CY62168EV30LL-45BVXI - 16Mb SRAM 45ns 3V | Infineon
Référence : CY62168EV30LL-45BVXI ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.85 | $5,85 |
| 10 | $5.27 | $52,70 |
| 100 | $4.68 | $468,00 |
| 500 | $4.21 | $2 105,00 |
| 1 000 | $3.75 | $3 750,00 |
CY62168EV30LL-45BVXI Présentation
An asynchronous SRAM is a type of volatile memory that does not require a clock for core read and write operations - the address and chip-enable signals directly control access. SRAM sits in the memory hierarchy above DRAM (no refresh needed) and below CPU registers (larger but slower than on-chip cache). The CY62168EV30LL falls into the low-power SRAM category, which trades absolute speed for ultra-low quiescent current to extend battery life in mobile equipment.
Key features include very high-speed 45 ns access, 2.2 V to 3.6 V wide voltage range, ultra-low standby power with typical standby current of 1.5 µA (maximum 12 µA), and ultra-low active power with typical active current of 2.2 mA at 1 MHz. The device offers easy memory expansion with active-low CE1 and CE2 chip-enable inputs, automatic power-down when deselected, and CMOS-compatible I/O. The 48-VFBGA (6x8) package is optimized for compact surface-mount designs.
The CY62168EV30LL-45BVXI uses a 6-transistor (6T) CMOS SRAM cell architecture with asynchronous address-latch and sense-amplifier circuitry. Its internal organization is 2 M × 8 bits with common I/O data lines and byte-wide access via CE1/CE2 control. The wide voltage range and low-power architecture are achieved through a 0.13 µm low-leakage process and dynamic power management circuits that monitor CE1/CE2 activity.
Typical applications include portable media players, handheld GPS units, cellular phone buffers, PDAs and data-acquisition devices, handheld instruments, battery-powered systems, and cellular phone base-band buffering. It also fits industrial low-power data logging and embedded systems that require non-DRAM memory with deterministic low-latency reads.
When designing with this device, ensure that VCC decoupling (0.1 µF + 1 µF ceramic) is placed within 5 mm of the supply pins. Because it is a BGA package, proper PCB pad design, reflow profile (per JEDEC J-STD-020), and X-ray inspection are mandatory for reliable assembly. Note that the 45 ns speed grade is conservative for moderate-performance buffering; for higher bandwidth consider the CY62168G30 family.
This page synthesizes Infineon/Cypress datasheet specifications, distributor stock and pricing, drop-in and same-package alternatives, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour CY62168EV30LL-45BVXI — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec CY62168EV30LL-45BVXI (même facteur de forme et même empreinte) — différant par Memory Type, Mounting Type, Organization, Package, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
CY62168EV30LL-45BVXI
✅ Remplacement direct✓ En stock
$3.75 / unité
Voir la fiche technique →CY62168G30-45BVXI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY62167EV30LL-45BVXI
✅ Remplacement direct✓ En stock
$3.78 / unité
Voir la fiche technique →MR4A08BMA35
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MR4A08BCMA35
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY62147GE30-45BVXI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
CY62168EV30LL-45BVXI Valeurs maximales et caractéristiques électriques
| Type de mémoire | Volatile SRAM (asynchronous) |
| Memory Family | MoBL (Micropower) SRAM |
| Taille de mémoire | 16 Mbit (2 M × 8) |
| Organisation de la mémoire | 2M × 8 |
| Access Time | 45 ns |
| Operating Voltage Range | 2.20 V to 3.60 V |
| Maximum Operating Voltage | 3.60 V |
| Minimum Operating Voltage | 2.20 V |
| Standby Current (typical) | 1.5 µA |
| Standby Current (maximum) | 12 µA |
| Active Current (typical @ 1 MHz) | 2.2 mA |
| Type d'interface | Parallel (asynchronous) |
| Chip Enable | CE1# (active low), CE2 (active high) |
| Write Enable | WE# (active low) |
| Output Enable | OE# (active low) |
| Boîtier | 48-ball VFBGA (6 x 8) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Statut RoHS | Compliant |
Configuration des broches de CY62168EV30LL-45BVXI
| Broche A1 | A15 — Address input 15 |
| Broche A2 | A14 — Address input 14 |
| Broche A3 | A13 — Address input 13 |
| Broche A4 | A12 — Address input 12 |
| Broche A5 | VSS — Ground |
| Broche A6 | DQ3 — Data I/O 3 |
| Broche B1 | A17 — Address input 17 |
| Broche B2 | A16 — Address input 16 |
| Broche B3 | CE2 — Chip enable 2 (active high) |
| Broche B4 | A11 — Address input 11 |
| Broche B5 | DQ7 — Data I/O 7 |
| Broche B6 | DQ4 — Data I/O 4 |
| Broche C1 | A19 — Address input 19 |
| Broche C2 | A18 — Address input 18 |
| Broche C3 | VCC — Power supply |
| Broche C4 | WE# — Write enable (active low) |
| Broche C5 | OE# — Output enable (active low) |
| Broche C6 | DQ5 — Data I/O 5 |
| Broche D1 | NC — Not connected |
| Broche D2 | A20 — Address input 20 |
| Broche D3 | CE1# — Chip enable 1 (active low) |
| Broche D4 | VSS — Ground |
| Broche D5 | DQ1 — Data I/O 1 |
| Broche D6 | DQ6 — Data I/O 6 |
| Broche E1 | A5 — Address input 5 |
| Broche E2 | A8 — Address input 8 |
| Broche E3 | A9 — Address input 9 |
| Broche E4 | A10 — Address input 10 |
| Broche E5 | DQ0 — Data I/O 0 |
| Broche E6 | DQ2 — Data I/O 2 |
| Broche F1 | A0 — Address input 0 |
| Broche F2 | A1 — Address input 1 |
| Broche F3 | A2 — Address input 2 |
| Broche F4 | A3 — Address input 3 |
| Broche F5 | A4 — Address input 4 |
| Broche F6 | VSS — Ground |
| Broche G1 | VCC — Power supply |
| Broche G2 | A6 — Address input 6 |
| Broche G3 | A7 — Address input 7 |
| Broche G4 | VCC — Power supply |
| Broche G5 | VSS — Ground |
| Broche G6 | NC — Not connected |
| Broche H1 | NC — Not connected |
| Broche H2 | VSS — Ground |
| Broche H3 | NC — Not connected |
| Broche H4 | NC — Not connected |
| Broche H5 | NC — Not connected |
| Broche H6 | NC — Not connected |
Applications typiques
CY62168EV30LL-45BVXI convient pour 6 applications: Portable Media Player Buffer Memory, Handheld GPS Data Buffer, Cellular Phone Baseband Buffer, Industrial Handheld Data Acquisition, PDA Scratchpad Memory, Battery-Powered Embedded Instrument.
Portable Media Player Buffer Memory
The CY62168EV30LL-45BVXI fits portable media player buffer memory with its 16 Mb (2M x 8) byte-wide density and 45 ns access matching typical audio decoder read latency requirements. Its ultra-low 1.5 uA typical standby current extends battery life in pause/idle modes, critical for multi-hour playback. Placed between the system SoC and the audio DAC, the SRAM absorbs data bursts without requiring frequent SoC interrupts. At 2.2-3.6 V operation it interfaces directly to single-cell Li-ion supplies.
Recommandé
Handheld GPS Data Buffer
The CY62168EV30LL-45BVXI's wide 2.20-3.60 V supply range and 1.5 uA standby current make it well suited for handheld GPS data buffering, where NMEA sentence data and satellite ephemeris must be stored between GPS engine wake events. With 45 ns access and 2M x 8 organization, the SRAM provides ample bandwidth for serial-to-parallel buffering. The 48-VFBGA package suits miniaturized GPS PCBs. Its industrial -40 to +85 C operating range covers outdoor handheld use.
Recommandé
Cellular Phone Baseband Buffer
The CY62168EV30LL-45BVXI serves as a baseband signal/voice buffer in cellular phone architectures, where its 2M x 8 organization matches the byte-wide data path between modem DSP and codec. With 45 ns access and 2.2 mA active current at 1 MHz, the SRAM provides deterministic low-latency reads for real-time voice frames. Its 12 uA max standby current is acceptable for idle periods. The wide voltage tolerance allows direct connection to 2.8 V or 3.3 V baseband rails.
Recommandé
Industrial Handheld Data Acquisition
The CY62168EV30LL-45BVXI supports industrial handheld data acquisition with its 16 Mb capacity, sufficient to store thousands of sensor samples between batch uploads. Its industrial -40 to +85 C operating range tolerates factory floor temperature extremes. The asynchronous interface simplifies firmware by eliminating clock-synchronization overhead vs SDRAM. With 2.2-3.6 V supply and 1.5 uA standby, the SRAM enables battery-powered field instruments with multi-shift operation.
Recommandé
PDA Scratchpad Memory
The CY62168EV30LL-45BVXI operates as PDA scratchpad memory where its 2M x 8 organization aligns with legacy PDA bus widths and 45 ns access matches touchscreen refresh timing. With ultra-low 1.5 uA standby, the SRAM preserves battery life in suspend modes where context data must be retained. The 48-VFBGA package fits compact PDA motherboards. Its automatic power-down feature reduces active current during partial-address accesses.
Recommandé
Battery-Powered Embedded Instrument
The CY62168EV30LL-45BVXI is ideal for battery-powered embedded instruments such as portable meters and field diagnostic tools, where its 1.5 uA typical standby current contributes to multi-year battery shelf life. With 16 Mb density and 45 ns access, the SRAM stores calibration tables, measurement history, and user preferences. The 2.2-3.6 V supply range allows direct connection to two alkaline or one Li-ion cell, simplifying power architecture.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour CY62168EV30LL-45BVXI — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | CY62168G30-45BVXI | CY62167EV30LL-45BVXI | MR4A08BMA35 | MR4A08BCMA35 |
|---|---|---|---|---|---|
| Brand | Infineon (Cypress) | Infineon | Infineon | Everspin | Everspin |
| Package | 48-VFBGA (6x8) | 48-VFBGA (6x8) - same | 48-VFBGA (6x8) - same | 48-BGA - same footprint | 48-BGA - same footprint |
| Memory Type | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | MRAM (non-volatile) | MRAM (non-volatile) |
| Density | 16 Mbit (2M x 8) | 16 Mbit | 16 Mbit | 16 Mbit | 16 Mbit |
| Access Time | 45 ns | 45 ns | 45 ns | 35 ns (22% faster) | 35 ns |
| Operating Voltage | 2.20 V to 3.60 V | 2.20 V to 3.60 V | 2.20 V to 3.60 V | 2.70 V to 3.60 V (narrower) | 2.70 V to 3.60 V |
| Standby Current (typical) | 1.5 µA | 1.0 µA | 1.5 µA | Non-volatile (no standby retention current) | Non-volatile |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +105 °C (extended) | 0 °C to +70 °C (commercial) |
Principaux différenciateurs
- Ultra-low 1.5 µA typical standby current (vs Everspin MR4A08BMA35 MRAM)
- Wide 2.2 V to 3.6 V supply range (vs Everspin MR4A08BMA35 MRAM)
- Proven mature MoBL SRAM process with active production (vs Discontinued competitive 16 Mb SRAMs)
Notes de conception
Place 0.1 µF and 1 µF ceramic decoupling capacitors within 5 mm of the VCC and VSS balls, ideally directly under or beside the BGA. Use a 4-layer PCB with continuous ground plane under the BGA to minimize inductance. VFBGA packages require reflow profile per JEDEC J-STD-020 with peak temperature 245 °C for lead-free assembly. X-ray or AOI inspection is mandatory since solder joints are hidden under the package.
Keep address, data, and control traces short and matched where possible. Series-damping resistors (22-33 Ω) on data lines may be needed for busses > 50 MHz equivalent edge rates. CE1#, CE2, OE#, and WE# are asynchronous control inputs - debounce external logic to avoid unintended writes. Avoid floating CE1#/CE2 states during power-up; tie CE2 low or to VCC through 10 kΩ to define state.
Do not exceed 3.60 V absolute maximum on VCC - the MoBL SRAM is not 5 V tolerant. For read cycles, ensure OE# is asserted before or coincident with CE1# falling edge to avoid bus contention. Note that 45 ns is the maximum access time over the full voltage range; at 3.3 V typical access is faster. The automatic power-down feature activates only when both CE1# = high AND CE2 = low - miswiring these disables power saving.
The 48-VFBGA package has good thermal conduction through balls to inner PCB copper planes. For sustained high-frequency read/write workloads, ensure the VCC balls connect to a 2 oz copper pour. The industrial -40 to +85 °C operating range covers most portable applications without derating. At maximum 2.2 mA active current the self-heating is negligible (estimated: 7 mW at 3.3 V).
Informations de conformité
RoHS and lead-free per Infineon/Cypress product page. Not AEC-Q100 qualified (industrial grade only). REACH compliance per Infineon regulatory statements.
