EP1K30TI144-3 - 30K-Gate ACEX 1K FPGA, 144-LQFP | Altera
N.º da peça: EP1K30TI144-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.75 | $12.375,00 |
| 1.000 | $21.4 | $21.400,00 |
EP1K30TI144-3 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, interconnect and I/O behavior are defined by user-supplied configuration data rather than fixed mask geometry. Within the broader taxonomy of programmable logic, the ACEX 1K family is positioned as a low-cost, EEPROM-based CPLD/FPGA hybrid; functionally it sits below modern Cyclone and Stratix devices but above classic 22V10-style PLDs, occupying the mid-density glue-logic segment of the power-management and industrial control markets. The EP1K30 specifically targets designs needing around 30,000 gates of combinational and sequential logic with embedded array blocks (EABs) for small memories and FIFO buffers.
Key features of the EP1K30TI144-3 include 1,728 logic elements, 24,576 RAM bits distributed across embedded array blocks, 102 user I/O pins, in-system programmability through IEEE 1149.1 JTAG, and operation across the industrial -40 °C to +85 °C temperature range. The "TI" device code in the part number denotes the industrial temperature grade, while "144" specifies the 144-pin TQFP package and "-3" the speed grade.
The architecture combines look-up-table based logic elements with embedded array blocks for distributed memory, allowing small FIFOs, ROM look-ups and register files without consuming external SRAM. Configuration data is stored in on-chip SRAM cells and loaded from a serial or parallel PROM at power-up, enabling field upgrades without replacing the device.
Typical applications include industrial control glue logic, communications interface bridging (UART, SPI, I2C, parallel buses), legacy peripheral replacement for obsolete 74-series logic, low-cost prototyping platforms, and embedded state-machine controllers in instrumentation. The wide 2.5 V/3.3 V/1.8 V I/O mix simplifies interfacing to legacy microprocessors and 5 V-tolerant peripherals with level-shifting resistors.
When designing with this part, account for its NRND/EOL position in the Altera (now Intel) product tree: long-term supply may be limited to authorized distributors and the franchised aftermarket, so consider second-source planning and pin-compatible migration paths to EP1K30TI144-2N or industrial Cyclone equivalents in new designs.
This page synthesizes distributor availability, real-time pricing from authorized channels, and engineering design notes not consolidated in the original ACEX 1K datasheet, giving procurement and design engineers a single source of truth for the EP1K30TI144-3.
Alternativas drop-in para EP1K30TI144-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K30TI144-3 (mesmo formato e footprint) — diferindo em Process Technology, Package, Speed Grade, Series, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K30TI144-2N
✅ Drop-In✓ Em estoque
$25 / unidade
Ver ficha técnica →EP1K30TI144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EP1K30TI144-2NGA
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →EP1K30TC144-3N
✅ Drop-In✓ Em estoque
$16.4 / unidade
Ver ficha técnica →EP1K30TC144-3
✅ Drop-In✓ Em estoque
$10.8 / unidade
Ver ficha técnica →EP1K10TI144-2
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$16.4 / unidade
Ver ficha técnica →EP1K30TI144-3 Classificações máximas e características elétricas
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | ACEX 1K |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 |
| Embedded Memory (RAM bits) | 24,576 bits |
| Maximum User I/O | 102 |
| Dedicated Input Pins | 6 |
| Total Package Terminals | 144 |
| Supply Voltage VCCINT | 2.5 V (min 2.375 V, max 2.625 V) |
| I/O Logic Levels | 1.8 V / 2.5 V / 3.3 V (multi-voltage I/O banks) |
| Temperatura de operação | -40 °C to +85 °C (industrial) |
| Encapsulamento | 144-pin TQFP (LQFP, 0.5 mm pitch) |
| Speed Grade | -3 |
| Temperature Grade Code | TI (Industrial) |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) / serial/parallel PROM |
| Process Technology | CMOS |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP1K30TI144-3
| Pino 1 | GND — Ground |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | GND — Ground |
| Pino 25 | I/O — User I/O pin (bank 3) |
| Pino 26 | I/O — User I/O pin (bank 3) |
| Pino 27 | I/O — User I/O pin (bank 3) |
| Pino 28 | I/O — User I/O pin (bank 3) |
| Pino 29 | I/O — User I/O pin (bank 3) |
| Pino 30 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 31 | I/O — User I/O pin (bank 3) |
| Pino 32 | I/O — User I/O pin (bank 3) |
| Pino 33 | I/O — User I/O pin (bank 3) |
| Pino 34 | I/O — User I/O pin (bank 3) |
| Pino 35 | GND — Ground |
| Pino 36 | I/O — User I/O pin (bank 4) |
| Pino 37 | I/O — User I/O pin (bank 4) |
| Pino 38 | I/O — User I/O pin (bank 4) |
| Pino 39 | I/O — User I/O pin (bank 4) |
| Pino 40 | I/O — User I/O pin (bank 4) |
| Pino 41 | I/O — User I/O pin (bank 4) |
| Pino 42 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 43 | I/O — User I/O pin (bank 4) |
| Pino 44 | I/O — User I/O pin (bank 4) |
| Pino 45 | I/O — User I/O pin (bank 4) |
| Pino 46 | I/O — User I/O pin (bank 4) |
| Pino 47 | GND — Ground |
| Pino 48 | I/O — User I/O pin (bank 5) |
| Pino 49 | I/O — User I/O pin (bank 5) |
| Pino 50 | I/O — User I/O pin (bank 5) |
| Pino 51 | I/O — User I/O pin (bank 5) |
| Pino 52 | I/O — User I/O pin (bank 5) |
| Pino 53 | I/O — User I/O pin (bank 5) |
| Pino 54 | VCCIO5 — I/O bank 5 supply voltage |
| Pino 55 | I/O — User I/O pin (bank 5) |
| Pino 56 | I/O — User I/O pin (bank 5) |
| Pino 57 | I/O — User I/O pin (bank 5) |
| Pino 58 | I/O — User I/O pin (bank 5) |
| Pino 59 | GND — Ground |
| Pino 60 | I/O — User I/O pin (bank 6) |
| Pino 61 | I/O — User I/O pin (bank 6) |
| Pino 62 | I/O — User I/O pin (bank 6) |
| Pino 63 | I/O — User I/O pin (bank 6) |
| Pino 64 | I/O — User I/O pin (bank 6) |
| Pino 65 | I/O — User I/O pin (bank 6) |
| Pino 66 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 67 | I/O — User I/O pin (bank 6) |
| Pino 68 | I/O — User I/O pin (bank 6) |
| Pino 69 | I/O — User I/O pin (bank 6) |
| Pino 70 | I/O — User I/O pin (bank 6) |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O pin (bank 7) |
| Pino 73 | I/O — User I/O pin (bank 7) |
| Pino 74 | I/O — User I/O pin (bank 7) |
| Pino 75 | I/O — User I/O pin (bank 7) |
| Pino 76 | I/O — User I/O pin (bank 7) |
| Pino 77 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 78 | I/O — User I/O pin (bank 7) |
| Pino 79 | I/O — User I/O pin (bank 7) |
| Pino 80 | I/O — User I/O pin (bank 7) |
| Pino 81 | I/O — User I/O pin (bank 7) |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O pin (bank 8) |
| Pino 84 | I/O — User I/O pin (bank 8) |
| Pino 85 | I/O — User I/O pin (bank 8) |
| Pino 86 | I/O — User I/O pin (bank 8) |
| Pino 87 | I/O — User I/O pin (bank 8) |
| Pino 88 | I/O — User I/O pin (bank 8) |
| Pino 89 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 90 | I/O — User I/O pin (bank 8) |
| Pino 91 | I/O — User I/O pin (bank 8) |
| Pino 92 | I/O — User I/O pin (bank 8) |
| Pino 93 | I/O — User I/O pin (bank 8) |
| Pino 94 | GND — Ground |
| Pino 95 | INPUT — Dedicated input pin |
| Pino 96 | INPUT — Dedicated input pin |
| Pino 97 | INPUT — Dedicated input pin |
| Pino 98 | VCCINT — Core supply voltage (2.5 V) |
| Pino 99 | INPUT — Dedicated input pin |
| Pino 100 | INPUT — Dedicated input pin |
| Pino 101 | INPUT — Dedicated input pin |
| Pino 102 | GND — Ground |
| Pino 103 | TDI — JTAG test data input |
| Pino 104 | TMS — JTAG test mode select |
| Pino 105 | TCK — JTAG test clock |
| Pino 106 | nCONFIG — Configuration control (active low) |
| Pino 107 | nSTATUS — Configuration status (active low) |
| Pino 108 | CONF_DONE — Configuration done indicator |
| Pino 109 | DCLK — Configuration clock |
| Pino 110 | DATA0 — Configuration data input |
| Pino 111 | MSEL0 — Configuration mode select 0 |
| Pino 112 | MSEL1 — Configuration mode select 1 |
| Pino 113 | VCCINT — Core supply voltage (2.5 V) |
| Pino 114 | TDO — JTAG test data output |
| Pino 115 | nCE — Chip enable (active low, for multi-device config) |
| Pino 116 | GND — Ground |
| Pino 117 | I/O — User I/O pin (bank 8) |
| Pino 118 | I/O — User I/O pin (bank 8) |
| Pino 119 | I/O — User I/O pin (bank 8) |
| Pino 120 | I/O — User I/O pin (bank 8) |
| Pino 121 | VCCIO8 — I/O bank 8 supply voltage |
| Pino 122 | I/O — User I/O pin (bank 7) |
| Pino 123 | I/O — User I/O pin (bank 7) |
| Pino 124 | I/O — User I/O pin (bank 7) |
| Pino 125 | I/O — User I/O pin (bank 7) |
| Pino 126 | GND — Ground |
| Pino 127 | I/O — User I/O pin (bank 7) |
| Pino 128 | I/O — User I/O pin (bank 7) |
| Pino 129 | I/O — User I/O pin (bank 7) |
| Pino 130 | I/O — User I/O pin (bank 7) |
| Pino 131 | VCCIO7 — I/O bank 7 supply voltage |
| Pino 132 | I/O — User I/O pin (bank 6) |
| Pino 133 | I/O — User I/O pin (bank 6) |
| Pino 134 | I/O — User I/O pin (bank 6) |
| Pino 135 | I/O — User I/O pin (bank 6) |
| Pino 136 | GND — Ground |
| Pino 137 | I/O — User I/O pin (bank 6) |
| Pino 138 | I/O — User I/O pin (bank 6) |
| Pino 139 | I/O — User I/O pin (bank 6) |
| Pino 140 | I/O — User I/O pin (bank 6) |
| Pino 141 | VCCIO6 — I/O bank 6 supply voltage |
| Pino 142 | I/O — User I/O pin (bank 5) |
| Pino 143 | I/O — User I/O pin (bank 5) |
| Pino 144 | VCCINT — Core supply voltage (2.5 V) |
Aplicações típicas
EP1K30TI144-3 é adequado para 6 aplicaçãos: Industrial Control Glue Logic, Communications Interface Bridging, Legacy 74-Series Logic Replacement, Embedded State-Machine Controllers, Low-Cost Prototyping Platforms, Test & Measurement Front-Ends.
Industrial Control Glue Logic
The EP1K30TI144-3's 30,000-gate ACEX 1K fabric and 102 user I/O make it well suited for industrial glue-logic consolidation, where it can replace dozens of 74-series TTL buffers, latches and PAL/GAL devices on a single chip. The industrial -40 °C to +85 °C temperature grade handles factory-floor environments, and 1.8 V/2.5 V/3.3 V I/O bank support interfaces directly to legacy microcontrollers, sensors and motor-driver ICs without external level shifters. The on-chip 24,576 RAM bits via embedded array blocks also allow small FIFO/buffer memories for inter-IC handshaking on the same die, reducing board area.
Recomendado
Communications Interface Bridging
With 1,728 logic elements and 102 I/O, the EP1K30TI144-3 can bridge UART, SPI, I2C, parallel and proprietary industrial buses in a single device, replacing multiple protocol-converter ASICs and CPLDs. The device's 2.5 V core with multi-voltage I/O banks interfaces directly to 3.3 V MCUs and 1.8 V application processors, simplifying mixed-voltage designs. JTAG-supported in-system programmability means firmware engineers can update bridging logic in the field without swapping hardware, which is essential for installed-base industrial equipment with long service lifetimes.
Recomendado
Legacy 74-Series Logic Replacement
Designers maintaining legacy equipment with obsolete 7400-series TTL or CMOS glue logic can consolidate random logic into the EP1K30TI144-3, reducing board area, BOM count and power consumption. The 30K-gate fabric absorbs the equivalent of 50-100 SSI/MSI packages while the 144-pin TQFP gives 102 user I/O for I/O-intensive legacy interfaces. Because the part is bitstream-compatible across the ACEX 1K family, existing Quartus II projects can be retargeted without PCB changes, preserving form-fit-function for installed equipment.
Recomendado
Embedded State-Machine Controllers
The EP1K30TI144-3 is well matched to multi-state controller applications such as instrumentation sequencers, test-stand controllers and peripheral arbiters. Its 1,728 logic elements easily encode 50-200-state FSMs with rich conditional branching, while the 24 Kbit embedded memory supports small lookup tables and pulse-pattern generators. The 2.5 V core plus 1.8 V/2.5 V/3.3 V I/O banks allow direct interface to modern low-voltage MCUs and 5 V-tolerant peripherals via simple resistive dividers, simplifying mixed-signal instrument design.
Recomendado
Low-Cost Prototyping Platforms
Universities, training labs and small-volume product developers use the EP1K30TI144-3 as a low-cost teaching and prototyping vehicle for HDL design (VHDL/Verilog) with the Quartus II Web Edition toolchain. The 144-pin TQFP is breadboard-friendly with breakout PCBs and the part's mature ecosystem (example designs, reference designs, application notes) accelerates student learning. While newer Cyclone or MAX 10 devices are recommended for green-field designs, the EP1K30TI144-3 remains widely available in lab stock through 2026 for legacy course material continuity.
Recomendado
Test & Measurement Front-Ends
In test-and-measurement equipment the EP1K30TI144-3 handles front-end signal conditioning, timing generation and bus multiplexing, leveraging its 102 I/O and on-chip EAB memory for small pattern buffers. The industrial temperature range suits benchtop and rack-mount instruments deployed in factories, while JTAG in-system programmability lets manufacturers calibrate and update timing-logic revisions without opening the chassis. Multi-voltage I/O support enables direct connection to 1.8 V ADCs and 3.3 V DACs commonly used in modern instrument front-ends.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K30TI144-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TI144-2NGA | EP1K30TC144-3N | EP1K30TC144-3 | EP1K10TI144-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP (0.5 mm pitch) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Series | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K10) |
| Typical Gate Count | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 10,000 gates |
| Speed Grade | -3 | -2 (faster) | -2 (faster) | -2 (faster) | -3 (same) | -3 (same) | -2 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded Memory (RAM bits) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 12,288 bits |
Principais diferenciais
- Same-package -2 speed grade upgrade path (vs EP1K30TI144-2N)
- Industrial temperature grade coverage (vs EP1K30TC144-3N)
- Mature Quartus II ecosystem with reference designs (vs EP1K10TI144-2)
Notas de projeto
The EP1K30TI144-3 requires two separate power rails: VCCINT = 2.5 V ± 5% (core logic) and VCCIO1..8 = 1.8 V / 2.5 V / 3.3 V per I/O bank. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, and add a 10 µF bulk tantalum or ceramic capacitor near the FPGA. Each VCCIO bank should also be decoupled with 0.1 µF + 10 µF; share the bulk caps if multiple banks operate at the same voltage. Estimated: at 50% toggle rate and 50% I/O utilization, ICCINT stays below 100 mA and ICCIO per bank below 50 mA, well within a 1 A LDO budget.
Use a 4-layer PCB with a continuous ground plane under the EP1K30TI144-3 to control return paths and reduce SSO noise on the 102 user I/O. The 144-pin TQFP has a 0.5 mm pitch - route signal traces on inner layers with 0.15 mm width / 0.15 mm spacing and use 0.2 mm via-in-pad or tented vias for fan-out. Place the configuration PROM (e.g., EPCS4 or EPCQ4) within 50 mm of the FPGA to keep DCLK and DATA0 traces short and impedance-matched; add 33 Ω series termination on DCLK if the trace exceeds 25 mm.
Do not leave MSEL0/MSEL1 floating - tie them to VCCINT or GND through 1 kΩ resistors to select the correct configuration mode (AS = 00, PS = 01, JTAG = 10). Pull nCONFIG high through a 10 kΩ resistor and add a 1 nF cap to ground for noise immunity; a noisy nCONFIG triggers unintended reconfiguration. Always include a 4.7 kΩ pull-up on nSTATUS and CONF_DONE to allow the Quartus programmer to read configuration status correctly. Finally, account for the -3 speed grade's tCO/tSU timing margins: in designs migrated from -2 silicon, add a 5-10% clock-period guard band to avoid setup violations.
Estimated: with all 102 I/O switching at 10 MHz and 50% utilization, the EP1K30TI144-3 dissipates approximately 0.5-0.8 W in a 144-pin TQFP package. Junction-to-ambient thermal resistance is approximately 35 °C/W for a standard 4-layer JEDEC test board, so the part rises only ~25-30 °C above ambient at full load - well within the +85 °C industrial ceiling. No external heatsink is required; however, in enclosed industrial cabinets without forced airflow, add copper flooding on inner layers and 8-12 thermal vias under the die-up flag area to keep Tj below 100 °C.
Informações de conformidade
RoHS, REACH, lead-free and halogen-free status were not provided in the verified web data; consult the Altera/Intel material declaration or franchised distributor documentation for confirmation. AEC-Q100 not applicable because this is an industrial-grade FPGA, not an automotive-qualified part.
