EP1K30TI144-3 - 30K-Gate ACEX 1K FPGA, 144-LQFP | Altera
부품 번호: EP1K30TI144-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.75 | $12,375.00 |
| 1,000 | $21.4 | $21,400.00 |
EP1K30TI144-3 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic fabric, interconnect and I/O behavior are defined by user-supplied configuration data rather than fixed mask geometry. Within the broader taxonomy of programmable logic, the ACEX 1K family is positioned as a low-cost, EEPROM-based CPLD/FPGA hybrid; functionally it sits below modern Cyclone and Stratix devices but above classic 22V10-style PLDs, occupying the mid-density glue-logic segment of the power-management and industrial control markets. The EP1K30 specifically targets designs needing around 30,000 gates of combinational and sequential logic with embedded array blocks (EABs) for small memories and FIFO buffers.
Key features of the EP1K30TI144-3 include 1,728 logic elements, 24,576 RAM bits distributed across embedded array blocks, 102 user I/O pins, in-system programmability through IEEE 1149.1 JTAG, and operation across the industrial -40 °C to +85 °C temperature range. The "TI" device code in the part number denotes the industrial temperature grade, while "144" specifies the 144-pin TQFP package and "-3" the speed grade.
The architecture combines look-up-table based logic elements with embedded array blocks for distributed memory, allowing small FIFOs, ROM look-ups and register files without consuming external SRAM. Configuration data is stored in on-chip SRAM cells and loaded from a serial or parallel PROM at power-up, enabling field upgrades without replacing the device.
Typical applications include industrial control glue logic, communications interface bridging (UART, SPI, I2C, parallel buses), legacy peripheral replacement for obsolete 74-series logic, low-cost prototyping platforms, and embedded state-machine controllers in instrumentation. The wide 2.5 V/3.3 V/1.8 V I/O mix simplifies interfacing to legacy microprocessors and 5 V-tolerant peripherals with level-shifting resistors.
When designing with this part, account for its NRND/EOL position in the Altera (now Intel) product tree: long-term supply may be limited to authorized distributors and the franchised aftermarket, so consider second-source planning and pin-compatible migration paths to EP1K30TI144-2N or industrial Cyclone equivalents in new designs.
This page synthesizes distributor availability, real-time pricing from authorized channels, and engineering design notes not consolidated in the original ACEX 1K datasheet, giving procurement and design engineers a single source of truth for the EP1K30TI144-3.
드롭인 대체품: EP1K30TI144-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1K30TI144-3 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Speed Grade, Series, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1K30TI144-2N
✅ 드롭인✓ 재고 있음
$25 / 개
데이터시트 보기 →EP1K30TI144-2
✅ 드롭인✓ 재고 있음
$13.85 / 개
데이터시트 보기 →EP1K30TI144-2NGA
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →EP1K30TC144-3N
✅ 드롭인✓ 재고 있음
$16.4 / 개
데이터시트 보기 →EP1K30TC144-3
✅ 드롭인✓ 재고 있음
$10.8 / 개
데이터시트 보기 →EP1K10TI144-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$16.4 / 개
데이터시트 보기 →EP1K30TI144-3 최대 정격 & 전기적 특성
| Product Type | FPGA (Field Programmable Gate Array) |
| Series | ACEX 1K |
| Typical Gate Count | 30,000 gates |
| Logic Elements | 1,728 |
| Embedded Memory (RAM bits) | 24,576 bits |
| Maximum User I/O | 102 |
| Dedicated Input Pins | 6 |
| Total Package Terminals | 144 |
| Supply Voltage VCCINT | 2.5 V (min 2.375 V, max 2.625 V) |
| I/O Logic Levels | 1.8 V / 2.5 V / 3.3 V (multi-voltage I/O banks) |
| 동작 온도 | -40 °C to +85 °C (industrial) |
| 패키지 | 144-pin TQFP (LQFP, 0.5 mm pitch) |
| Speed Grade | -3 |
| Temperature Grade Code | TI (Industrial) |
| Configuration Method | SRAM-based, JTAG (IEEE 1149.1) / serial/parallel PROM |
| Process Technology | CMOS |
| 실장 유형 | Surface Mount |
EP1K30TI144-3 핀 구성
| 핀 1 | GND — Ground |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | I/O — User I/O pin (bank 1) |
| 핀 4 | I/O — User I/O pin (bank 1) |
| 핀 5 | I/O — User I/O pin (bank 1) |
| 핀 6 | I/O — User I/O pin (bank 1) |
| 핀 7 | I/O — User I/O pin (bank 1) |
| 핀 8 | VCCIO1 — I/O bank 1 supply voltage |
| 핀 9 | I/O — User I/O pin (bank 1) |
| 핀 10 | I/O — User I/O pin (bank 1) |
| 핀 11 | I/O — User I/O pin (bank 1) |
| 핀 12 | GND — Ground |
| 핀 13 | I/O — User I/O pin (bank 2) |
| 핀 14 | I/O — User I/O pin (bank 2) |
| 핀 15 | I/O — User I/O pin (bank 2) |
| 핀 16 | I/O — User I/O pin (bank 2) |
| 핀 17 | I/O — User I/O pin (bank 2) |
| 핀 18 | I/O — User I/O pin (bank 2) |
| 핀 19 | VCCIO2 — I/O bank 2 supply voltage |
| 핀 20 | I/O — User I/O pin (bank 2) |
| 핀 21 | I/O — User I/O pin (bank 2) |
| 핀 22 | I/O — User I/O pin (bank 2) |
| 핀 23 | I/O — User I/O pin (bank 2) |
| 핀 24 | GND — Ground |
| 핀 25 | I/O — User I/O pin (bank 3) |
| 핀 26 | I/O — User I/O pin (bank 3) |
| 핀 27 | I/O — User I/O pin (bank 3) |
| 핀 28 | I/O — User I/O pin (bank 3) |
| 핀 29 | I/O — User I/O pin (bank 3) |
| 핀 30 | VCCIO3 — I/O bank 3 supply voltage |
| 핀 31 | I/O — User I/O pin (bank 3) |
| 핀 32 | I/O — User I/O pin (bank 3) |
| 핀 33 | I/O — User I/O pin (bank 3) |
| 핀 34 | I/O — User I/O pin (bank 3) |
| 핀 35 | GND — Ground |
| 핀 36 | I/O — User I/O pin (bank 4) |
| 핀 37 | I/O — User I/O pin (bank 4) |
| 핀 38 | I/O — User I/O pin (bank 4) |
| 핀 39 | I/O — User I/O pin (bank 4) |
| 핀 40 | I/O — User I/O pin (bank 4) |
| 핀 41 | I/O — User I/O pin (bank 4) |
| 핀 42 | VCCIO4 — I/O bank 4 supply voltage |
| 핀 43 | I/O — User I/O pin (bank 4) |
| 핀 44 | I/O — User I/O pin (bank 4) |
| 핀 45 | I/O — User I/O pin (bank 4) |
| 핀 46 | I/O — User I/O pin (bank 4) |
| 핀 47 | GND — Ground |
| 핀 48 | I/O — User I/O pin (bank 5) |
| 핀 49 | I/O — User I/O pin (bank 5) |
| 핀 50 | I/O — User I/O pin (bank 5) |
| 핀 51 | I/O — User I/O pin (bank 5) |
| 핀 52 | I/O — User I/O pin (bank 5) |
| 핀 53 | I/O — User I/O pin (bank 5) |
| 핀 54 | VCCIO5 — I/O bank 5 supply voltage |
| 핀 55 | I/O — User I/O pin (bank 5) |
| 핀 56 | I/O — User I/O pin (bank 5) |
| 핀 57 | I/O — User I/O pin (bank 5) |
| 핀 58 | I/O — User I/O pin (bank 5) |
| 핀 59 | GND — Ground |
| 핀 60 | I/O — User I/O pin (bank 6) |
| 핀 61 | I/O — User I/O pin (bank 6) |
| 핀 62 | I/O — User I/O pin (bank 6) |
| 핀 63 | I/O — User I/O pin (bank 6) |
| 핀 64 | I/O — User I/O pin (bank 6) |
| 핀 65 | I/O — User I/O pin (bank 6) |
| 핀 66 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 67 | I/O — User I/O pin (bank 6) |
| 핀 68 | I/O — User I/O pin (bank 6) |
| 핀 69 | I/O — User I/O pin (bank 6) |
| 핀 70 | I/O — User I/O pin (bank 6) |
| 핀 71 | GND — Ground |
| 핀 72 | I/O — User I/O pin (bank 7) |
| 핀 73 | I/O — User I/O pin (bank 7) |
| 핀 74 | I/O — User I/O pin (bank 7) |
| 핀 75 | I/O — User I/O pin (bank 7) |
| 핀 76 | I/O — User I/O pin (bank 7) |
| 핀 77 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 78 | I/O — User I/O pin (bank 7) |
| 핀 79 | I/O — User I/O pin (bank 7) |
| 핀 80 | I/O — User I/O pin (bank 7) |
| 핀 81 | I/O — User I/O pin (bank 7) |
| 핀 82 | GND — Ground |
| 핀 83 | I/O — User I/O pin (bank 8) |
| 핀 84 | I/O — User I/O pin (bank 8) |
| 핀 85 | I/O — User I/O pin (bank 8) |
| 핀 86 | I/O — User I/O pin (bank 8) |
| 핀 87 | I/O — User I/O pin (bank 8) |
| 핀 88 | I/O — User I/O pin (bank 8) |
| 핀 89 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 90 | I/O — User I/O pin (bank 8) |
| 핀 91 | I/O — User I/O pin (bank 8) |
| 핀 92 | I/O — User I/O pin (bank 8) |
| 핀 93 | I/O — User I/O pin (bank 8) |
| 핀 94 | GND — Ground |
| 핀 95 | INPUT — Dedicated input pin |
| 핀 96 | INPUT — Dedicated input pin |
| 핀 97 | INPUT — Dedicated input pin |
| 핀 98 | VCCINT — Core supply voltage (2.5 V) |
| 핀 99 | INPUT — Dedicated input pin |
| 핀 100 | INPUT — Dedicated input pin |
| 핀 101 | INPUT — Dedicated input pin |
| 핀 102 | GND — Ground |
| 핀 103 | TDI — JTAG test data input |
| 핀 104 | TMS — JTAG test mode select |
| 핀 105 | TCK — JTAG test clock |
| 핀 106 | nCONFIG — Configuration control (active low) |
| 핀 107 | nSTATUS — Configuration status (active low) |
| 핀 108 | CONF_DONE — Configuration done indicator |
| 핀 109 | DCLK — Configuration clock |
| 핀 110 | DATA0 — Configuration data input |
| 핀 111 | MSEL0 — Configuration mode select 0 |
| 핀 112 | MSEL1 — Configuration mode select 1 |
| 핀 113 | VCCINT — Core supply voltage (2.5 V) |
| 핀 114 | TDO — JTAG test data output |
| 핀 115 | nCE — Chip enable (active low, for multi-device config) |
| 핀 116 | GND — Ground |
| 핀 117 | I/O — User I/O pin (bank 8) |
| 핀 118 | I/O — User I/O pin (bank 8) |
| 핀 119 | I/O — User I/O pin (bank 8) |
| 핀 120 | I/O — User I/O pin (bank 8) |
| 핀 121 | VCCIO8 — I/O bank 8 supply voltage |
| 핀 122 | I/O — User I/O pin (bank 7) |
| 핀 123 | I/O — User I/O pin (bank 7) |
| 핀 124 | I/O — User I/O pin (bank 7) |
| 핀 125 | I/O — User I/O pin (bank 7) |
| 핀 126 | GND — Ground |
| 핀 127 | I/O — User I/O pin (bank 7) |
| 핀 128 | I/O — User I/O pin (bank 7) |
| 핀 129 | I/O — User I/O pin (bank 7) |
| 핀 130 | I/O — User I/O pin (bank 7) |
| 핀 131 | VCCIO7 — I/O bank 7 supply voltage |
| 핀 132 | I/O — User I/O pin (bank 6) |
| 핀 133 | I/O — User I/O pin (bank 6) |
| 핀 134 | I/O — User I/O pin (bank 6) |
| 핀 135 | I/O — User I/O pin (bank 6) |
| 핀 136 | GND — Ground |
| 핀 137 | I/O — User I/O pin (bank 6) |
| 핀 138 | I/O — User I/O pin (bank 6) |
| 핀 139 | I/O — User I/O pin (bank 6) |
| 핀 140 | I/O — User I/O pin (bank 6) |
| 핀 141 | VCCIO6 — I/O bank 6 supply voltage |
| 핀 142 | I/O — User I/O pin (bank 5) |
| 핀 143 | I/O — User I/O pin (bank 5) |
| 핀 144 | VCCINT — Core supply voltage (2.5 V) |
일반적인 애플리케이션
EP1K30TI144-3 적합 용도: 6 애플리케이션s: Industrial Control Glue Logic, Communications Interface Bridging, Legacy 74-Series Logic Replacement, Embedded State-Machine Controllers, Low-Cost Prototyping Platforms, Test & Measurement Front-Ends.
Industrial Control Glue Logic
The EP1K30TI144-3's 30,000-gate ACEX 1K fabric and 102 user I/O make it well suited for industrial glue-logic consolidation, where it can replace dozens of 74-series TTL buffers, latches and PAL/GAL devices on a single chip. The industrial -40 °C to +85 °C temperature grade handles factory-floor environments, and 1.8 V/2.5 V/3.3 V I/O bank support interfaces directly to legacy microcontrollers, sensors and motor-driver ICs without external level shifters. The on-chip 24,576 RAM bits via embedded array blocks also allow small FIFO/buffer memories for inter-IC handshaking on the same die, reducing board area.
추천
Communications Interface Bridging
With 1,728 logic elements and 102 I/O, the EP1K30TI144-3 can bridge UART, SPI, I2C, parallel and proprietary industrial buses in a single device, replacing multiple protocol-converter ASICs and CPLDs. The device's 2.5 V core with multi-voltage I/O banks interfaces directly to 3.3 V MCUs and 1.8 V application processors, simplifying mixed-voltage designs. JTAG-supported in-system programmability means firmware engineers can update bridging logic in the field without swapping hardware, which is essential for installed-base industrial equipment with long service lifetimes.
추천
Legacy 74-Series Logic Replacement
Designers maintaining legacy equipment with obsolete 7400-series TTL or CMOS glue logic can consolidate random logic into the EP1K30TI144-3, reducing board area, BOM count and power consumption. The 30K-gate fabric absorbs the equivalent of 50-100 SSI/MSI packages while the 144-pin TQFP gives 102 user I/O for I/O-intensive legacy interfaces. Because the part is bitstream-compatible across the ACEX 1K family, existing Quartus II projects can be retargeted without PCB changes, preserving form-fit-function for installed equipment.
추천
Embedded State-Machine Controllers
The EP1K30TI144-3 is well matched to multi-state controller applications such as instrumentation sequencers, test-stand controllers and peripheral arbiters. Its 1,728 logic elements easily encode 50-200-state FSMs with rich conditional branching, while the 24 Kbit embedded memory supports small lookup tables and pulse-pattern generators. The 2.5 V core plus 1.8 V/2.5 V/3.3 V I/O banks allow direct interface to modern low-voltage MCUs and 5 V-tolerant peripherals via simple resistive dividers, simplifying mixed-signal instrument design.
추천
Low-Cost Prototyping Platforms
Universities, training labs and small-volume product developers use the EP1K30TI144-3 as a low-cost teaching and prototyping vehicle for HDL design (VHDL/Verilog) with the Quartus II Web Edition toolchain. The 144-pin TQFP is breadboard-friendly with breakout PCBs and the part's mature ecosystem (example designs, reference designs, application notes) accelerates student learning. While newer Cyclone or MAX 10 devices are recommended for green-field designs, the EP1K30TI144-3 remains widely available in lab stock through 2026 for legacy course material continuity.
추천
Test & Measurement Front-Ends
In test-and-measurement equipment the EP1K30TI144-3 handles front-end signal conditioning, timing generation and bus multiplexing, leveraging its 102 I/O and on-chip EAB memory for small pattern buffers. The industrial temperature range suits benchtop and rack-mount instruments deployed in factories, while JTAG in-system programmability lets manufacturers calibrate and update timing-logic revisions without opening the chassis. Multi-voltage I/O support enables direct connection to 1.8 V ADCs and 3.3 V DACs commonly used in modern instrument front-ends.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1K30TI144-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1K30TI144-2N | EP1K30TI144-2 | EP1K30TI144-2NGA | EP1K30TC144-3N | EP1K30TC144-3 | EP1K10TI144-2 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 144-pin TQFP (0.5 mm pitch) | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Series | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K30) | ACEX 1K (EP1K10) |
| Typical Gate Count | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 30,000 gates | 10,000 gates |
| Speed Grade | -3 | -2 (faster) | -2 (faster) | -2 (faster) | -3 (same) | -3 (same) | -2 (faster) |
| Temperature Grade | Industrial (-40 °C to +85 °C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 576 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded Memory (RAM bits) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 12,288 bits |
주요 차별점
- Same-package -2 speed grade upgrade path (vs EP1K30TI144-2N)
- Industrial temperature grade coverage (vs EP1K30TC144-3N)
- Mature Quartus II ecosystem with reference designs (vs EP1K10TI144-2)
설계 노트
The EP1K30TI144-3 requires two separate power rails: VCCINT = 2.5 V ± 5% (core logic) and VCCIO1..8 = 1.8 V / 2.5 V / 3.3 V per I/O bank. Decouple each VCCINT pin with a 0.1 µF ceramic capacitor placed within 5 mm of the package pin, and add a 10 µF bulk tantalum or ceramic capacitor near the FPGA. Each VCCIO bank should also be decoupled with 0.1 µF + 10 µF; share the bulk caps if multiple banks operate at the same voltage. Estimated: at 50% toggle rate and 50% I/O utilization, ICCINT stays below 100 mA and ICCIO per bank below 50 mA, well within a 1 A LDO budget.
Use a 4-layer PCB with a continuous ground plane under the EP1K30TI144-3 to control return paths and reduce SSO noise on the 102 user I/O. The 144-pin TQFP has a 0.5 mm pitch - route signal traces on inner layers with 0.15 mm width / 0.15 mm spacing and use 0.2 mm via-in-pad or tented vias for fan-out. Place the configuration PROM (e.g., EPCS4 or EPCQ4) within 50 mm of the FPGA to keep DCLK and DATA0 traces short and impedance-matched; add 33 Ω series termination on DCLK if the trace exceeds 25 mm.
Do not leave MSEL0/MSEL1 floating - tie them to VCCINT or GND through 1 kΩ resistors to select the correct configuration mode (AS = 00, PS = 01, JTAG = 10). Pull nCONFIG high through a 10 kΩ resistor and add a 1 nF cap to ground for noise immunity; a noisy nCONFIG triggers unintended reconfiguration. Always include a 4.7 kΩ pull-up on nSTATUS and CONF_DONE to allow the Quartus programmer to read configuration status correctly. Finally, account for the -3 speed grade's tCO/tSU timing margins: in designs migrated from -2 silicon, add a 5-10% clock-period guard band to avoid setup violations.
Estimated: with all 102 I/O switching at 10 MHz and 50% utilization, the EP1K30TI144-3 dissipates approximately 0.5-0.8 W in a 144-pin TQFP package. Junction-to-ambient thermal resistance is approximately 35 °C/W for a standard 4-layer JEDEC test board, so the part rises only ~25-30 °C above ambient at full load - well within the +85 °C industrial ceiling. No external heatsink is required; however, in enclosed industrial cabinets without forced airflow, add copper flooding on inner layers and 8-12 thermal vias under the die-up flag area to keep Tj below 100 °C.
규정 준수 정보
RoHS, REACH, lead-free and halogen-free status were not provided in the verified web data; consult the Altera/Intel material declaration or franchised distributor documentation for confirmation. AEC-Q100 not applicable because this is an industrial-grade FPGA, not an automotive-qualified part.
