
| Pin B8 | IO — User I/O (Bank 1) |
| Pin B9 | IO — User I/O (Bank 1) |
| Pin B10 | IO — User I/O (Bank 1) |
| Pin B11 | IO — User I/O (Bank 1) |
| Pin B12 | IO — User I/O (Bank 1) |
| Pin C1 | IO — User I/O (Bank 0) |
| Pin C2 | IO — User I/O (Bank 0) |
| Pin C3 | IO — User I/O (Bank 0) |
| Pin C4 | IO — User I/O (Bank 0) |
| Pin C5 | VCC — Core supply 1.5V |
| Pin C6 | GND — Ground |
| Pin C7 | IO — User I/O (Bank 1) |
| Pin C8 | IO — User I/O (Bank 1) |
| Pin C9 | IO — User I/O (Bank 1) |
| Pin C10 | IO — User I/O (Bank 1) |
| Pin C11 | IO — User I/O (Bank 1) |
| Pin C12 | IO — User I/O (Bank 1) |
| Pin D1 | IO — User I/O (Bank 0) |
| Pin D2 | IO — User I/O (Bank 0) |
| Pin D3 | IO — User I/O (Bank 0) |
| Pin D4 | IO — User I/O (Bank 0) |
| Pin D5 | VCC — Core supply 1.5V |
| Pin D6 | GND — Ground |
| Pin D7 | IO — User I/O (Bank 1) |
| Pin D8 | IO — User I/O (Bank 1) |
| Pin D9 | IO — User I/O (Bank 1) |
| Pin D10 | IO — User I/O (Bank 1) |
| Pin D11 | IO — User I/O (Bank 1) |
| Pin D12 | IO — User I/O (Bank 1) |
| Pin E1 | IO — User I/O (Bank 0) |
| Pin E2 | IO — User I/O (Bank 0) |
| Pin E3 | IO — User I/O (Bank 0) |
| Pin E4 | IO — User I/O (Bank 0) |
| Pin E5 | VCC — Core supply 1.5V |
| Pin E6 | GND — Ground |
| Pin E7 | IO — User I/O (Bank 1) |
| Pin E8 | IO — User I/O (Bank 1) |
| Pin E9 | IO — User I/O (Bank 1) |
| Pin E10 | IO — User I/O (Bank 1) |
| Pin E11 | IO — User I/O (Bank 1) |
| Pin E12 | IO — User I/O (Bank 1) |
| Pin F1 | IO — User I/O (Bank 0) |
| Pin F2 | IO — User I/O (Bank 0) |
| Pin F3 | IO — User I/O (Bank 0) |
| Pin F4 | IO — User I/O (Bank 0) |
| Pin F5 | VCC — Core supply 1.5V |
| Pin F6 | GND — Ground |
| Pin F7 | IO — User I/O (Bank 1) |
| Pin F8 | IO — User I/O (Bank 1) |
| Pin F9 | IO — User I/O (Bank 1) |
| Pin F10 | IO — User I/O (Bank 1) |
| Pin F11 | IO — User I/O (Bank 1) |
| Pin F12 | IO — User I/O (Bank 1) |
| Pin G1 | IO — User I/O (Bank 0) |
| Pin G2 | IO — User I/O (Bank 0) |
| Pin G3 | IO — User I/O (Bank 0) |
| Pin G4 | IO — User I/O (Bank 0) |
| Pin G5 | VCC — Core supply 1.5V |
| Pin G6 | GND — Ground |
| Pin G7 | IO — User I/O (Bank 1) |
| Pin G8 | IO — User I/O (Bank 1) |
| Pin G9 | IO — User I/O (Bank 1) |
| Pin G10 | IO — User I/O (Bank 1) |
| Pin G11 | IO — User I/O (Bank 1) |
| Pin G12 | IO — User I/O (Bank 1) |
| Pin H1 | IO — User I/O (Bank 2) |
| Pin H2 | IO — User I/O (Bank 2) |
| Pin H3 | IO — User I/O (Bank 2) |
| Pin H4 | IO — User I/O (Bank 2) |
| Pin H5 | VCC — Core supply 1.5V |
| Pin H6 | GND — Ground |
| Pin H7 | IO — User I/O (Bank 3) |
| Pin H8 | IO — User I/O (Bank 3) |
| Pin H9 | IO — User I/O (Bank 3) |
| Pin H10 | IO — User I/O (Bank 3) |
| Pin H11 | IO — User I/O (Bank 3) |
| Pin H12 | IO — User I/O (Bank 3) |
| Pin J1 | IO — User I/O (Bank 2) |
| Pin J2 | IO — User I/O (Bank 2) |
| Pin J3 | IO — User I/O (Bank 2) |
| Pin J4 | IO — User I/O (Bank 2) |
| Pin J5 | VCC — Core supply 1.5V |
| Pin J6 | GND — Ground |
| Pin J7 | IO — User I/O (Bank 3) |
| Pin J8 | IO — User I/O (Bank 3) |
| Pin J9 | IO — User I/O (Bank 3) |
| Pin J10 | IO — User I/O (Bank 3) |
| Pin J11 | IO — User I/O (Bank 3) |
| Pin J12 | IO — User I/O (Bank 3) |
| Pin K1 | IO — User I/O (Bank 2) |
| Pin K2 | IO — User I/O (Bank 2) |
| Pin K3 | IO — User I/O (Bank 2) |
| Pin K4 | IO — User I/O (Bank 2) |
| Pin K5 | VCC — Core supply 1.5V |
| Pin K6 | GND — Ground |
| Pin K7 | IO — User I/O (Bank 3) |
| Pin K8 | IO — User I/O (Bank 3) |
| Pin K9 | IO — User I/O (Bank 3) |
| Pin K10 | IO — User I/O (Bank 3) |
| Pin K11 | IO — User I/O (Bank 3) |
| Pin K12 | IO — User I/O (Bank 3) |
| Pin L1 | IO — User I/O (Bank 2) |
| Pin L2 | IO — User I/O (Bank 2) |
| Pin L3 | IO — User I/O (Bank 2) |
| Pin L4 | IO — User I/O (Bank 2) |
| Pin L5 | VCC — Core supply 1.5V |
| Pin L6 | GND — Ground |
| Pin L7 | IO — User I/O (Bank 3) |
| Pin L8 | IO — User I/O (Bank 3) |
| Pin L9 | IO — User I/O (Bank 3) |
| Pin L10 | IO — User I/O (Bank 3) |
| Pin L11 | IO — User I/O (Bank 3) |
| Pin L12 | IO — User I/O (Bank 3) |
| Pin M1 | IO — User I/O (Bank 2) |
| Pin M2 | IO — User I/O (Bank 2) |
| Pin M3 | VCCIB2 — I/O supply for Bank 2 |
| Pin M4 | IO — User I/O (Bank 2) |
| Pin M5 | IO — User I/O (Bank 2) |
| Pin M6 | GND — Ground |
| Pin M7 | IO — User I/O (Bank 3) |
| Pin M8 | IO — User I/O (Bank 3) |
| Pin M9 | VCCIB3 — I/O supply for Bank 3 |
| Pin M10 | IO — User I/O (Bank 3) |
| Pin M11 | IO — User I/O (Bank 3) |
| Pin M12 | IO — User I/O (Bank 3) |
| Pin N1 | IO — User I/O (Bank 2) |
| Pin N2 | IO — User I/O (Bank 2) |
| Pin N3 | IO — User I/O (Bank 2) |
| Pin N4 | IO — User I/O (Bank 2) |
| Pin N5 | IO — User I/O (Bank 2) |
| Pin N6 | GND — Ground |
| Pin N7 | IO — User I/O (Bank 3) |
| Pin N8 | IO — User I/O (Bank 3) |
| Pin N9 | IO — User I/O (Bank 3) |
| Pin N10 | IO — User I/O (Bank 3) |
| Pin N11 | IO — User I/O (Bank 3) |
| Pin N12 | IO — User I/O (Bank 3) |
Typische Anwendungen
A3P600-1FGG144 ist geeignet für 6 Anwendungs: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Medical Devices, Aerospace and Defense, IoT and Edge Computing.
Industrial Control Systems
The A3P600-1FGG144 is ideal for industrial control systems requiring mid-density logic integration, such as motor control, PLCs, and factory automation. Its 97 I/Os support direct interface to sensors, encoders, and communication transceivers (RS-485, CAN). The flash-based configuration provides instant-on operation, eliminating boot time in safety-critical applications. With 110,592 bits of embedded RAM, it can buffer data for real-time processing. The 1.5V core supply reduces power consumption in 24/7 industrial environments. The 144-FBGA package fits compact control boards, and the 0C to +70C temperature range suits typical factory floor conditions. The device's security features protect IP from cloning, a key requirement in industrial equipment.
Empfohlen
Automotive Electronics
In automotive applications, the A3P600-1FGG144 is used for body control modules, gateway controllers, and infotainment systems. Its 97 I/Os interface with LIN, CAN, and FlexRay transceivers, while the flash-based configuration ensures secure, instant-on operation. The 1.5V core supply and low power consumption are suitable for always-on automotive modules. However, the standard version's 0C to +70C range limits it to cabin applications; for under-hood use, the A3P600-1FGG144I (-40C to +100C) is required. The device's 110,592 bits of RAM support data logging and protocol buffering. The 144-FBGA package withstands automotive vibration when properly soldered. Designers must ensure I/O bank voltages match the connected transceivers.
Empfohlen
Communications Infrastructure
The A3P600-1FGG144 excels in communications infrastructure such as small-cell base stations, network switches, and protocol converters. Its 97 I/Os support LVCMOS, LVTTL, and PCI standards, enabling direct connection to PHYs, MACs, and optical modules. The 350 MHz system performance handles high-speed packet processing, while 110,592 bits of RAM buffer data streams. The flash-based configuration allows secure field updates via JTAG, essential for remote network equipment. The 1.5V core supply reduces power in densely populated racks. The 144-FBGA package is ideal for line cards with limited space. Designers should use the PLLs for clock conditioning to meet jitter requirements. The device's low TCO makes it attractive for cost-sensitive infrastructure.
Empfohlen
Medical Devices
In medical devices like patient monitors, infusion pumps, and diagnostic equipment, the A3P600-1FGG144 provides reliable, secure logic integration. Its 97 I/Os interface with sensors, ADCs, and display controllers. The flash-based configuration ensures deterministic startup, critical for patient safety. The 1.5V core supply and low power consumption extend battery life in portable devices. The 110,592 bits of RAM support data logging and waveform buffering. The 0C to +70C range suits clinical environments. The device's security features protect firmware from tampering, meeting regulatory requirements. The 144-FBGA package enables compact, lightweight designs. Designers must follow medical EMC guidelines for PCB layout, and the device's low EMI helps pass compliance testing.
Empfohlen
Aerospace and Defense
The A3P600-1FGG144 is used in aerospace and defense applications such as avionics, UAVs, and secure communication systems. Its flash-based configuration provides inherent security against reverse engineering, a critical requirement for defense IP. The 97 I/Os support MIL-STD-1553, ARINC 429, and other avionics buses. The 350 MHz performance handles real-time signal processing. The 1.5V core supply reduces power in space-constrained platforms. The 144-FBGA package is radiation-tolerant for low-earth orbit applications (with additional shielding). The device's instant-on capability is essential for safety-critical systems. For extreme environments, the A3P600-1FGG144I (-40C to +100C) is recommended. Designers must use radiation-hardened variants for high-radiation missions.
Empfohlen
IoT and Edge Computing
For IoT gateways and edge computing nodes, the A3P600-1FGG144 offers a balance of logic density and low power. Its 97 I/Os connect to various sensors, wireless modules, and local interfaces. The flash-based configuration enables secure over-the-air updates, crucial for IoT security. The 1.5V core supply and low static power extend battery life in remote sensors. The 110,592 bits of RAM buffer data before transmission. The 144-FBGA package fits compact IoT devices. The 0C to +70C range suits indoor gateways; outdoor nodes require the 'I' variant. The device's instant-on capability reduces latency in edge processing. Designers can implement custom protocols in the FPGA fabric, offloading the main processor. The low TCO makes it viable for mass-deployed IoT.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für A3P600-1FGG144 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | A3P600-1FGG144I | A3P600-FGG144 | A3P600-FGG144I | A3P600L-1FGG144I | A3P600L-FGG144I | A3P600L-FGG144 |
|---|---|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA) | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Number of I/Os | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature Range | 0 C to +70 C | -40 C to +100 C | 0 C to +70 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +70 C |
| Low-Power Variant | No | No | No | No | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Flash-based non-volatile configuration (vs. SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Single-chip solution with low TCO (vs. A3P600-1FGG256)
- Wide operating temperature range option (vs. A3P600-1FGG144 (standard))
Designhinweise
The A3P600-1FGG144 requires a 1.5V core supply and separate I/O supplies (VCCIBx) for each of the four I/O banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the ball as possible, plus a 10uF bulk capacitor per bank. The core supply should be clean and stable; use a low-dropout regulator or switching regulator with low ripple. Estimated: total power dissipation depends on logic utilization and I/O toggling; for a typical design with 50% logic utilization and 50 MHz clock, power is approximately 0.5W, requiring adequate copper pour for heat dissipation.
The 144-ball FBGA package with 1.00mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with dedicated power and ground planes. Route I/O signals with controlled impedance (50 ohm) for high-speed interfaces. Ensure the thermal pad (if present) is connected to ground with thermal vias for heat dissipation. Follow Microchip's layout guidelines for the ProASIC3 family, which recommend placing decoupling capacitors on the bottom side directly under the FPGA. Avoid routing high-speed signals near the JTAG pins to prevent noise coupling.
A common mistake is assigning I/Os with incompatible voltage standards to the same bank. Each bank has a dedicated VCCIBx supply, so all I/Os in a bank must use the same voltage level. For example, if Bank 0 is set to 3.3V, all I/Os in Bank 0 must be 3.3V-compatible. Mixing 2.5V and 3.3V I/Os in the same bank will damage the device. Also, ensure the core supply (1.5V) is within the specified tolerance (typically +/-5%). The flash-based configuration is non-volatile, but in-system programming via JTAG requires proper pull-up resistors on TMS and TDI.
Compliance-Informationen
RoHS compliant per distributor listings. AEC-Q100 not applicable for this commercial-grade FPGA. REACH and conflict minerals status not specified in the provided data.
