EP1SGX25DF1020C6L - 25K LE Stratix GX FPGA, 1020-BGA | Intel
Référence : EP1SGX25DF1020C6L ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1745 | $17 450,00 |
| 100 | $1640 | $164 000,00 |
| 250 | $1550 | $387 500,00 |
| 500 | $1485 | $742 500,00 |
EP1SGX25DF1020C6L Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device containing configurable logic blocks (LABs/CLBs), routing fabric, and dedicated hard IP that the designer can interconnect after manufacture to realize arbitrary digital functions. FPGAs sit between fixed-function ASICs and software-defined processors in the compute hierarchy, and the Stratix GX family specifically targets high-speed serial I/O, embedded processing, and parallel DSP. Within the broader taxonomy, an FPGA is a programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Synonyms include "field programmable gate array", "programmable logic device (PLD)", and "logic array".
Key features of the EP1SGX25DF1020C6L include 2,566 LABs/CLBs for fine-grained logic distribution, embedded multiplier blocks and DSP support, dedicated PLL clock-management blocks, 1.5 V core supply with separate VCCIO banks, and full JTAG boundary-scan / IEEE 1149.1 support. The "6" speed grade (-6) places this part in the mid-band of Stratix GX speed grades, balancing Fmax against power consumption. The "L" suffix indicates a lead-free, RoHS-compliant package finish.
Architecturally, the Stratix GX device combines a TriMatrix memory hierarchy (MRAM blocks of varied widths), a MultiTrack interconnect, and 20 SERDES channels with embedded 8B/10B encoding, byte serializer/deserializer, and pattern-detection logic. The 130 nm process node places this part in the legacy/established FPGA category; long-term production planning should be confirmed with Intel FPGA's product longevity program before committing to new designs.
Typical applications include multi-gigabit serial backplanes (XAUI, Serial RapidIO, PCI Express endpoint 1.0/2.0), telecom line cards, high-speed protocol bridging, DSP co-processing in software-defined radio (SDR), and custom network processor front-ends. The 1020-ball BGA also makes it suitable for high-density compute accelerator boards where ample logic and memory bandwidth are required.
When designing with this part, allocate generous PCB real-estate for the 33 x 33 mm BGA; the 1.0 mm ball pitch requires HDI PCB fabrication with microvias and tight DRC rules. Provide clean, low-noise power rails (1.5 V core plus dedicated VCCIO banks) and follow Intel's Stratix GX hardware-design guidelines for high-speed serial channel signal integrity.
This page synthesizes distributor pricing, drop-in same-package variants, and design considerations not found on the standalone manufacturer datasheet.
Alternatives de remplacement direct pour EP1SGX25DF1020C6L — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX25DF1020C6L (même facteur de forme et même empreinte) — différant par Operating Temperature, Speed Grade, Package Type, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX25DF1020C6ESL
✅ Remplacement direct✓ En stock
$1095 / unité
Voir la fiche technique →EP1SGX25DF1020C6ES
✅ Remplacement direct✓ En stock
$285 / unité
Voir la fiche technique →EP1SGX25DF1020C6BN
✅ Remplacement direct✓ En stock
$290 / unité
Voir la fiche technique →EP1SGX25DF1020C6B
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP1SGX25DF1020C6
✅ Remplacement direct✓ En stock
$289 / unité
Voir la fiche technique →EP1SGX25DF1020C5N
✅ Remplacement direct✓ En stock
$650 / unité
Voir la fiche technique →EP1SGX25DF1020C5ES
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP1SGX25DF1020C6L Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Elements | 25,660 |
| LABs / CLBs | 2,566 |
| User I/O Pins | 607 |
| Embedded RAM | 1,944,576 bits |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | 130 nm CMOS |
| Number of Transceivers | Up to 20 channels |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps |
| Boîtier | 1020-ball FC-FBGA, 33 x 33 mm, 1.0 mm pitch |
| Type de montage | Surface Mount |
| Operating Temperature (Junction) | 0 C to 85 C |
| Speed Grade | -6 (mid-band) |
| Lead-Free / RoHS | Yes (L suffix = lead-free) |
| Logic Family | CMOS |
Guide de configuration des broches du EP1SGX25DF1020C6L 1020-ball fc-fbga, 33 x 33 mm, 1.0 mm pitch
Configuration des broches du EP1SGX25DF1020C6L (boîtier 1020-ball fc-fbga, 33 x 33 mm, 1.0 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX25DF1020C6L.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX25DF1020C6L convient pour 6 applications: Gigabit Ethernet Backplane / XAUI Switch, Software-Defined Radio (SDR) Baseband Processing, PCI Express Endpoint / Add-In Card, Telecom Line Card Aggregation, High-Speed Protocol Bridging / Serial RapidIO, Custom Network Processor Front-End.
Gigabit Ethernet Backplane / XAUI Switch
The EP1SGX25DF1020C6L's 20 transceivers at up to 3.1875 Gbps make it ideal for 4-lane XAUI (3.125 Gbps per lane) and multi-port gigabit Ethernet backplane switching. With 25,660 logic elements the device implements MAC framing, PCS, and link-partner state machines. The 1,944,576 bits of embedded RAM buffer packets efficiently, while 607 user I/O pins carry GMII/RGMII sideband signals to PHY and switch ASICs.
Recommandé
Software-Defined Radio (SDR) Baseband Processing
Stratix GX DSP blocks and 20 multi-gigabit transceivers suit the EP1SGX25DF1020C6L for SDR baseband processors that digitize wideband IF signals. At 25,660 logic elements it runs FFT/iFFT, channelization, and modulation/demodulation in firmware, while transceivers interface to ADC/DAC JESD204B-style links or LVDS data buses. The 1.5 V core and 130 nm process keep the device within practical SDR chassis thermal envelopes.
Recommandé
PCI Express Endpoint / Add-In Card
The EP1SGX25DF1020C6L implements PCI Express x4 endpoints using its 3.1875 Gbps transceivers (PCIe 1.0/2.0 line rate). With 25,660 logic elements the device realizes the PCIe transaction layer, data link layer, and application logic on a single die, eliminating external bridge chips. The 1020-ball BGA provides 607 user I/O for local bus expansion, memory interfaces, and DMA control.
Recommandé
Telecom Line Card Aggregation
The EP1SGX25DF1020C6L aggregates multiple telecom framer/PHY links in central-office line cards, providing traffic management, QoS scheduling, and protocol conversion. 20 transceivers terminate 4-5 SFP/SFP+ optical modules simultaneously, while 25,660 logic elements implement forwarding tables and congestion-control algorithms. The 1,944,576 bits of RAM hold route lookups and packet descriptors.
Recommandé
High-Speed Protocol Bridging / Serial RapidIO
Multi-protocol bridging between Serial RapidIO, Aurora, custom LVDS, and gigabit serial is a classic Stratix GX use case for the EP1SGX25DF1020C6L. With 20 transceivers supporting 500 Mbps-3.1875 Gbps and 25,660 logic elements, the device translates packets between standards, encapsulates payloads, and recovers clock domains. The 1020-ball BGA supports ample I/O for parallel local-bus interfaces to companion ASICs.
Recommandé
Custom Network Processor Front-End
The EP1SGX25DF1020C6L serves as a programmable front-end for network processors, parsing packet headers, classifying flows, and pre-allocating buffer descriptors before they reach the NPU. At 25,660 logic elements the device handles multi-gigabit line-rate parsing, while 20 transceivers provide flexible 1G/2.5G link aggregation. Embedded RAM (1,944,576 bits) caches flow tables and TCAM lookups in real time.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX25DF1020C6L — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX25DF1020C6ESL | EP1SGX25DF1020C6ES | EP1SGX25DF1020C6BN | EP1SGX25DF1020C6B | EP1SGX25DF1020C6 | EP1SGX25DF1020C5N | EP1SGX25DF1020C5ES |
|---|---|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA (33 x 33 mm, 1.0 mm pitch) | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Speed Grade | -6 (mid) | -6 | -6 | -6 | -6 | -6 | -5 (faster) | -5 (faster) |
| User I/O Pins | 607 | 607 | 607 | 607 | 607 | 607 | 607 | 607 |
| Embedded RAM | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits | 1,944,576 bits |
| Lead-Free (RoHS) | Yes (L suffix) | Yes | Yes | Yes | Yes | No (leaded) | Yes | Yes |
| Transceiver Count | Up to 20 channels | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Approx. Unit Price (qty 1, as of 2026-09-07) | $1,850 USD | Similar / varies by listing | Similar / varies by listing | Similar / varies by listing | Similar / varies by listing | Similar / varies by listing | Higher (faster grade) | Higher (faster grade) |
Principaux différenciateurs
- Same-package alternative with engineering-sample/alternate finish (vs EP1SGX25DF1020C6ES)
- Drop-in upgrade to faster speed grade (-5 vs -6) (vs EP1SGX25DF1020C5N)
- Bitstream-identical alternative for inventory continuity (vs EP1SGX25DF1020C6ESL)
- Lead-free finish vs. leaded (non-RoHS) variant (vs EP1SGX25DF1020C6)
Notes de conception
Estimated: the 1020-ball BGA uses a 1.0 mm ball pitch on a 33 x 33 mm body. Routing this package requires HDI PCB fabrication with microvias-in-pad, 4-6 routing layers minimum, and laser-drilled vias. Plan at least 8 PCB layers for break-out: power planes, ground planes, signal layers, and dedicated high-speed serial layers. Allocate at least 6 square inches of continuous copper under the BGA thermal land for heat spreading. The Stratix GX datasheet hardware-design guidelines specify power-rail decoupling within 100 mils of every VCC pin.
The Stratix GX device requires multiple supply domains: 1.5 V core (VCCINT), VCCIO bank voltages (1.5 V/1.8 V/2.5 V/3.3 V selectable per bank), PLL analog supplies (VCCA_PLL, VCCD_PLL), and high-speed serial transceiver supplies (VCCA_TX, VCCA_RX at typically 2.5 V or 3.3 V). Use a multi-rail power-supply solution such as a multi-output PMIC or discrete LDO + switching converters, with each rail independently filtered. Per the Stratix GX power-design guide, decouple each rail with bulk + ceramic + ferrite combinations to manage switching transients when transceivers enable.
The 20 multi-gigabit transceivers at 3.1875 Gbps require controlled-impedance differential routing (typically 100 ohm differential, with AC-coupling capacitors on TX outputs). Estimated: route serial pairs with intra-pair skew below 1 ps per inch, and keep serial pairs at least 5x the dielectric thickness away from other signals. The Stratix GX hardware-design guidelines recommend reference-plane continuity under every serial pair, with ground stitching vias every 200 mils along the trace. Compliance with XAUI, PCIe, and Serial RapidIO specifications requires careful channel-loss budgeting, with insertion loss below 6 dB at the Nyquist frequency.
Estimated: a fully populated EP1SGX25DF1020C6L with 20 active transceivers at 3.1875 Gbps and 70-80% logic toggle rate dissipates approximately 8-12 W. Combined with the 1020-ball BGA's thermal resistance of approximately 0.4 C/W junction-to-case, the case-to-ambient thermal path becomes critical. A heat spreader or low-profile heatsink bonded to the BGA thermal land is recommended; without it, junction temperature can exceed 100 C in still air. The Stratix GX thermal-management document specifies airflow of 200 LFM minimum for high-utilization designs.
Common design pitfalls with the EP1SGX25DF1020C6L include: (1) failing to provide all VCCINT/VCCIO/VCCA decoupling capacitors within the manufacturer's placement guidelines, leading to power-rail ringing; (2) incorrectly biasing unused transceiver channels - leave TX pairs AC-terminated and RX inputs pulled to common-mode voltage per the pin-connection guidelines; (3) assuming the EP1SGX25DF1020C6L and EP1SGX25DF1020C6 are identical - they share the same die but the L suffix denotes lead-free finish (and possibly different solder-bump alloy), and leaded parts may not be acceptable for RoHS markets. Always generate fresh configuration bitstreams when migrating between speed grades (-5 vs -6 vs -7) since timing models differ.
Informations de conformité
RoHS compliant per the "L" suffix in the part number. Lead-free (Pb-free) finish confirmed. Halogen-free status not explicitly stated in available data; set to unknown. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified IC.
