A3P600-1FGG144 - 600K Gate ProASIC3 FPGA | Microchip
MPN: A3P600-1FGG144 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $65.97 | $65.97 |
| 10 | $59.37 | $593.70 |
| 100 | $52.78 | $5,278.00 |
| 500 | $47.5 | $23,750.00 |
| 1,000 | $42.88 | $42,880.00 |
Drop-in alternatives for A3P600-1FGG144 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3P600-1FGG144I
β Drop-Inβ In Stock
$45 / Unit
View Datasheet βA3P600-FGG144
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$49.8 / Unit
View Datasheet βA3P600-FGG144I
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$27.2 / Unit
View Datasheet βA3P600L-1FGG144I
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$59.8 / Unit
View Datasheet βA3P600L-FGG144I
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$33.95 / Unit
View Datasheet βA3P600L-FGG144
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View Datasheet βA3P600-1FGG144 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| Total Gates | 600,000 |
| Logic Elements (CLBs) | 13,824 |
| Number of I/Os | 97 |
| Embedded RAM | 110,592 bits |
| Core Supply Voltage | 1.5 V |
| Maximum System Performance | 350 MHz |
| Package | 144-LBGA (FBGA) |
| Package Pitch | 1.00 mm |
| Mounting Style | SMD/SMT |
| Operating Temperature Range | 0 C to +70 C |
| Packaging | Tray |
| I/O Banks | 4 |
| Configuration | Flash-based (non-volatile) |
| RoHS Status | Compliant |
A3P600-1FGG144 Pin Configuration
| Pin A1 | IO β User I/O (Bank 0) |
| Pin A2 | IO β User I/O (Bank 0) |
| Pin A3 | VCCIB0 β I/O supply for Bank 0 |
| Pin A4 | IO β User I/O (Bank 0) |
| Pin A5 | IO β User I/O (Bank 0) |
| Pin A6 | GND β Ground |
| Pin A7 | IO β User I/O (Bank 1) |
| Pin A8 | IO β User I/O (Bank 1) |
| Pin A9 | VCCIB1 β I/O supply for Bank 1 |
| Pin A10 | IO β User I/O (Bank 1) |
| Pin A11 | IO β User I/O (Bank 1) |
| Pin A12 | IO β User I/O (Bank 1) |
| Pin B1 | IO β User I/O (Bank 0) |
| Pin B2 | IO β User I/O (Bank 0) |
| Pin B3 | IO β User I/O (Bank 0) |
| Pin B4 | IO β User I/O (Bank 0) |
| Pin B5 | VCC β Core supply 1.5V |
| Pin B6 | GND β Ground |
| Pin B7 | IO β User I/O (Bank 1) |
| Pin B8 | IO β User I/O (Bank 1) |
| Pin B9 | IO β User I/O (Bank 1) |
| Pin B10 | IO β User I/O (Bank 1) |
| Pin B11 | IO β User I/O (Bank 1) |
| Pin B12 | IO β User I/O (Bank 1) |
| Pin C1 | IO β User I/O (Bank 0) |
| Pin C2 | IO β User I/O (Bank 0) |
| Pin C3 | IO β User I/O (Bank 0) |
| Pin C4 | IO β User I/O (Bank 0) |
| Pin C5 | VCC β Core supply 1.5V |
| Pin C6 | GND β Ground |
| Pin C7 | IO β User I/O (Bank 1) |
| Pin C8 | IO β User I/O (Bank 1) |
| Pin C9 | IO β User I/O (Bank 1) |
| Pin C10 | IO β User I/O (Bank 1) |
| Pin C11 | IO β User I/O (Bank 1) |
| Pin C12 | IO β User I/O (Bank 1) |
| Pin D1 | IO β User I/O (Bank 0) |
| Pin D2 | IO β User I/O (Bank 0) |
| Pin D3 | IO β User I/O (Bank 0) |
| Pin D4 | IO β User I/O (Bank 0) |
| Pin D5 | VCC β Core supply 1.5V |
| Pin D6 | GND β Ground |
| Pin D7 | IO β User I/O (Bank 1) |
| Pin D8 | IO β User I/O (Bank 1) |
| Pin D9 | IO β User I/O (Bank 1) |
| Pin D10 | IO β User I/O (Bank 1) |
| Pin D11 | IO β User I/O (Bank 1) |
| Pin D12 | IO β User I/O (Bank 1) |
| Pin E1 | IO β User I/O (Bank 0) |
| Pin E2 | IO β User I/O (Bank 0) |
| Pin E3 | IO β User I/O (Bank 0) |
| Pin E4 | IO β User I/O (Bank 0) |
| Pin E5 | VCC β Core supply 1.5V |
| Pin E6 | GND β Ground |
| Pin E7 | IO β User I/O (Bank 1) |
| Pin E8 | IO β User I/O (Bank 1) |
| Pin E9 | IO β User I/O (Bank 1) |
| Pin E10 | IO β User I/O (Bank 1) |
| Pin E11 | IO β User I/O (Bank 1) |
| Pin E12 | IO β User I/O (Bank 1) |
| Pin F1 | IO β User I/O (Bank 0) |
| Pin F2 | IO β User I/O (Bank 0) |
| Pin F3 | IO β User I/O (Bank 0) |
| Pin F4 | IO β User I/O (Bank 0) |
| Pin F5 | VCC β Core supply 1.5V |
| Pin F6 | GND β Ground |
| Pin F7 | IO β User I/O (Bank 1) |
| Pin F8 | IO β User I/O (Bank 1) |
| Pin F9 | IO β User I/O (Bank 1) |
| Pin F10 | IO β User I/O (Bank 1) |
| Pin F11 | IO β User I/O (Bank 1) |
| Pin F12 | IO β User I/O (Bank 1) |
| Pin G1 | IO β User I/O (Bank 0) |
| Pin G2 | IO β User I/O (Bank 0) |
| Pin G3 | IO β User I/O (Bank 0) |
| Pin G4 | IO β User I/O (Bank 0) |
| Pin G5 | VCC β Core supply 1.5V |
| Pin G6 | GND β Ground |
| Pin G7 | IO β User I/O (Bank 1) |
| Pin G8 | IO β User I/O (Bank 1) |
| Pin G9 | IO β User I/O (Bank 1) |
| Pin G10 | IO β User I/O (Bank 1) |
| Pin G11 | IO β User I/O (Bank 1) |
| Pin G12 | IO β User I/O (Bank 1) |
| Pin H1 | IO β User I/O (Bank 2) |
| Pin H2 | IO β User I/O (Bank 2) |
| Pin H3 | IO β User I/O (Bank 2) |
| Pin H4 | IO β User I/O (Bank 2) |
| Pin H5 | VCC β Core supply 1.5V |
| Pin H6 | GND β Ground |
| Pin H7 | IO β User I/O (Bank 3) |
| Pin H8 | IO β User I/O (Bank 3) |
| Pin H9 | IO β User I/O (Bank 3) |
| Pin H10 | IO β User I/O (Bank 3) |
| Pin H11 | IO β User I/O (Bank 3) |
| Pin H12 | IO β User I/O (Bank 3) |
| Pin J1 | IO β User I/O (Bank 2) |
| Pin J2 | IO β User I/O (Bank 2) |
| Pin J3 | IO β User I/O (Bank 2) |
| Pin J4 | IO β User I/O (Bank 2) |
| Pin J5 | VCC β Core supply 1.5V |
| Pin J6 | GND β Ground |
| Pin J7 | IO β User I/O (Bank 3) |
| Pin J8 | IO β User I/O (Bank 3) |
| Pin J9 | IO β User I/O (Bank 3) |
| Pin J10 | IO β User I/O (Bank 3) |
| Pin J11 | IO β User I/O (Bank 3) |
| Pin J12 | IO β User I/O (Bank 3) |
| Pin K1 | IO β User I/O (Bank 2) |
| Pin K2 | IO β User I/O (Bank 2) |
| Pin K3 | IO β User I/O (Bank 2) |
| Pin K4 | IO β User I/O (Bank 2) |
| Pin K5 | VCC β Core supply 1.5V |
| Pin K6 | GND β Ground |
| Pin K7 | IO β User I/O (Bank 3) |
| Pin K8 | IO β User I/O (Bank 3) |
| Pin K9 | IO β User I/O (Bank 3) |
| Pin K10 | IO β User I/O (Bank 3) |
| Pin K11 | IO β User I/O (Bank 3) |
| Pin K12 | IO β User I/O (Bank 3) |
| Pin L1 | IO β User I/O (Bank 2) |
| Pin L2 | IO β User I/O (Bank 2) |
| Pin L3 | IO β User I/O (Bank 2) |
| Pin L4 | IO β User I/O (Bank 2) |
| Pin L5 | VCC β Core supply 1.5V |
| Pin L6 | GND β Ground |
| Pin L7 | IO β User I/O (Bank 3) |
| Pin L8 | IO β User I/O (Bank 3) |
| Pin L9 | IO β User I/O (Bank 3) |
| Pin L10 | IO β User I/O (Bank 3) |
| Pin L11 | IO β User I/O (Bank 3) |
| Pin L12 | IO β User I/O (Bank 3) |
| Pin M1 | IO β User I/O (Bank 2) |
| Pin M2 | IO β User I/O (Bank 2) |
| Pin M3 | VCCIB2 β I/O supply for Bank 2 |
| Pin M4 | IO β User I/O (Bank 2) |
| Pin M5 | IO β User I/O (Bank 2) |
| Pin M6 | GND β Ground |
| Pin M7 | IO β User I/O (Bank 3) |
| Pin M8 | IO β User I/O (Bank 3) |
| Pin M9 | VCCIB3 β I/O supply for Bank 3 |
| Pin M10 | IO β User I/O (Bank 3) |
| Pin M11 | IO β User I/O (Bank 3) |
| Pin M12 | IO β User I/O (Bank 3) |
| Pin N1 | IO β User I/O (Bank 2) |
| Pin N2 | IO β User I/O (Bank 2) |
| Pin N3 | IO β User I/O (Bank 2) |
| Pin N4 | IO β User I/O (Bank 2) |
| Pin N5 | IO β User I/O (Bank 2) |
| Pin N6 | GND β Ground |
| Pin N7 | IO β User I/O (Bank 3) |
| Pin N8 | IO β User I/O (Bank 3) |
| Pin N9 | IO β User I/O (Bank 3) |
| Pin N10 | IO β User I/O (Bank 3) |
| Pin N11 | IO β User I/O (Bank 3) |
| Pin N12 | IO β User I/O (Bank 3) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-1FGG144 is suitable for 6 applications: Industrial Control Systems, Automotive Electronics, Communications Infrastructure, Medical Devices, Aerospace and Defense, IoT and Edge Computing.
Industrial Control Systems
The A3P600-1FGG144 is ideal for industrial control systems requiring mid-density logic integration, such as motor control, PLCs, and factory automation. Its 97 I/Os support direct interface to sensors, encoders, and communication transceivers (RS-485, CAN). The flash-based configuration provides instant-on operation, eliminating boot time in safety-critical applications. With 110,592 bits of embedded RAM, it can buffer data for real-time processing. The 1.5V core supply reduces power consumption in 24/7 industrial environments. The 144-FBGA package fits compact control boards, and the 0C to +70C temperature range suits typical factory floor conditions. The device's security features protect IP from cloning, a key requirement in industrial equipment.
Recommended
Automotive Electronics
In automotive applications, the A3P600-1FGG144 is used for body control modules, gateway controllers, and infotainment systems. Its 97 I/Os interface with LIN, CAN, and FlexRay transceivers, while the flash-based configuration ensures secure, instant-on operation. The 1.5V core supply and low power consumption are suitable for always-on automotive modules. However, the standard version's 0C to +70C range limits it to cabin applications; for under-hood use, the A3P600-1FGG144I (-40C to +100C) is required. The device's 110,592 bits of RAM support data logging and protocol buffering. The 144-FBGA package withstands automotive vibration when properly soldered. Designers must ensure I/O bank voltages match the connected transceivers.
Recommended
Communications Infrastructure
The A3P600-1FGG144 excels in communications infrastructure such as small-cell base stations, network switches, and protocol converters. Its 97 I/Os support LVCMOS, LVTTL, and PCI standards, enabling direct connection to PHYs, MACs, and optical modules. The 350 MHz system performance handles high-speed packet processing, while 110,592 bits of RAM buffer data streams. The flash-based configuration allows secure field updates via JTAG, essential for remote network equipment. The 1.5V core supply reduces power in densely populated racks. The 144-FBGA package is ideal for line cards with limited space. Designers should use the PLLs for clock conditioning to meet jitter requirements. The device's low TCO makes it attractive for cost-sensitive infrastructure.
Recommended
Medical Devices
In medical devices like patient monitors, infusion pumps, and diagnostic equipment, the A3P600-1FGG144 provides reliable, secure logic integration. Its 97 I/Os interface with sensors, ADCs, and display controllers. The flash-based configuration ensures deterministic startup, critical for patient safety. The 1.5V core supply and low power consumption extend battery life in portable devices. The 110,592 bits of RAM support data logging and waveform buffering. The 0C to +70C range suits clinical environments. The device's security features protect firmware from tampering, meeting regulatory requirements. The 144-FBGA package enables compact, lightweight designs. Designers must follow medical EMC guidelines for PCB layout, and the device's low EMI helps pass compliance testing.
Recommended
Aerospace and Defense
The A3P600-1FGG144 is used in aerospace and defense applications such as avionics, UAVs, and secure communication systems. Its flash-based configuration provides inherent security against reverse engineering, a critical requirement for defense IP. The 97 I/Os support MIL-STD-1553, ARINC 429, and other avionics buses. The 350 MHz performance handles real-time signal processing. The 1.5V core supply reduces power in space-constrained platforms. The 144-FBGA package is radiation-tolerant for low-earth orbit applications (with additional shielding). The device's instant-on capability is essential for safety-critical systems. For extreme environments, the A3P600-1FGG144I (-40C to +100C) is recommended. Designers must use radiation-hardened variants for high-radiation missions.
Recommended
IoT and Edge Computing
For IoT gateways and edge computing nodes, the A3P600-1FGG144 offers a balance of logic density and low power. Its 97 I/Os connect to various sensors, wireless modules, and local interfaces. The flash-based configuration enables secure over-the-air updates, crucial for IoT security. The 1.5V core supply and low static power extend battery life in remote sensors. The 110,592 bits of RAM buffer data before transmission. The 144-FBGA package fits compact IoT devices. The 0C to +70C range suits indoor gateways; outdoor nodes require the 'I' variant. The device's instant-on capability reduces latency in edge processing. Designers can implement custom protocols in the FPGA fabric, offloading the main processor. The low TCO makes it viable for mass-deployed IoT.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-1FGG144 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-1FGG144I | A3P600-FGG144 | A3P600-FGG144I | A3P600L-1FGG144I | A3P600L-FGG144I | A3P600L-FGG144 |
|---|---|---|---|---|---|---|---|
| Package | 144-LBGA (FBGA) | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same | 144-LBGA (FBGA) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Number of I/Os | 97 | 97 | 97 | 97 | 97 | 97 | 97 |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Maximum System Performance | 350 MHz | 350 MHz | [DATA_NEEDED: max frequency] | [DATA_NEEDED: max frequency] | [DATA_NEEDED: max frequency] | [DATA_NEEDED: max frequency] | [DATA_NEEDED: max frequency] |
| Operating Temperature Range | 0 C to +70 C | -40 C to +100 C | 0 C to +70 C | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | 0 C to +70 C |
| Low-Power Variant | No | No | No | No | Yes | Yes | Yes |
Key Differentiators
- Flash-based non-volatile configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6))
- Single-chip solution with low TCO (vs A3P600-1FGG256)
- Wide operating temperature range option (vs A3P600-1FGG144 (standard))
Design Notes
The A3P600-1FGG144 requires a 1.5V core supply and separate I/O supplies (VCCIBx) for each of the four I/O banks. Decouple each supply pin with a 0.1uF ceramic capacitor placed as close to the ball as possible, plus a 10uF bulk capacitor per bank. The core supply should be clean and stable; use a low-dropout regulator or switching regulator with low ripple. Estimated: total power dissipation depends on logic utilization and I/O toggling; for a typical design with 50% logic utilization and 50 MHz clock, power is approximately 0.5W, requiring adequate copper pour for heat dissipation.
The 144-ball FBGA package with 1.00mm pitch requires careful PCB layout. Use a 4-layer or more stack-up with dedicated power and ground planes. Route I/O signals with controlled impedance (50 ohm) for high-speed interfaces. Ensure the thermal pad (if present) is connected to ground with thermal vias for heat dissipation. Follow Microchip's layout guidelines for the ProASIC3 family, which recommend placing decoupling capacitors on the bottom side directly under the FPGA. Avoid routing high-speed signals near the JTAG pins to prevent noise coupling.
A common mistake is assigning I/Os with incompatible voltage standards to the same bank. Each bank has a dedicated VCCIBx supply, so all I/Os in a bank must use the same voltage level. For example, if Bank 0 is set to 3.3V, all I/Os in Bank 0 must be 3.3V-compatible. Mixing 2.5V and 3.3V I/Os in the same bank will damage the device. Also, ensure the core supply (1.5V) is within the specified tolerance (typically +/-5%). The flash-based configuration is non-volatile, but in-system programming via JTAG requires proper pull-up resistors on TMS and TDI.
Compliance Information
RoHS compliant per distributor listings. AEC-Q100 not applicable for this commercial-grade FPGA. REACH and conflict minerals status not specified in the provided data.
