EP1K50TC144-1N - ACEX 1K FPGA, 50K Gates, 144-TQFP | Intel / Altera
Référence : EP1K50TC144-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.75 | $1 375,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.85 | $9 850,00 |
EP1K50TC144-1N Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the architectural density of a gate array with user-configurable interconnect and logic. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic arrays -> programmable semiconductors. The ACEX 1K family was engineered specifically for high-volume, cost-sensitive applications and combines embedded array blocks (EABs) for memory and specialized megafunctions with a logic array fabric optimized for general-purpose logic. This dual structure distinguishes ACEX 1K from pure CPLDs and from later Cyclone families.
Key features include a maximum operating frequency of 180 MHz, built-in IEEE 1149.1-compliant JTAG boundary-scan test (BST) circuitry, PCI Local Bus Specification Revision 2.2 compliance for 5.0V operation in the -1 speed grade, an enhanced embedded array for implementing megafunctions, and dual-port RAM support. The CMOS process and 2.5V core reduce power consumption relative to 5V and 3.3V predecessors while preserving adequate speed for glue logic, bus interface, and moderate-complexity DSP tasks.
Typical applications span low-cost system-on-a-programmable-chip designs, PCI bus bridges, communications infrastructure glue logic, industrial control and instrumentation, video/image processing front-ends, and DSP coprocessor interfacing. Designers leverage the embedded array blocks to instantiate memory, multipliers, and other megafunctions without consuming general logic resources, which preserves logic element count for state machines and datapath control.
When designing with this device, allocate I/O banks carefully because the 2.5V core requires careful level-shifting to interface with 3.3V and 5V peripherals. The TQFP-144 footprint supports hand-soldering and prototype rework but is not the highest-density option in the ACEX 1K line; designers targeting smaller board area should evaluate QFP-208 or BGA packages. Programming is supported by the legacy MAX+PLUS II toolchain as well as selected Quartus versions.
Alternatives de remplacement direct pour EP1K50TC144-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K50TC144-1N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Family, Speed Grade, Operating Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K50TC144-1
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K50TC144-2N
✅ Remplacement direct✓ En stock
$22.45 / unité
Voir la fiche technique →EP1K50TC144-3N
✅ Remplacement direct✓ En stock
$9.15 / unité
Voir la fiche technique →EP1K30TC144-1N
✅ Remplacement direct✓ En stock
$11.5 / unité
Voir la fiche technique →EP1K10TC144-1N
✅ Remplacement direct✓ En stock
$4.35 / unité
Voir la fiche technique →EP1C6TC144
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EP1K50TC144-1N Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Logic Elements | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Equivalent Gates | 199,000 |
| Embedded RAM | 40,960 bits |
| User I/Os | 102 |
| Maximum Operating Frequency | 180 MHz |
| Supply Voltage (Typical) | 2.5 V |
| Supply Voltage Range | 2.375 V to 2.625 V |
| Process Technology | CMOS |
| Boîtier | 144-pin TQFP |
| Type de montage | Surface Mount |
| JTAG Boundary-Scan | IEEE Std 1149.1-1990 compliant |
| PCI Compliance | PCI Local Bus Specification Rev 2.2 (5.0V, -1 speed grade) |
| Speed Grade | -1 |
| Statut RoHS | Compliant |
Configuration des broches de EP1K50TC144-1N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | VCCINT — Core supply voltage (2.5V typical) |
| Broche 9 | I/O — User I/O pin (bank 2) |
| Broche 10 | I/O — User I/O pin (bank 2) |
| Broche 11 | I/O — User I/O pin (bank 2) |
| Broche 12 | I/O — User I/O pin (bank 2) |
| Broche 13 | I/O — User I/O pin (bank 2) |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | VCCIO1 — I/O supply voltage bank 1 |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | I/O — User I/O pin (bank 2) |
| Broche 25 | I/O — User I/O pin (bank 2) |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 3) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | VCCIO3 — I/O supply voltage bank 3 |
| Broche 44 | I/O — User I/O pin (bank 3) |
| Broche 45 | I/O — User I/O pin (bank 3) |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | I/O — User I/O pin (bank 4) |
| Broche 65 | VCCIO4 — I/O supply voltage bank 4 |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | GND — Ground |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | I/O — User I/O pin (bank 4) |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | I/O — User I/O pin (bank 5) |
| Broche 86 | I/O — User I/O pin (bank 5) |
| Broche 87 | VCCINT — Core supply voltage (2.5V typical) |
| Broche 88 | I/O — User I/O pin (bank 5) |
| Broche 89 | I/O — User I/O pin (bank 5) |
| Broche 90 | I/O — User I/O pin (bank 5) |
| Broche 91 | I/O — User I/O pin (bank 5) |
| Broche 92 | I/O — User I/O pin (bank 5) |
| Broche 93 | I/O — User I/O pin (bank 5) |
| Broche 94 | I/O — User I/O pin (bank 5) |
| Broche 95 | I/O — User I/O pin (bank 5) |
| Broche 96 | I/O — User I/O pin (bank 5) |
| Broche 97 | I/O — User I/O pin (bank 5) |
| Broche 98 | VCCIO5 — I/O supply voltage bank 5 |
| Broche 99 | I/O — User I/O pin (bank 5) |
| Broche 100 | I/O — User I/O pin (bank 5) |
| Broche 101 | I/O — User I/O pin (bank 5) |
| Broche 102 | I/O — User I/O pin (bank 5) |
| Broche 103 | I/O — User I/O pin (bank 5) |
| Broche 104 | I/O — User I/O pin (bank 5) |
| Broche 105 | I/O — User I/O pin (bank 5) |
| Broche 106 | I/O — User I/O pin (bank 6) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (bank 6) |
| Broche 109 | I/O — User I/O pin (bank 6) |
| Broche 110 | I/O — User I/O pin (bank 6) |
| Broche 111 | I/O — User I/O pin (bank 6) |
| Broche 112 | I/O — User I/O pin (bank 6) |
| Broche 113 | I/O — User I/O pin (bank 6) |
| Broche 114 | VCCIO6 — I/O supply voltage bank 6 |
| Broche 115 | I/O — User I/O pin (bank 6) |
| Broche 116 | I/O — User I/O pin (bank 6) |
| Broche 117 | I/O — User I/O pin (bank 6) |
| Broche 118 | I/O — User I/O pin (bank 6) |
| Broche 119 | I/O — User I/O pin (bank 6) |
| Broche 120 | I/O — User I/O pin (bank 6) |
| Broche 121 | I/O — User I/O pin (bank 6) |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O pin (bank 6) |
| Broche 124 | I/O — User I/O pin (bank 6) |
| Broche 125 | TDI — JTAG Test Data In |
| Broche 126 | TMS — JTAG Test Mode Select |
| Broche 127 | TCK — JTAG Test Clock |
| Broche 128 | I/O — User I/O pin (bank 6) |
| Broche 129 | I/O — User I/O pin (bank 6) |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | VCCIO1 — I/O supply voltage bank 1 |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | I/O — User I/O pin (bank 1) |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | nCONFIG — Configuration control (active-low) |
| Broche 140 | nSTATUS — Configuration status (active-low) |
| Broche 141 | CONF_DONE — Configuration done indicator |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | TDO — JTAG Test Data Out |
Applications typiques
EP1K50TC144-1N convient pour 6 applications: Low-Cost System-on-a-Programmable-Chip (SOPC) Designs, PCI Bus Interface and Bridge, Industrial Control and Instrumentation, Communications Infrastructure Glue Logic, DSP Coprocessor and Front-End Pre-Processing, Video and Image Processing Front-Ends.
Low-Cost System-on-a-Programmable-Chip (SOPC) Designs
The EP1K50TC144-1N fits SOPC designs because its 2,880 logic elements and 40,960 bits of embedded dual-port RAM allow integration of a soft processor core plus glue logic on a single device. Designers typically instantiate the EAB-based memory blocks to hold firmware or data buffers while using the LAB fabric for peripherals and bus control, achieving a complete subsystem on one FPGA rather than partitioning across multiple chips.
Recommandé
PCI Bus Interface and Bridge
The EP1K50TC144-1N's -1 speed grade complies with PCI Local Bus Specification Revision 2.2 at 5.0V operation per the ACEX 1K datasheet. The 102 user I/Os in the TQFP-144 package provide adequate pins for a 32-bit PCI bus (32 data + control) plus side-band signals, while the 199K equivalent gates and 360 LABs accommodate protocol state machines, FIFOs, and bus-master DMA engines without external logic.
Recommandé
Industrial Control and Instrumentation
The EP1K50TC144-1N suits industrial control because its CMOS 2.5V core delivers low power dissipation and the TQFP-144 package is hand-solderable for prototype rework. The 102 I/Os are ample for parallel sensor arrays, encoder feedback, PWM outputs, and isolated communication links; meanwhile the embedded RAM and LAB fabric can host custom filtering, control loops, and Modbus or CAN soft-IP without external ASICs.
Recommandé
Communications Infrastructure Glue Logic
The EP1K50TC144-1N fits telecom and networking equipment as interface-bridging glue between legacy parallel buses, framing ASICs, and backplane transceivers. Its 180 MHz Fmax, embedded dual-port RAM, and 102 I/Os allow designers to integrate protocol converters, FIFO buffers, and timing-recovery state machines on a single 2.5V device, replacing multiple discrete PLDs and FIFOs while keeping power consumption low.
Recommandé
DSP Coprocessor and Front-End Pre-Processing
The EP1K50TC144-1N serves as a DSP coprocessor or pre-processing engine because its embedded array blocks can implement multipliers and dedicated datapath functions alongside general LAB logic. Designers use the 40,960 bits of dual-port RAM as data and coefficient storage while the 2,880 logic elements implement FIR filters, FFT butterflies, and control state machines that offload the host processor.
Recommandé
Video and Image Processing Front-Ends
The EP1K50TC144-1N can handle video and image front-end tasks such as line buffering, color-space conversion, and de-interlacing. Its 40,960 bits of embedded dual-port RAM serve as line buffers for CIF and SD-resolution video, while the 102 user I/Os accept parallel ITU-R BT.656 or RGB streams and drive downstream encoders; the 2.5V core and CMOS process keep dynamic power manageable in always-on pipelines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K50TC144-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K50TC144-1 | EP1K50TC144-2N | EP1K50TC144-3N | EP1K30TC144-1N | EP1K10TC144-1N | EP1C6TC144 |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 (-40%) | 576 (-80%) | 5,980 (+108%) |
| Embedded RAM | 40,960 bits | 40,960 bits | 40,960 bits | 40,960 bits | 24,576 bits | 12,288 bits | 92,160 bits |
| Speed Grade | -1 | -1 | -2 (faster) | -3 (slower) | -1 | -1 | Cyclone speed grade (different scale) |
| Core Voltage | 2.5V (2.375V to 2.625V) | 2.5V | 2.5V | 2.5V | 2.5V | 2.5V | 1.5V (different family) |
| User I/Os | 102 | 102 | 102 | 102 | 102 | 102 | 98 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete (Cyclone legacy) |
Principaux différenciateurs
- Balanced density and I/O count for cost-sensitive glue-logic designs (vs EP1K30TC144-1N)
- PCI Local Bus 2.2 compliance at 5.0V operation (vs EP1C6TC144 (Cyclone))
- Same-footprint migration path across speed grades (vs EP1K50TC144-2N)
- Higher embedded RAM density than smaller ACEX 1K siblings (vs EP1K10TC144-1N)
Notes de conception
The EP1K50TC144-1N requires separate VCCINT (2.5V core) and VCCIO bank supplies, with each I/O bank having its own VCCIO pin. Designers must provide at least 0.1 uF decoupling per supply pin plus bulk capacitance (typically 10-100 uF tantalum) near the device. Bank voltages may differ (e.g. 3.3V or 5.0V for PCI compliance in -1 grade) provided the bank's VCCIO matches the signaling standard; mixing voltages across banks allows mixed-voltage interfacing without external level shifters.
Route all differential pairs (PCI CLK, clock inputs) with 100 ohm controlled impedance and matched lengths within tolerance per the ACEX 1K family datasheet. Place the JTAG chain (TDI, TDO, TMS, TCK) so that all four signals reach the device with matched lengths and minimal stubs; add 10K pull-ups on nCONFIG and 10K pull-down on nSTATUS as recommended. Because the TQFP-144 has 0.5mm pitch, use 4-layer PCB with continuous ground plane for signal integrity and thermal dissipation.
Do not confuse the EP1K50TC144-1N speed grade -1 with the faster -2 grade when ordering - the part markings only differ in the suffix character. Also note that VCCINT is 2.5V only; supplying 3.3V will damage the device. Configuration data must be loaded via JTAG or an EPCS-compatible serial configuration device; do not leave MSEL pins floating - tie to the appropriate logic level for the chosen configuration mode.
Estimated: the TQFP-144 package has no exposed thermal pad, so all heat dissipation flows through the lead frame and PCB copper. For high-utilization designs (>70% logic element usage at 180 MHz), provide at least 2 square inches of copper pour on the top layer connected to GND, and use thermal vias to inner ground planes to reduce junction-to-ambient thermal resistance. Avoid operating the device above 100 MHz without adequate airflow in enclosed housings.
Informations de conformité
RoHS compliant per Altera/Intel product pages. Halogen-free status not explicitly stated in the verified data; mark as unknown. AEC-Q100 not applicable - this is an industrial/consumer FPGA. Conflict minerals compliance per Altera's regulatory disclosures.