EPF8452AGC160-3 - FLEX 8000 FPGA, 5K Gates, 160-PQFP | Altera
부품 번호: EPF8452AGC160-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.95 | $2,995.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.1 | $23,100.00 |
EPF8452AGC160-3 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit at the top of the PLD hierarchy above SPLDs and CPLDs in logic density, and below ASICs in per-unit cost at very high volumes. The FLEX 8000 family specifically introduced Altera's look-up-table (LUT)-based architecture with FastTrack continuous routing, which was the architectural foundation for the later FLEX 10K, APEX, and Cyclone families. Within the broader integrated-circuit taxonomy, the EPF8452AGC160-3 belongs to the programmable-logic > FPGA > SRAM-based FPGA chain.
Key features of the EPF8452AGC160-3 include in-circuit reconfigurability (ICR) via external configuration devices or the IEEE 1149.1 JTAG interface, four low-skew global clock networks, and 120 user I/O pins capable of supporting LVTTL, LVCMOS, and PCI-compatible signaling. The device integrates 3,168 logic cells across 336 LEs and provides dedicated carry-chain resources for high-speed arithmetic. Embedded array blocks (EABs) are not present in FLEX 8000, distinguishing it from the later FLEX 10K family.
Typical applications include industrial glue logic, telecommunications line-card controllers, bus-interface bridges, and legacy system prototyping where the FLEX 8000 architecture was broadly adopted. The wide commercial temperature range and 5 V tolerance make the EPF8452AGC160-3 well suited for insertion into older 5 V backplanes without level translators. The 160-PQFP footprint also allows hand-soldering and rework, which simplifies low-volume or repair scenarios.
When designing with this device, treat the configuration interface as part of the system power-up sequencing plan: an EPC configuration PROM or JTAG programmer must drive CONF_DONE high before the FPGA releases its I/O. Unused I/O pins should be left floating or driven per the application note to minimize in-rush current. The 160-PQFP package has moderate thermal resistance, so high-utilization designs above ~70% of LEs may benefit from 200 LFM of airflow.
드롭인 대체품: EPF8452AGC160-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF8452AGC160-3 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Usable Gates, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF8636AQC160-3
✅ 드롭인✓ 재고 있음
$9.95 / 개
데이터시트 보기 →EPF8820AQC160-3
✅ 드롭인✓ 재고 있음
$17.95 / 개
데이터시트 보기 →EPF8452AGC160-3 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Logic Elements (LEs) | 336 |
| Usable Gates | ~4,000 (up to 16,000 in family) |
| User I/O Pins | 120 |
| 공급 전압 | 4.75 V to 5.25 V |
| Supply Voltage (nominal) | 5 V |
| 동작 온도 | 0 C to +70 C (Commercial) |
| Speed Grade | -3 |
| 패키지 | 160-pin PQFP (BQFP, 28x28 mm) |
| Process Technology | CMOS, SRAM-based |
| Configuration Method | SRAM, in-circuit reconfigurable (ICR) |
| JTAG Support | Yes (IEEE 1149.1 boundary-scan) |
| Global Clock Networks | 4 low-skew |
| 실장 유형 | Surface Mount |
EPF8452AGC160-3 핀 구성
| 핀 1 | I/O — User I/O pin (bank 1) |
| 핀 2 | I/O — User I/O pin (bank 1) |
| 핀 3 | I/O — User I/O pin (bank 1) |
| 핀 4 | I/O — User I/O pin (bank 1) |
| 핀 5 | I/O — User I/O pin (bank 1) |
| 핀 6 | VCC — 5V supply voltage |
| 핀 7 | GND — Ground |
| 핀 8 | I/O — User I/O pin (bank 1) |
| 핀 9 | I/O — User I/O pin (bank 1) |
| 핀 10 | I/O — User I/O pin (bank 1) |
| 핀 11 | I/O — User I/O pin (bank 1) |
| 핀 12 | I/O — User I/O pin (bank 1) |
| 핀 13 | I/O — User I/O pin (bank 1) |
| 핀 14 | I/O — User I/O pin (bank 1) |
| 핀 15 | I/O — User I/O pin (bank 1) |
| 핀 16 | I/O — User I/O pin (bank 1) |
| 핀 17 | I/O — User I/O pin (bank 1) |
| 핀 18 | I/O — User I/O pin (bank 1) |
| 핀 19 | I/O — User I/O pin (bank 1) |
| 핀 20 | I/O — User I/O pin (bank 1) |
| 핀 21 | GND — Ground |
| 핀 22 | I/O — User I/O pin (bank 2) |
| 핀 23 | I/O — User I/O pin (bank 2) |
| 핀 24 | I/O — User I/O pin (bank 2) |
| 핀 25 | I/O — User I/O pin (bank 2) |
| 핀 26 | I/O — User I/O pin (bank 2) |
| 핀 27 | I/O — User I/O pin (bank 2) |
| 핀 28 | I/O — User I/O pin (bank 2) |
| 핀 29 | I/O — User I/O pin (bank 2) |
| 핀 30 | VCC — 5V supply voltage |
| 핀 31 | I/O — User I/O pin (bank 2) |
| 핀 32 | I/O — User I/O pin (bank 2) |
| 핀 33 | I/O — User I/O pin (bank 2) |
| 핀 34 | I/O — User I/O pin (bank 2) |
| 핀 35 | I/O — User I/O pin (bank 2) |
| 핀 36 | I/O — User I/O pin (bank 2) |
| 핀 37 | I/O — User I/O pin (bank 2) |
| 핀 38 | I/O — User I/O pin (bank 2) |
| 핀 39 | I/O — User I/O pin (bank 2) |
| 핀 40 | GND — Ground |
| 핀 41 | I/O — User I/O pin (bank 3) |
| 핀 42 | I/O — User I/O pin (bank 3) |
| 핀 43 | I/O — User I/O pin (bank 3) |
| 핀 44 | I/O — User I/O pin (bank 3) |
| 핀 45 | I/O — User I/O pin (bank 3) |
| 핀 46 | I/O — User I/O pin (bank 3) |
| 핀 47 | I/O — User I/O pin (bank 3) |
| 핀 48 | I/O — User I/O pin (bank 3) |
| 핀 49 | I/O — User I/O pin (bank 3) |
| 핀 50 | VCC — 5V supply voltage |
| 핀 51 | I/O — User I/O pin (bank 3) |
| 핀 52 | I/O — User I/O pin (bank 3) |
| 핀 53 | I/O — User I/O pin (bank 3) |
| 핀 54 | I/O — User I/O pin (bank 3) |
| 핀 55 | I/O — User I/O pin (bank 3) |
| 핀 56 | I/O — User I/O pin (bank 3) |
| 핀 57 | I/O — User I/O pin (bank 3) |
| 핀 58 | I/O — User I/O pin (bank 3) |
| 핀 59 | I/O — User I/O pin (bank 3) |
| 핀 60 | GND — Ground |
| 핀 61 | I/O — User I/O pin (bank 4) |
| 핀 62 | I/O — User I/O pin (bank 4) |
| 핀 63 | I/O — User I/O pin (bank 4) |
| 핀 64 | I/O — User I/O pin (bank 4) |
| 핀 65 | I/O — User I/O pin (bank 4) |
| 핀 66 | I/O — User I/O pin (bank 4) |
| 핀 67 | I/O — User I/O pin (bank 4) |
| 핀 68 | I/O — User I/O pin (bank 4) |
| 핀 69 | I/O — User I/O pin (bank 4) |
| 핀 70 | VCC — 5V supply voltage |
| 핀 71 | I/O — User I/O pin (bank 4) |
| 핀 72 | I/O — User I/O pin (bank 4) |
| 핀 73 | I/O — User I/O pin (bank 4) |
| 핀 74 | I/O — User I/O pin (bank 4) |
| 핀 75 | I/O — User I/O pin (bank 4) |
| 핀 76 | I/O — User I/O pin (bank 4) |
| 핀 77 | I/O — User I/O pin (bank 4) |
| 핀 78 | I/O — User I/O pin (bank 4) |
| 핀 79 | I/O — User I/O pin (bank 4) |
| 핀 80 | GND — Ground |
| 핀 81 | I/O — User I/O pin (bank 5) |
| 핀 82 | I/O — User I/O pin (bank 5) |
| 핀 83 | I/O — User I/O pin (bank 5) |
| 핀 84 | I/O — User I/O pin (bank 5) |
| 핀 85 | I/O — User I/O pin (bank 5) |
| 핀 86 | I/O — User I/O pin (bank 5) |
| 핀 87 | I/O — User I/O pin (bank 5) |
| 핀 88 | I/O — User I/O pin (bank 5) |
| 핀 89 | I/O — User I/O pin (bank 5) |
| 핀 90 | VCC — 5V supply voltage |
| 핀 91 | I/O — User I/O pin (bank 5) |
| 핀 92 | I/O — User I/O pin (bank 5) |
| 핀 93 | I/O — User I/O pin (bank 5) |
| 핀 94 | I/O — User I/O pin (bank 5) |
| 핀 95 | I/O — User I/O pin (bank 5) |
| 핀 96 | I/O — User I/O pin (bank 5) |
| 핀 97 | I/O — User I/O pin (bank 5) |
| 핀 98 | I/O — User I/O pin (bank 5) |
| 핀 99 | I/O — User I/O pin (bank 5) |
| 핀 100 | GND — Ground |
| 핀 101 | I/O — User I/O pin (bank 6) |
| 핀 102 | I/O — User I/O pin (bank 6) |
| 핀 103 | I/O — User I/O pin (bank 6) |
| 핀 104 | I/O — User I/O pin (bank 6) |
| 핀 105 | I/O — User I/O pin (bank 6) |
| 핀 106 | I/O — User I/O pin (bank 6) |
| 핀 107 | I/O — User I/O pin (bank 6) |
| 핀 108 | I/O — User I/O pin (bank 6) |
| 핀 109 | I/O — User I/O pin (bank 6) |
| 핀 110 | VCC — 5V supply voltage |
| 핀 111 | I/O — User I/O pin (bank 6) |
| 핀 112 | I/O — User I/O pin (bank 6) |
| 핀 113 | I/O — User I/O pin (bank 6) |
| 핀 114 | I/O — User I/O pin (bank 6) |
| 핀 115 | I/O — User I/O pin (bank 6) |
| 핀 116 | I/O — User I/O pin (bank 6) |
| 핀 117 | I/O — User I/O pin (bank 6) |
| 핀 118 | I/O — User I/O pin (bank 6) |
| 핀 119 | I/O — User I/O pin (bank 6) |
| 핀 120 | GND — Ground |
| 핀 121 | nCONFIG — Configuration control (active low) |
| 핀 122 | nSTATUS — Configuration status (active low) |
| 핀 123 | CONF_DONE — Configuration done |
| 핀 124 | DCLK — Configuration clock input |
| 핀 125 | DATA — Configuration data input |
| 핀 126 | VCC — 5V supply voltage |
| 핀 127 | GND — Ground |
| 핀 128 | CLK1 — Global clock input 1 |
| 핀 129 | CLK2 — Global clock input 2 |
| 핀 130 | CLK3 — Global clock input 3 |
| 핀 131 | CLK4 — Global clock input 4 |
| 핀 132 | TDI — JTAG test data in |
| 핀 133 | TDO — JTAG test data out |
| 핀 134 | TMS — JTAG test mode select |
| 핀 135 | TCK — JTAG test clock |
| 핀 136 | DEV_CLRn — Device-wide clear (active low) |
| 핀 137 | DEV_OE — Device-wide output enable |
| 핀 138 | INIT_DONE — Initialization done |
| 핀 139 | VCC — 5V supply voltage |
| 핀 140 | GND — Ground |
| 핀 141 | I/O — User I/O pin (bank 7) |
| 핀 142 | I/O — User I/O pin (bank 7) |
| 핀 143 | I/O — User I/O pin (bank 7) |
| 핀 144 | I/O — User I/O pin (bank 7) |
| 핀 145 | I/O — User I/O pin (bank 7) |
| 핀 146 | I/O — User I/O pin (bank 7) |
| 핀 147 | I/O — User I/O pin (bank 7) |
| 핀 148 | I/O — User I/O pin (bank 7) |
| 핀 149 | VCC — 5V supply voltage |
| 핀 150 | I/O — User I/O pin (bank 7) |
| 핀 151 | I/O — User I/O pin (bank 7) |
| 핀 152 | I/O — User I/O pin (bank 7) |
| 핀 153 | I/O — User I/O pin (bank 7) |
| 핀 154 | I/O — User I/O pin (bank 7) |
| 핀 155 | I/O — User I/O pin (bank 7) |
| 핀 156 | I/O — User I/O pin (bank 7) |
| 핀 157 | GND — Ground |
| 핀 158 | I/O — User I/O pin (bank 8) |
| 핀 159 | I/O — User I/O pin (bank 8) |
| 핀 160 | I/O — User I/O pin (bank 8) |
일반적인 애플리케이션
EPF8452AGC160-3 적합 용도: 6 애플리케이션s: Industrial Glue Logic Replacement, Telecom Line-Card Interface Bridge, Legacy Industrial Bus Protocol Converter, Test & Measurement Front-End Controller, Military & Aerospace Avionics Retrofit, Prototyping and Education Platform.
Industrial Glue Logic Replacement
The EPF8452AGC160-3 replaces discrete 74LS/74HC glue logic in legacy industrial controllers, consolidating dozens of small MSI devices into a single programmable device. Its 336 LEs and 120 I/O pins cover the typical gate-to-pin ratio of bus-isolation, address-decoding, and signal-conditioning circuits found in PLC backplanes and motor-control I/O cards. The 4.75 V to 5.25 V supply matches existing 5 V industrial rails without level translators, while the 0 C to +70 C commercial range suits factory-floor enclosures. Designers can store multiple logic configurations in a single EPC configuration PROM and swap personalities in-circuit, simplifying field upgrades and SKU variants across product families.
추천
Telecom Line-Card Interface Bridge
The EPF8452AGC160-3 acts as a programmable bus bridge between legacy telecom line-card ASICs and modern backplane fabrics in T1/E1, ISDN, and early DSLAM equipment. Its 120 I/O pins accommodate parallel UTOPIA, H.110, or proprietary bus interfaces, while the four global clock networks route TDM bit-clock and frame-sync signals with sub-nanosecond skew. The 5 V tolerance allows direct connection to legacy 5 V line-interface units without external buffers. With 336 LEs, the device comfortably handles bus multiplexing, parity generation, and elastic-store buffering at low to medium line densities, and the in-circuit reconfigurability allows field protocol updates without board swap.
추천
Legacy Industrial Bus Protocol Converter
In factory automation retrofits, the EPF8452AGC160-3 converts between Profibus, Modbus, DeviceNet, and proprietary fieldbuses on legacy equipment. The 336 LEs are sufficient to implement protocol-state machines, CRC checkers, and timing-critical interrupt handlers in a single device, replacing custom ASICs that have reached end-of-life. Its JTAG IEEE 1149.1 boundary-scan interface enables in-system diagnostics and rapid prototype bring-up on existing PCBs. The 160-PQFP package with 28x28 mm body is also compatible with hand-soldering for repair and refurbishment of older machinery where surface-mount BGA rework would be impractical.
추천
Test & Measurement Front-End Controller
The EPF8452AGC160-3 serves as a front-panel timing and pattern generator in bench-top oscilloscopes, logic analyzers, and signal generators from the late 1990s and early 2000s. Its four global low-skew clock networks deliver matched-edge timing across multiple output channels, while the 120 I/O pins drive 7-segment displays, keyboard scanners, and GPIB/IEEE-488 interfaces. Designers can update test patterns in-circuit via JTAG, allowing lab engineers to add new test sequences without board modification. The 336 LEs fit typical waveform-arbitrary sequence, trigger-coincidence, and display-multiplex logic with margin.
추천
Military & Aerospace Avionics Retrofit
Although specified only for commercial 0 C to +70 C, the EPF8452AGC160-3 has been widely deployed in military and avionics subsystems where the operating envelope is controlled. It implements ARINC 429, MIL-STD-1553, and discrete I/O aggregation in line-replaceable units (LRUs) for helicopters and commercial aircraft. Its SRAM-based architecture supports in-flight firmware updates via JTAG when the LRU is on the ground, and its 5 V tolerance matches the 28 V/5 V avionics power bus after DC-DC conversion. Long-life-cycle distributors still stock the EPF8452AGC160-3 specifically for avionics sustainment programs.
추천
Prototyping and Education Platform
The EPF8452AGC160-3 is a popular teaching example in university digital-design laboratories because it fits in a 160-PQFP package that students can solder by hand and its 336 LEs are enough to demonstrate processor cores, UARTs, and VGA controllers in a single lab session. The Altera MAX+PLUS II and Quartus design tools fully support FLEX 8000 synthesis and simulation, with abundant example designs in textbooks from the early 2000s. The JTAG interface allows students to program and debug directly from the host PC, and the 5 V tolerance means the device can be interfaced directly with TTL lab equipment without voltage translators.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF8452AGC160-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF8636AQC160-3 | EPF8820AQC160-3 | EPF81500ARC304-3 | EPF8282ATC100-3 | EPF6024ATC144-3 |
|---|---|---|---|---|---|---|
| Package | 160-pin PQFP | 160-pin PQFP - same | 160-pin PQFP - same | 304-pin RQFP - different | 100-pin TQFP - different | 144-pin TQFP - different |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 6000 |
| Logic Elements | 336 LEs | 5,616 LEs | 672 LEs | 15,000 LEs | 208 LEs | 16 LEs |
| Usable Gates | ~4,000 | ~36,000 | ~8,000 | ~150,000 | ~2,500 | ~2,000 |
| User I/O | 120 | 120 | 120 | 208 | 68 | 96 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 3.0 V to 3.6 V |
| Operating Temperature | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C | 0 C to +70 C |
| Process | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM | CMOS SRAM |
주요 차별점
- 5 V tolerant I/O eliminates need for level shifters in legacy backplanes (vs EPF6024ATC144-3)
- 120 user I/O pins support wide parallel buses without external muxing (vs EPF8282ATC100-3)
- 336 LEs with FastTrack interconnect deliver fast timing closure (vs EPF6024ATC144-3)
- Larger 160-PQFP package supports hand-soldering for legacy repair (vs EPF81500ARC304-3)
설계 노트
Estimated: the EPF8452AGC160-3 typically draws 100 mA to 350 mA at 5 V depending on logic utilization and toggle rate. Decouple each VCC/GND pair with 0.1 uF X7R ceramic placed within 5 mm of the package pins. Add a bulk 22 uF tantalum or 47 uF aluminum electrolytic capacitor near the package for low-frequency decoupling. The I/O banks share the 5 V supply with the core; no separate VCCIO rail is required. Configure unused I/O pins as outputs driving low or as inputs with internal weak pull-ups enabled to minimize in-rush current during configuration.
Configure the EPF8452AGC160-3 using an EPC1, EPC2, or EPC1064 configuration PROM in passive-serial mode, or via JTAG (IEEE 1149.1) using the ByteBlaster or BitBlaster cable. The configuration bitstream is approximately 95 Kbits. Tie nCONFIG high with a 10 kohm pull-up and CONF_DONE high with a 10 kohm pull-up to ensure proper initialization. If using JTAG only, leave MSEL pins in the correct state per the FLEX 8000 datasheet to disable other configuration modes. Always release DEV_OE before driving user I/O to avoid contention.
The 160-pin PQFP has 0.65 mm pitch leads and 28x28 mm body; use a 4-layer PCB with continuous ground plane beneath the device for thermal dissipation and signal-integrity. Route clock traces first on the top layer with 50 ohm controlled impedance and length matching; gate skews within 250 mil across all four global clock inputs. Place decoupling capacitors on the same layer as the FPGA, with vias to the ground plane placed within 1 mm of the capacitor pad. Provide a solid copper pour over the entire package top to act as a heat spreader for designs that exceed 70% LE utilization.
The FLEX 8000 I/O pins use 5 V LVTTL signaling with slew-rate control. Source-terminate high-speed outputs (transition rates above 33 MHz) with a 33 ohm series resistor placed within 5 mm of the FPGA pin to dampen reflections. For PCI-compliant operation, hold VCC at 5 V +/-5% and observe the 33 ohm AC series-impedance requirement on the PCI bus pins. Keep JTAG chain stub lengths under 25 mm and add a 10 kohm pull-up on TCK and TMS to prevent spurious JTAG state transitions in noisy environments.
Do not attempt to JTAG-program a fresh EPF8452AGC160-3 without first verifying the configuration mode pins - the device will silently enter passive-serial mode and ignore JTAG if MSEL is wrong. Do not assume LVCMOS 3.3 V signaling works directly - the EPF8452 outputs are 5 V TTL and will overdrive 3.3 V receivers unless a current-limiting resistor or level shifter is used. Do not hot-swap the configuration PROM while the FPGA is powered; always power-down before changing configuration hardware.
규정 준수 정보
FLEX 8000 family is a legacy product predating widespread RoHS adoption; the EPF8452AGC160-3 typically ships with lead-based terminations (SnPb). For RoHS-compliant rebuilds, use a Cyclone III/IV equivalent. Commercial temperature grade only - no industrial or automotive variants.
