EP1K50TI144-3 - 50K-Gate ACEX 1K FPGA, 102 I/O, PQFP-144 | Intel
Référence : EP1K50TI144-3 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.8 | $1 380,00 |
| 500 | $11.95 | $5 975,00 |
| 1 000 | $10.4 | $10 400,00 |
EP1K50TI144-3 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that contains an array of programmable logic blocks connected via programmable interconnect, allowing designers to implement custom digital logic functions that can be reconfigured after manufacture. FPGAs occupy a unique position between fixed-function ASICs and software-programmable processors, offering hardware-timed performance, deterministic latency, and parallel execution for DSP, glue logic, and interface bridging tasks. The ACEX 1K family, introduced in 1999, was one of the first low-cost SRAM-based FPGAs and belongs to the broader taxonomy: FPGA -> Programmable Logic Device (PLD) -> Logic IC -> Integrated Circuit.
Key features include 360 Configurable Logic Blocks (CLBs) with 2,880 LEs, 72 embedded array blocks (EABs) providing 40,960 bits of dual-port RAM, and 6 dedicated input pins. The -3 speed grade offers approximately 12.5 ns propagation delay through the LUT + interconnect path. Built on a 0.22 µm CMOS SRAM process, the ACEX 1K supports in-system programming via the IEEE 1149.1 JTAG interface and can be configured from a serial PROM, parallel byte-wide flash, or processor port. Industrial-grade parts (TI suffix) operate from -40 °C to +85 °C.
Typical applications include glue logic and bus bridging in industrial controllers, motor control pre-processing, legacy telecommunication interface cards, and educational/development platforms where the established MAX+PLUS II or Quartus design flows remain in use. The PQFP-144 package supports through-hole-friendly fine-pitch surface-mount assembly.
When designing with this device, note that the 2.5 V core requires careful decoupling, and configuration data must be reloaded at every power-up since the SRAM cells are volatile. For new designs, consider the Cyclone series for active lifecycle support; the ACEX 1K family has been EOL for many years.
Alternatives de remplacement direct pour EP1K50TI144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TI144-3 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TI144-2
✅ Remplacement direct✓ En stock
$27.85 / unité
Voir la fiche technique →EP1K50TI144-2N
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TI144-2X
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.2 / unité
Voir la fiche technique →EP1K50TI144-2Q
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$19.85 / unité
Voir la fiche technique →EP1K50TI144-1X
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.95 / unité
Voir la fiche technique →EP1K30TI144-3
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP1K30TI144-3N
✅ Remplacement direct✓ En stock
$21.8 / unité
Voir la fiche technique →EP1K50TI144-3F
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1K50TI144-3 Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Logic Elements (LEs) | 2,880 |
| Typical Gate Count | 50,000 |
| Configurable Logic Blocks (CLBs) | 360 |
| Embedded Array Blocks (EABs) | 72 |
| Embedded RAM Bits | 40,960 |
| Maximum User I/O Pins | 102 |
| Dedicated Input Pins | 6 |
| Speed Grade | -3 |
| Propagation Delay (typical) | 12.5 ns |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V (2.5 V nominal) |
| Operating Temperature (industrial) | -40 C to +85 C |
| Boîtier | 144-pin PQFP (TQFP, TI suffix) |
| Process Technology | 0.22 µm CMOS SRAM |
| Configuration Interface | JTAG (IEEE 1149.1) + serial/parallel |
Guide de configuration des broches du EP1K50TI144-3 144-pin pqfp (tqfp, ti suffix)
Configuration des broches du EP1K50TI144-3 (boîtier 144-pin pqfp (tqfp, ti suffix)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1K50TI144-3.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1K50TI144-3 convient pour 7 applications: Industrial Glue Logic and Bus Bridging, Motor Control Pre-Processing and Encoder Decoding, Legacy Telecommunication Interface Cards, Medical Imaging Front-End Signal Processing, Avionics and Military Databus Interfaces, Educational FPGA Development Platforms, Test and Measurement Instrumentation Backplanes.
Industrial Glue Logic and Bus Bridging
The EP1K50TI144-3 is well-suited to industrial glue-logic boards that must convert between legacy parallel buses (ISA, PC/104, VME) and modern microcontrollers. Its 102 user I/O pins can absorb wide address and data buses without external muxes, and the 2,880 logic elements provide ample capacity to implement multiple state machines, FIFO controllers, and interrupt glue in a single chip. With 12.5 ns propagation delay at -3 speed grade, the part comfortably meets 25 MHz bus cycle timing. Industrial PC/104 and VMEbus SBCs shipped in 2000-2008 frequently used ACEX 1K for this exact function.
Recommandé
Motor Control Pre-Processing and Encoder Decoding
In servo drive and stepper motor control boards, the EP1K50TI144-3 functions as a quadrature encoder decoder, PWM pre-processor, and Hall-sensor interface front-end. The 72 embedded array blocks (EABs) provide 40,960 bits of dual-port RAM for lookup tables (sine commutation profiles, trapezoidal profiles) accessible on the same clock that reads encoder feedback. The 6 dedicated input pins handle high-speed encoder A/B/Z channels, while 102 general I/O drive direction signals, brake outputs, and current-loop DAC interfaces. Its -40 C to +85 C industrial range suits factory-floor cabinets.
Recommandé
Legacy Telecommunication Interface Cards
T1/E1 line interface cards, ISDN PRI controllers, and serial-protocol grooming cards from the early 2000s deployed ACEX 1K FPGAs to handle HDLC framing, timeslot interleaving, and clock-recovery glue between framers and DSP processors. The EP1K50TI144-3's 40,960 bits of dual-port RAM provided elastic stores (bit-shift registers) for jitter absorption at 1.544/2.048 MHz, while the 102 I/O pins routed parallel TDM streams cleanly to multiple framers. Card vendors like Dialogic, NMS, and Natural MicroSystems used this family extensively.
Recommandé
Medical Imaging Front-End Signal Processing
Ultrasound beamformers and patient-monitor front-ends of the 2000s era used ACEX 1K FPGAs to implement FIR filters, decimators, and timing skew correction before handing data to DSP or CPU blocks. The EP1K50TI144-3's embedded array blocks were configured as coefficient ROMs for symmetric FIR filters, while general logic implemented timing-and-control state machines. Although not approved for new medical device designs, it remains in service for repair of existing FDA-cleared imaging carts where PCB redesign cost would exceed repair economics.
Recommandé
Avionics and Military Databus Interfaces
MIL-STD-1553, ARINC 429, and RS-422 databus interface cards for legacy avionics and ground-vehicle platforms used ACEX 1K FPGAs as Manchester encoders, bus monitors, and protocol bridges. The EP1K50TI144-3 with its industrial -40 C to +85 C range met many ground-vehicle and sheltered-aircraft environmental profiles. Its JTAG configuration chain allowed in-system firmware updates in the field. Defense logistics agencies continue to source this part through QML/QPL-certified distributors for sustainment of deployed platforms.
Recommandé
Educational FPGA Development Platforms
University digital-design courses and FPGA training labs used the EP1K50TI144-3 on Altera-developed UP2 and Nios development boards through the mid-2000s. Students learned state-machine design, bus interfacing, and pipelined datapath construction using MAX+PLUS II (the legacy Altera IDE that natively supports ACEX 1K). Hobbyists and professors maintaining these labs continue to source the EP1K50TI144-3 to repair and refurbish training boards, since modern Cyclone training kits require complete board replacement.
Recommandé
Test and Measurement Instrumentation Backplanes
Rack-mounted ATE (Automatic Test Equipment), data acquisition systems, and protocol analyzers used ACEX 1K FPGAs as timing-and-control sequencers that route stimulus and response signals between the DUT interface and the host CPU. The EP1K50TI144-3's 102 I/O pins allowed direct interfacing to 32-bit parallel stimulus buses plus handshaking, while the embedded RAM stored calibration constants and pattern sequences. Continued support of installed ATE bases in semiconductor fabs drives ongoing broker demand for this part.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TI144-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TI144-2 | EP1K50TI144-2N | EP1K50TI144-3F | EP1K30TI144-3 |
|---|---|---|---|---|---|
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 2,880 | 2,880 (same) | 2,880 (same) | 2,880 (same) | 1,728 (-40%) |
| Speed Grade | -3 (~12.5 ns) | -2 (~10 ns, faster) | -2 (~10 ns, faster) | -3 (~12.5 ns, same) | -3 (~12.5 ns, same) |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 (-40%) |
| Embedded RAM (bits) | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 (-40%) |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 (same package) |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
| Lifecycle Status | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) | Obsolete (EOL) |
Principaux différenciateurs
- Identical footprint across EP1K50 speed grades (vs EP1K50TI144-2)
- 40% more logic and RAM than EP1K30 family (vs EP1K30TI144-3)
- Established JTAG-based in-system programming (vs EOL FPGAs without JTAG)
Notes de conception
Estimated: VCCINT (2.5 V core) at 100 MHz operation draws approximately 100-150 mA quiescent plus dynamic current proportional to toggle rate. Add at least four 0.1 µF ceramic decoupling capacitors (one near each corner of the TQFP-144 footprint) plus one 10 µF tantalum bulk capacitor on the VCCINT plane. The VCCIO bank supply (2.5 V or 3.3 V depending on interface) should have its own 0.1 µF and bulk caps. Use a power-valid reset supervisor to hold nCONFIG low until both rails reach their minimum thresholds, preventing partial-configuration corruption of the SRAM cells.
Estimated: the TQFP-144 package has θJA of approximately 35 °C/W on a 4-layer JEDEC test board. With VCCINT at 2.5 V, 100 MHz internal logic, and 60% toggle rate on typical I/O, junction temperature rise over ambient is approximately 15-25 °C - well within the -40 °C to +85 °C industrial limit, but designers should verify against worst-case ambient (e.g., +70 °C sealed enclosure) when the FPGA is one of several heat sources on the board. No heatsink is required under normal industrial conditions.
The TQFP-144 fine-pitch (0.5 mm) gull-wing package requires careful PCB layout: 4 mil (0.1 mm) trace-and-space rules, micro-via fanout if using any inner signal layers, and a continuous ground plane on layer 2 directly under the device for return-path integrity. Route all 102 user I/O signals on inner signal layers first, keeping outer layers for power and a few critical high-speed signals. JTAG chain (TCK/TMS/TDO/TDI) signals must be length-matched within ±50 mils for reliable boundary-scan operation across the full industrial temperature range.
Critical pitfall: ACEX 1K SRAM configuration is volatile, so power must be stable and monotonic at every power-up or the device will fail to configure correctly - always validate VCCINT monotonicity with an oscilloscope before production release. Another pitfall: MAX+PLUS II is required (or legacy Quartus II support for ACEX 1K) for compilation; modern Quartus Prime versions do not support ACEX 1K, so the design team must retain a copy of MAX+PLUS II or use legacy Quartus II v13.0. Finally, do not mix ACEX 1K VCCIO bank voltages across banks unless you fully understand the I/O standard matrix - mixing 2.5 V and 3.3 V banks adjacent on the same PCB requires strict sequencing.
Place the EPC configuration PROM (typically EPC2LC20) within 2 inches of the EP1K50TI144-3 to keep passive-serial DCLK and DATA traces short and impedance-controlled. Use a 4.7 kΩ pull-up on nCONFIG and a 1 kΩ pull-up on nSTATUS to VCCINT. Reserve a 4-pin header for the JTAG chain (TCK/TMS/TDO/TDI plus GND) at the board perimeter so Altera USB-Blaster or ByteBlaster can attach for in-system programming without removing the device from its socket.
Informations de conformité
Compliance status not documented in retrieved sources. ACEX 1K family predates RoHS standardization; lead-free variants use 'N' suffix (e.g., EP1K50TI144-2N, EP1K50TI144-3N) and RoHS-compliant variants use 'F' suffix (e.g., EP1K50TI144-3F). Confirm with manufacturer documentation for each specific suffix variant.
