EP1K30TI144-3 - 30K-Gate ACEX 1K FPGA, 144-LQFP | Altera
Référence : EP1K30TI144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2 890,00 |
| 500 | $24.75 | $12 375,00 |
| 1 000 | $21.4 | $21 400,00 |
EP1K30TI144-3 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, interconnect and I/O behavior are defined by user-supplied configuration data rather than fixed mask geometry. Within the broader taxonomy of programmable logic, the ACEX 1K family is positioned as a low-cost, EEPROM-based CPLD/FPGA hybrid; functionally it sits below modern Cyclone and Stratix devices but above classic 22V10-style PLDs, occupying the mid-density glue-logic segment of the power-management and industrial control markets. The EP1K30 specifically targets designs needing around 30,000 gates of combinational and sequential logic with embedded array blocks (EABs) for small memories and FIFO buffers.
Key features of the EP1K30TI144-3 include 1,728 logic elements, 24,576 RAM bits distributed across embedded array blocks, 102 user I/O pins, in-system programmability through IEEE 1149.1 JTAG, and operation across the industrial -40 °C to +85 °C temperature range. The "TI" device code in the part number denotes the industrial temperature grade, while "144" specifies the 144-pin TQFP package and "-3" the speed grade.
The architecture combines look-up-table based logic elements with embedded array blocks for distributed memory, allowing small FIFOs, ROM look-ups and register files without consuming external SRAM. Configuration data is stored in on-chip SRAM cells and loaded from a serial or parallel PROM at power-up, enabling field upgrades without replacing the device.
Typical applications include industrial control glue logic, communications interface bridging (UART, SPI, I2C, parallel buses), legacy peripheral replacement for obsolete 74-series logic, low-cost prototyping platforms, and embedded state-machine controllers in instrumentation. The wide 2.5 V/3.3 V/1.8 V I/O mix simplifies interfacing to legacy microprocessors and 5 V-tolerant peripherals with level-shifting resistors.
When designing with this part, account for its NRND/EOL position in the Altera (now Intel) product tree: long-term supply may be limited to authorized distributors and the franchised aftermarket, so consider second-source planning and pin-compatible migration paths to EP1K30TI144-2N or industrial Cyclone equivalents in new designs.
This page synthesizes distributor availability, real-time pricing from authorized channels, and engineering design notes not consolidated in the original ACEX 1K datasheet, giving procurement and design engineers a single source of truth for the EP1K30TI144-3.
Alternatives de remplacement direct pour EP1K30TI144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K30TI144-3 (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, Series, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K30TI144-2N
✅ Remplacement direct✓ En stock
$25 / unité
Voir la fiche technique →EP1K30TI144-2
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EP1K30TI144-2NGA
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →EP1K30TC144-3N
✅ Remplacement direct✓ En stock
$16.4 / unité
Voir la fiche technique →EP1K30TC144-3
✅ Remplacement direct✓ En stock
$10.8 / unité
Voir la fiche technique →EP1K10TI144-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$16.4 / unité
Voir la fiche technique →EP1K30TI144-3 Valeurs maximales et caractéristiques électriques
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | ACEX 1K |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 |
| Embedded Memory (RAM bits) | 24,576 bits |
| Maximum User I/O | 102 |
| Dedicated Input Pins | 6 |
| Total Package Terminals | 144 |
| Supply Voltage VCCINT | 2.5 V (min 2.375 V, max 2.625 V) |
| I/O Logic Levels | 1.8 V / 2.5 V / 3.3 V (multi-voltage I/O banks) |
| Température de fonctionnement | -40 °C to +85 °C (industrial) |
| Boîtier | 144-pin TQFP (LQFP, 0.5 mm pitch) |
| Speed Grade | -3 |
| Temperature Grade Code | TI (Industrial) |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) / serial/parallel PROM |
| Process Technology | CMOS |
| Type de montage | Surface Mount |
Configuration des broches de EP1K30TI144-3
| Broche 1 | GND — Ground |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | GND — Ground |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | GND — Ground |
| Broche 25 | I/O — User I/O pin (bank 3) |
| Broche 26 | I/O — User I/O pin (bank 3) |
| Broche 27 | I/O — User I/O pin (bank 3) |
| Broche 28 | I/O — User I/O pin (bank 3) |
| Broche 29 | I/O — User I/O pin (bank 3) |
| Broche 30 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 31 | I/O — User I/O pin (bank 3) |
| Broche 32 | I/O — User I/O pin (bank 3) |
| Broche 33 | I/O — User I/O pin (bank 3) |
| Broche 34 | I/O — User I/O pin (bank 3) |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O pin (bank 4) |
| Broche 37 | I/O — User I/O pin (bank 4) |
| Broche 38 | I/O — User I/O pin (bank 4) |
| Broche 39 | I/O — User I/O pin (bank 4) |
| Broche 40 | I/O — User I/O pin (bank 4) |
| Broche 41 | I/O — User I/O pin (bank 4) |
| Broche 42 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 43 | I/O — User I/O pin (bank 4) |
| Broche 44 | I/O — User I/O pin (bank 4) |
| Broche 45 | I/O — User I/O pin (bank 4) |
| Broche 46 | I/O — User I/O pin (bank 4) |
| Broche 47 | GND — Ground |
| Broche 48 | I/O — User I/O pin (bank 5) |
| Broche 49 | I/O — User I/O pin (bank 5) |
| Broche 50 | I/O — User I/O pin (bank 5) |
| Broche 51 | I/O — User I/O pin (bank 5) |
| Broche 52 | I/O — User I/O pin (bank 5) |
| Broche 53 | I/O — User I/O pin (bank 5) |
| Broche 54 | VCCIO5 — I/O bank 5 supply voltage |
| Broche 55 | I/O — User I/O pin (bank 5) |
| Broche 56 | I/O — User I/O pin (bank 5) |
| Broche 57 | I/O — User I/O pin (bank 5) |
| Broche 58 | I/O — User I/O pin (bank 5) |
| Broche 59 | GND — Ground |
| Broche 60 | I/O — User I/O pin (bank 6) |
| Broche 61 | I/O — User I/O pin (bank 6) |
| Broche 62 | I/O — User I/O pin (bank 6) |
| Broche 63 | I/O — User I/O pin (bank 6) |
| Broche 64 | I/O — User I/O pin (bank 6) |
| Broche 65 | I/O — User I/O pin (bank 6) |
| Broche 66 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 67 | I/O — User I/O pin (bank 6) |
| Broche 68 | I/O — User I/O pin (bank 6) |
| Broche 69 | I/O — User I/O pin (bank 6) |
| Broche 70 | I/O — User I/O pin (bank 6) |
| Broche 71 | GND — Ground |
| Broche 72 | I/O — User I/O pin (bank 7) |
| Broche 73 | I/O — User I/O pin (bank 7) |
| Broche 74 | I/O — User I/O pin (bank 7) |
| Broche 75 | I/O — User I/O pin (bank 7) |
| Broche 76 | I/O — User I/O pin (bank 7) |
| Broche 77 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 78 | I/O — User I/O pin (bank 7) |
| Broche 79 | I/O — User I/O pin (bank 7) |
| Broche 80 | I/O — User I/O pin (bank 7) |
| Broche 81 | I/O — User I/O pin (bank 7) |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O pin (bank 8) |
| Broche 84 | I/O — User I/O pin (bank 8) |
| Broche 85 | I/O — User I/O pin (bank 8) |
| Broche 86 | I/O — User I/O pin (bank 8) |
| Broche 87 | I/O — User I/O pin (bank 8) |
| Broche 88 | I/O — User I/O pin (bank 8) |
| Broche 89 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 90 | I/O — User I/O pin (bank 8) |
| Broche 91 | I/O — User I/O pin (bank 8) |
| Broche 92 | I/O — User I/O pin (bank 8) |
| Broche 93 | I/O — User I/O pin (bank 8) |
| Broche 94 | GND — Ground |
| Broche 95 | INPUT — Dedicated input pin |
| Broche 96 | INPUT — Dedicated input pin |
| Broche 97 | INPUT — Dedicated input pin |
| Broche 98 | VCCINT — Core supply voltage (2.5 V) |
| Broche 99 | INPUT — Dedicated input pin |
| Broche 100 | INPUT — Dedicated input pin |
| Broche 101 | INPUT — Dedicated input pin |
| Broche 102 | GND — Ground |
| Broche 103 | TDI — JTAG test data input |
| Broche 104 | TMS — JTAG test mode select |
| Broche 105 | TCK — JTAG test clock |
| Broche 106 | nCONFIG — Configuration control (active low) |
| Broche 107 | nSTATUS — Configuration status (active low) |
| Broche 108 | CONF_DONE — Configuration done indicator |
| Broche 109 | DCLK — Configuration clock |
| Broche 110 | DATA0 — Configuration data input |
| Broche 111 | MSEL0 — Configuration mode select 0 |
| Broche 112 | MSEL1 — Configuration mode select 1 |
| Broche 113 | VCCINT — Core supply voltage (2.5 V) |
| Broche 114 | TDO — JTAG test data output |
| Broche 115 | nCE — Chip enable (active low, for multi-device config) |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — User I/O pin (bank 8) |
| Broche 118 | I/O — User I/O pin (bank 8) |
| Broche 119 | I/O — User I/O pin (bank 8) |
| Broche 120 | I/O — User I/O pin (bank 8) |
| Broche 121 | VCCIO8 — I/O bank 8 supply voltage |
| Broche 122 | I/O — User I/O pin (bank 7) |
| Broche 123 | I/O — User I/O pin (bank 7) |
| Broche 124 | I/O — User I/O pin (bank 7) |
| Broche 125 | I/O — User I/O pin (bank 7) |
| Broche 126 | GND — Ground |
| Broche 127 | I/O — User I/O pin (bank 7) |
| Broche 128 | I/O — User I/O pin (bank 7) |
| Broche 129 | I/O — User I/O pin (bank 7) |
| Broche 130 | I/O — User I/O pin (bank 7) |
| Broche 131 | VCCIO7 — I/O bank 7 supply voltage |
| Broche 132 | I/O — User I/O pin (bank 6) |
| Broche 133 | I/O — User I/O pin (bank 6) |
| Broche 134 | I/O — User I/O pin (bank 6) |
| Broche 135 | I/O — User I/O pin (bank 6) |
| Broche 136 | GND — Ground |
| Broche 137 | I/O — User I/O pin (bank 6) |
| Broche 138 | I/O — User I/O pin (bank 6) |
| Broche 139 | I/O — User I/O pin (bank 6) |
| Broche 140 | I/O — User I/O pin (bank 6) |
| Broche 141 | VCCIO6 — I/O bank 6 supply voltage |
| Broche 142 | I/O — User I/O pin (bank 5) |
| Broche 143 | I/O — User I/O pin (bank 5) |
| Broche 144 | VCCINT — Core supply voltage (2.5 V) |
Applications typiques
EP1K30TI144-3 convient pour 6 applications: Industrial Control Glue Logic, Communications Interface Bridging, Legacy 74-Series Logic Replacement, Embedded State-Machine Controllers, Low-Cost Prototyping Platforms, Test & Measurement Front-Ends.
Industrial Control Glue Logic
The EP1K30TI144-3's 30,000-gate ACEX 1K fabric and 102 user I/O make it well suited for industrial glue-logic consolidation, where it can replace dozens of 74-series TTL buffers, latches and PAL/GAL devices on a single chip. The industrial -40 °C to +85 °C temperature grade handles factory-floor environments, and 1.8 V/2.5 V/3.3 V I/O bank support interfaces directly to legacy microcontrollers, sensors and motor-driver ICs without external level shifters. The on-chip 24,576 RAM bits via embedded array blocks also allow small FIFO/buffer memories for inter-IC handshaking on the same die, reducing board area.
Recommandé
Communications Interface Bridging
With 1,728 logic elements and 102 I/O, the EP1K30TI144-3 can bridge UART, SPI, I2C, parallel and proprietary industrial buses in a single device, replacing multiple protocol-converter ASICs and CPLDs. The device's 2.5 V core with multi-voltage I/O banks interfaces directly to 3.3 V MCUs and 1.8 V application processors, simplifying mixed-voltage designs. JTAG-supported in-system programmability means firmware engineers can update bridging logic in the field without swapping hardware, which is essential for installed-base industrial equipment with long service lifetimes.
Recommandé
Legacy 74-Series Logic Replacement
Designers maintaining legacy equipment with obsolete 7400-series TTL or CMOS glue logic can consolidate random logic into the EP1K30TI144-3, reducing board area, BOM count and power consumption. The 30K-gate fabric absorbs the equivalent of 50-100 SSI/MSI packages while the 144-pin TQFP gives 102 user I/O for I/O-intensive legacy interfaces. Because the part is bitstream-compatible across the ACEX 1K family, existing Quartus II projects can be retargeted without PCB changes, preserving form-fit-function for installed equipment.
Recommandé
Embedded State-Machine Controllers
The EP1K30TI144-3 is well matched to multi-state controller applications such as instrumentation sequencers, test-stand controllers and peripheral arbiters. Its 1,728 logic elements easily encode 50-200-state FSMs with rich conditional branching, while the 24 Kbit embedded memory supports small lookup tables and pulse-pattern generators. The 2.5 V core plus 1.8 V/2.5 V/3.3 V I/O banks allow direct interface to modern low-voltage MCUs and 5 V-tolerant peripherals via simple resistive dividers, simplifying mixed-signal instrument design.
Recommandé
Low-Cost Prototyping Platforms
Universities, training labs and small-volume product developers use the EP1K30TI144-3 as a low-cost teaching and prototyping vehicle for HDL design (VHDL/Verilog) with the Quartus II Web Edition toolchain. The 144-pin TQFP is breadboard-friendly with breakout PCBs and the part's mature ecosystem (example designs, reference designs, application notes) accelerates student learning. While newer Cyclone or MAX 10 devices are recommended for green-field designs, the EP1K30TI144-3 remains widely available in lab stock through 2026 for legacy course material continuity.
Recommandé
Test & Measurement Front-Ends
In test-and-measurement equipment the EP1K30TI144-3 handles front-end signal conditioning, timing generation and bus multiplexing, leveraging its 102 I/O and on-chip EAB memory for small pattern buffers. The industrial temperature range suits benchtop and rack-mount instruments deployed in factories, while JTAG in-system programmability lets manufacturers calibrate and update timing-logic revisions without opening the chassis. Multi-voltage I/O support enables direct connection to 1.8 V ADCs and 3.3 V DACs commonly used in modern instrument front-ends.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K30TI144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TI144-2NGA | EP1K30TC144-3N | EP1K30TC144-3 | EP1K10TI144-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP (0.5 mm pitch) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Series | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K10) |
| Typical Gate Count | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 10,000 gates |
| Speed Grade | -3 | -2 (faster) | -2 (faster) | -2 (faster) | -3 (same) | -3 (same) | -2 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded Memory (RAM bits) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 12,288 bits |
Principaux différenciateurs
- Same-package -2 speed grade upgrade path (vs EP1K30TI144-2N)
- Industrial temperature grade coverage (vs EP1K30TC144-3N)
- Mature Quartus II ecosystem with reference designs (vs EP1K10TI144-2)
Notes de conception
The EP1K30TI144-3 requires two separate power rails: VCCINT = 2.5 V ± 5% (core logic) and VCCIO1..8 = 1.8 V / 2.5 V / 3.3 V per I/O bank. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, and add a 10 µF bulk tantalum or ceramic capacitor near the FPGA. Each VCCIO bank should also be decoupled with 0.1 µF + 10 µF; share the bulk caps if multiple banks operate at the same voltage. Estimated: at 50% toggle rate and 50% I/O utilization, ICCINT stays below 100 mA and ICCIO per bank below 50 mA, well within a 1 A LDO budget.
Use a 4-layer PCB with a continuous ground plane under the EP1K30TI144-3 to control return paths and reduce SSO noise on the 102 user I/O. The 144-pin TQFP has a 0.5 mm pitch - route signal traces on inner layers with 0.15 mm width / 0.15 mm spacing and use 0.2 mm via-in-pad or tented vias for fan-out. Place the configuration PROM (e.g., EPCS4 or EPCQ4) within 50 mm of the FPGA to keep DCLK and DATA0 traces short and impedance-matched; add 33 Ω series termination on DCLK if the trace exceeds 25 mm.
Do not leave MSEL0/MSEL1 floating - tie them to VCCINT or GND through 1 kΩ resistors to select the correct configuration mode (AS = 00, PS = 01, JTAG = 10). Pull nCONFIG high through a 10 kΩ resistor and add a 1 nF cap to ground for noise immunity; a noisy nCONFIG triggers unintended reconfiguration. Always include a 4.7 kΩ pull-up on nSTATUS and CONF_DONE to allow the Quartus programmer to read configuration status correctly. Finally, account for the -3 speed grade's tCO/tSU timing margins: in designs migrated from -2 silicon, add a 5-10% clock-period guard band to avoid setup violations.
Estimated: with all 102 I/O switching at 10 MHz and 50% utilization, the EP1K30TI144-3 dissipates approximately 0.5-0.8 W in a 144-pin TQFP package. Junction-to-ambient thermal resistance is approximately 35 °C/W for a standard 4-layer JEDEC test board, so the part rises only ~25-30 °C above ambient at full load - well within the +85 °C industrial ceiling. No external heatsink is required; however, in enclosed industrial cabinets without forced airflow, add copper flooding on inner layers and 8-12 thermal vias under the die-up flag area to keep Tj below 100 °C.
Informations de conformité
RoHS, REACH, lead-free and halogen-free status were not provided in the verified web data; consult the Altera/Intel material declaration or franchised distributor documentation for confirmation. AEC-Q100 not applicable because this is an industrial-grade FPGA, not an automotive-qualified part.
