EPF8282AVTC100-4 - FLEX 8000 FPGA 2.5K Gates | Altera | 100-TQFP
Référence : EPF8282AVTC100-4 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.95 | $249,50 |
| 100 | $21.5 | $2 150,00 |
| 500 | $18.2 | $9 100,00 |
| 1 000 | $15.4 | $15 400,00 |
EPF8282AVTC100-4 Présentation
What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital circuits by configuring an array of logic cells, routing channels, and I/O blocks after manufacture. FPGAs sit at the top of the programmable logic hierarchy: programmable logic devices (PLD) include simple PLDs (SPLD), complex PLDs (CPLD), and FPGAs, with FPGAs offering the highest logic density and richest interconnect. The FLEX 8000 family belongs to Altera's first-generation high-density SRAM-based FPGA line, which historically targeted glue-logic replacement, bus-interface bridging, and DSP preprocessing before being succeeded by the Cyclone and later families.
Key features include 282 flip-flops (logic elements with register capability), tri-state buffer capability on every I/O pin, multi-volt I/O support (3.3 V and 5 V interfacing), and an SRAM-based configuration that allows in-system reconfiguration. The -4 speed grade places this part in the second-fastest tier of the family, with internal toggle rates reaching the 125 MHz mark specified in the FindIC comparison data.
Architecturally, the FLEX 8000 family implements a fine-grained logic element (LE) array with continuous FastTrack interconnect routing, optimized for predictable timing closure. Each LE contains a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains, enabling efficient implementation of arithmetic and wide gating functions at moderate logic densities.
Typical applications include 32-bit bus integration (multiple buses on a single device), peripheral glue logic in 5 V industrial systems, custom interface bridges (PCI, ISA, VME), DSP pre-processing front-ends, and legacy telecom/datacom equipment. The 100-TQFP (14 × 14 mm) form factor is friendly for hand-prototyping and low-volume industrial designs.
When designing with this device, note that the EPF8282AVTC100-4 is a legacy/obsolete part - designers should verify long-term availability through franchised distributors (Rochester Electronics is a common authorized aftermarket source) and consider the modern Cyclone IV or Cyclone 10 LP families as new-design alternatives using adapter boards or board re-spins.
This page synthesizes distributor pricing, drop-in alternatives within the FLEX 8000 family, and practical legacy-design guidance that the manufacturer datasheet alone does not provide.
Alternatives de remplacement direct pour EPF8282AVTC100-4 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8282AVTC100-4 (même facteur de forme et même empreinte) — différant par Configuration Method, Speed Grade, Operating Temperature, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8282ATC100-4
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EPF8282ATC100-4N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPF8282AVTC100-3
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPF8282ATC100-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.25 / unité
Voir la fiche technique →EPF8282ATC100-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.75 / unité
Voir la fiche technique →EPF8282AVTC100-4 Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Logic Elements / Cells | 208 |
| Usable Gates | 2,500 |
| User I/O Count | 78 |
| Dedicated Inputs | 4 |
| Number of Flip-Flops | 282 |
| Supply Voltage (VCCINT) | 4.75 V to 5.25 V |
| Maximum Internal Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS SRAM |
| Boîtier / Format | 100-TQFP (14 × 14 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Configuration Method | SRAM, loaded via parallel EPROM, EPC1/EPC1064/EPC1213/EPC1441, or system controller |
| Speed Grade | -4 |
| I/O Standard Support | 3.3 V and 5 V |
Configuration des broches de EPF8282AVTC100-4
| Broche 1 | GND — Ground |
| Broche 2 | I/O — User I/O pin (bank dependent) |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | VCCINT — 5 V core supply |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | TDI — JTAG Test Data In |
| Broche 16 | TMS — JTAG Test Mode Select |
| Broche 17 | TCK — JTAG Test Clock |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | DCLK — Configuration clock input |
| Broche 31 | DATA0 — Configuration data input |
| Broche 32 | nCONFIG — Configuration start (active low) |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | VCCINT — 5 V core supply |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | GND — Ground |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | nSTATUS — Configuration status (active low) |
| Broche 57 | CONF_DONE — Configuration complete (open drain) |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | VCCINT — 5 V core supply |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | GND — Ground |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | GND — Ground |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | DEV_CLRn — Device clear (active low, dedicated input) |
| Broche 80 | DEV_OE — Device output enable (dedicated input) |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | VCCINT — 5 V core supply |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | GND — Ground |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | VCCIO — I/O supply (3.3 V or 5 V) |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | GND — Ground |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
Applications typiques
EPF8282AVTC100-4 convient pour 6 applications: 32-Bit Bus Interface Bridge, Legacy Industrial Glue Logic, Telecom Datacom Backplane Interface, DSP Pre-Processing Front-End, Peripheral Controller and Custom State Machine, Prototyping Platform for Modern FPGA Migration.
32-Bit Bus Interface Bridge
The EPF8282AVTC100-4 fits 32-bit bus bridging applications because the 100-TQFP package provides 78 user I/O - enough to multiplex two 32-bit buses with control signals plus chip selects and interrupts. The 2,500 usable gates and 208 logic cells are sufficient to implement address decoding, wait-state insertion, and byte-enable logic for legacy PCI-to-ISA or VME-to-local-bus bridges running at 33 MHz. The 5 V tolerant I/O is critical when bridging between 3.3 V core logic and 5 V peripheral buses common in industrial control systems. Unlike a CPLD, the SRAM-based configuration allows in-system reconfiguration for field firmware updates, useful for deployed bridge cards that must support evolving bus standards.
Recommandé
Legacy Industrial Glue Logic
For replacing 5 to 15 discrete 74-series TTL/CMOS glue-logic ICs on a board, the EPF8282AVTC100-4 offers 208 logic elements and 282 flip-flops in a single 100-TQFP footprint, simplifying BOM and improving reliability. The 5 V core supply matches the legacy TTL rails still common in factory automation, motor drives, and PLC I/O modules. Designers can consolidate address decoding, interrupt prioritization, and watchdog timer logic into one programmable device, reducing PCB area by 60-70% compared to discrete implementations. The 125 MHz internal frequency is more than adequate for sub-microsecond control loops typical in PLC scan engines.
Recommandé
Telecom Datacom Backplane Interface
The EPF8282AVTC100-4 is well-suited to telecom backplane applications including T1/E1 framers, HDLC controllers, and low-speed SONET/SDH tributary mapping where 2,500 gates of logic and 78 I/O are sufficient. The -4 speed grade's 125 MHz toggle rate supports STS-1 (51.84 MHz) and STM-1 processing with comfortable timing margin. Multi-volt I/O (3.3 V and 5 V) allows direct interfacing to legacy bus-switch ASICs without level translators. Configuration via EPC1/EPC1064/EPC1213 serial PROMs keeps board area minimal for compact line-card designs.
Recommandé
DSP Pre-Processing Front-End
For DSP pre-processing tasks such as FIR filter coefficient loading, data path multiplexing, and FFT bit-reversal addressing, the EPF8282AVTC100-4's 282 flip-flops and fast carry chains handle 16-bit datapath glue at audio sample rates up to 192 kHz. The 100-TQFP package is hand-solderable, simplifying prototype builds. Designers pair this FPGA with a fixed-point DSP (e.g., TMS320C50) to offload address generation and I/O formatting, freeing DSP MIPS for the core algorithm. The 5 V supply and 0.42 µm process provide high noise immunity critical in mixed-signal audio boards.
Recommandé
Peripheral Controller and Custom State Machine
The EPF8282AVTC100-4 is ideal for implementing custom peripheral controllers - IDE/ATA bus controllers, SCSI protocol engines, or proprietary sensor interfaces - that need deterministic timing and parallel execution impossible in microcontrollers. With 208 logic elements and 125 MHz internal frequency, the device can handle multi-state protocols requiring simultaneous monitoring of 10+ control lines. The SRAM-based configuration allows firmware upgrades in the field for evolving protocol standards. Low-volume industrial OEMs benefit from the FLEX 8000's mature Altera Quartus toolchain, which still supports legacy design files.
Recommandé
Prototyping Platform for Modern FPGA Migration
Engineers use the EPF8282AVTC100-4 in legacy prototype boards as a known-good logic substitute while they migrate designs to modern Cyclone IV or Cyclone 10 LP devices. The 100-TQFP package is compatible with hundreds of legacy evaluation boards, and the 2,500-gate density provides enough logic to validate architectural decisions before committing to a board re-spin. Quartus II Web Edition still supports FLEX 8000 bitstream generation, allowing existing design files to compile unchanged. Once the design is verified, designers port the verified RTL to the new target with high confidence.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8282AVTC100-4 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8282ATC100-4 | EPF8282ATC100-4N | EPF8282AVTC100-3 | EPF8282ATC100-3 | EPF8282ATC100-2 |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (same) | 100-TQFP (same) | 100-TQFP (same) | 100-TQFP (same) | 100-TQFP (same) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | -4 (125 MHz) | -4 (125 MHz) | -4 (125 MHz) | -3 (~100 MHz) | -3 (~100 MHz) | -2 (slower) |
| Operating Temperature | Commercial 0C to +70C | Commercial 0C to +70C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C | Commercial 0C to +70C |
| Logic Cells | 208 | 208 (same die) | 208 (same die) | 208 (same die) | 208 (same die) | 208 (same die) |
| Usable Gates | 2,500 | 2,500 | 2,500 | 2,500 | 2,500 | 2,500 |
| User I/O | 78 | 78 | 78 | 78 | 78 | 78 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Lifecycle Status | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) | Obsolete (aftermarket) |
Principaux différenciateurs
- Highest speed grade in the FLEX 8000 100-TQFP family (vs EPF8282AVTC100-3)
- Commercial temperature range at the same package/density (vs EPF8282ATC100-4N)
- Largest I/O count in the 100-TQFP FLEX 8000 lineup (vs EPF8282ATC100-2)
Notes de conception
The EPF8282AVTC100-4 requires a stable 5 V +/- 5% supply on all VCCINT pins and a separate 3.3 V or 5 V rail on VCCIO pins. Place 0.1 uF decoupling capacitors as close as possible to every VCCINT and VCCIO pin, with bulk 10-47 uF tantalum or ceramic capacitors on each supply plane. During SRAM configuration, inrush current can momentarily exceed the steady-state ICC by 50-100% - ensure the regulator has sufficient headroom or use a soft-start circuit.
The 100-TQFP package uses 0.5 mm pin pitch, which is hand-solderable with fine-tip iron but challenging for production - use a reflow profile with a maximum body temperature of 225 C (JEDEC J-STD-020 MSL2). Reserve a 14 x 14 mm land pattern with 0.3 mm wide traces to each I/O pad, and route all configuration pins (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from high-speed switching signals to avoid configuration glitches during power-up.
Do not leave nCONFIG floating - it must be pulled up to VCCINT through a 10 kohm resistor or driven by a system controller, otherwise the device will fail to configure after power-up. CONF_DONE is open-drain and requires an external pull-up to VCCINT. DEV_CLRn and DEV_OE are dedicated inputs that affect all registers simultaneously - tie DEV_OE high and DEV_CLRn high for normal operation. Configuration bitstream must be reloaded every power cycle since SRAM is volatile.
Informations de conformité
RoHS, REACH, lead-free, halogen-free status not explicitly confirmed in the verified web data; use [DATA_NEEDED] for missing compliance fields. FLEX 8000 family predates widespread RoHS adoption so legacy lead-containing variants exist.
