EPM3256ATI144-10 - MAX 3000A 256-Macrocell 10ns CPLD | Intel
Référence : EPM3256ATI144-10 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
EPM3256ATI144-10 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between small discrete logic gates (74-series) and large FPGAs in the programmable logic hierarchy. It provides predictable timing, instant-on operation from on-chip EEPROM, and is well suited to glue logic, bus interface, and state-machine functions. The MAX 3000A family uses a classic MAX architecture with 16 Logic Array Blocks (LABs), each containing 16 macrocells interconnected by a programmable interconnect array (PIA).
Key features include 3.3V in-system programmability (ISP) compliant with IEEE Std. 1532, MultiVolt I/O supporting 1.8V/2.5V/3.3V/5.0V mixed-voltage interfacing, 5,000 typical usable gates, 116 user I/O pins, and a maximum toggle frequency of 95.2 MHz. The device operates from a single 3.0V to 3.6V supply with industrial temperature range of -40°C to +85°C. PCI-compatible I/O drive and programmable slew-rate control make it suitable for board-level bus applications.
The EPM3256ATI144-10 leverages EEPROM-based configuration cells for instant-on behavior with no external boot memory required, predictable deterministic routing delays that simplify static timing analysis, and JTAG-based IEEE 1149.1 boundary-scan support for board testability. Designers can target the part with the legacy Altera MAX+PLUS II or the modern Quartus II toolchain.
Typical applications include bus-interface bridges, address decoding and glue logic for legacy microcontrollers, peripheral controllers (UART, SPI, I2C bridges), industrial control boards, and PCI add-in card glue logic. Its instant-on, deterministic timing, and 116 I/O make it a versatile choice for medium-complexity logic consolidation.
When designing with this device, ensure JTAG chain integrity (TDI/TDO/TMS/TCK pull-ups per IEEE 1149.1), respect the 3.3V VCCINT tolerance, and use Quartus II 13.0 SP1 or MAX+PLUS II for legacy design flows. Note that new designs should generally migrate to MAX II or MAX V families.
This page synthesizes distributor availability, drop-in same-family alternatives, and practical design notes not consolidated on a single manufacturer page.
Alternatives de remplacement direct pour EPM3256ATI144-10 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3256ATI144-10 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Propagation Delay (tPD), RoHS Status, JTAG Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM3256ATC144-10N
✅ Remplacement direct✓ En stock
$14.5 / unité
Voir la fiche technique →EPM3256ATC144-10AA
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$11.6 / unité
Voir la fiche technique →EPM3256ATC144-10
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPM3256ATC144-7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.2 / unité
Voir la fiche technique →EPM3256ATC144-7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.06 / unité
Voir la fiche technique →EPM3128ATI144-10N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.32 / unité
Voir la fiche technique →EPM3256ATI144-10 Valeurs maximales et caractéristiques électriques
| Series | MAX 3000A |
| Programmable Type | In-System Programmable (ISP), EEPROM-based |
| Number of Macrocells | 256 |
| Number of Logic Elements / Blocks | 16 LABs (Logic Array Blocks) |
| Number of Gates | 5,000 typical usable gates |
| Number of User I/O | 116 |
| Propagation Delay (tpd max) | 10 ns |
| Maximum Frequency (fmax) | 95.2 MHz |
| Supply Voltage (VCCINT) | 3.0 V to 3.6 V (3.3 V nominal) |
| I/O Voltage Support | MultiVolt: 1.8 V / 2.5 V / 3.3 V / 5.0 V mixed |
| Logic Family | CMOS, EEPROM-based |
| Température de fonctionnement | -40°C to +85°C (industrial) |
| Boîtier | 144-pin TQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Programming Interface | JTAG (IEEE 1149.1) and IEEE Std. 1532 ISP |
| Compliance | IEEE Std. 1532 ISP, PCI-compatible I/O |
| Statut du cycle de vie | Obsolete (per HighqualityPCB listing) |
Configuration des broches de EPM3256ATI144-10
| Broche 1 | I/O — User I/O pin (Bank 1) |
| Broche 2 | I/O — User I/O pin (Bank 1) |
| Broche 3 | I/O — User I/O pin (Bank 1) |
| Broche 4 | I/O — User I/O pin (Bank 1) |
| Broche 5 | I/O — User I/O pin (Bank 1) |
| Broche 6 | I/O — User I/O pin (Bank 1) |
| Broche 7 | I/O — User I/O pin (Bank 1) |
| Broche 8 | I/O — User I/O pin (Bank 1) |
| Broche 9 | I/O — User I/O pin (Bank 1) |
| Broche 10 | I/O — User I/O pin (Bank 1) |
| Broche 11 | I/O — User I/O pin (Bank 1) |
| Broche 12 | I/O — User I/O pin (Bank 1) |
| Broche 13 | I/O — User I/O pin (Bank 2) |
| Broche 14 | I/O — User I/O pin (Bank 2) |
| Broche 15 | I/O — User I/O pin (Bank 2) |
| Broche 16 | I/O — User I/O pin (Bank 2) |
| Broche 17 | I/O — User I/O pin (Bank 2) |
| Broche 18 | I/O — User I/O pin (Bank 2) |
| Broche 19 | I/O — User I/O pin (Bank 2) |
| Broche 20 | I/O — User I/O pin (Bank 2) |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin (Bank 2) |
| Broche 23 | I/O — User I/O pin (Bank 2) |
| Broche 24 | I/O — User I/O pin (Bank 2) |
| Broche 25 | I/O — User I/O pin (Bank 2) |
| Broche 26 | I/O — User I/O pin (Bank 2) |
| Broche 27 | I/O — User I/O pin (Bank 2) |
| Broche 28 | I/O — User I/O pin (Bank 2) |
| Broche 29 | I/O — User I/O pin (Bank 2) |
| Broche 30 | I/O — User I/O pin (Bank 2) |
| Broche 31 | GND — Ground |
| Broche 32 | I/O — User I/O pin (Bank 2) |
| Broche 33 | I/O — User I/O pin (Bank 3) |
| Broche 34 | I/O — User I/O pin (Bank 3) |
| Broche 35 | I/O — User I/O pin (Bank 3) |
| Broche 36 | I/O — User I/O pin (Bank 3) |
| Broche 37 | I/O — User I/O pin (Bank 3) |
| Broche 38 | I/O — User I/O pin (Bank 3) |
| Broche 39 | I/O — User I/O pin (Bank 3) |
| Broche 40 | I/O — User I/O pin (Bank 3) |
| Broche 41 | I/O — User I/O pin (Bank 3) |
| Broche 42 | I/O — User I/O pin (Bank 3) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O pin (Bank 3) |
| Broche 45 | I/O — User I/O pin (Bank 3) |
| Broche 46 | I/O — User I/O pin (Bank 3) |
| Broche 47 | I/O — User I/O pin (Bank 3) |
| Broche 48 | I/O — User I/O pin (Bank 3) |
| Broche 49 | I/O — User I/O pin (Bank 3) |
| Broche 50 | I/O — User I/O pin (Bank 3) |
| Broche 51 | I/O — User I/O pin (Bank 3) |
| Broche 52 | I/O — User I/O pin (Bank 3) |
| Broche 53 | I/O — User I/O pin (Bank 3) |
| Broche 54 | I/O — User I/O pin (Bank 3) |
| Broche 55 | I/O — User I/O pin (Bank 4) |
| Broche 56 | I/O — User I/O pin (Bank 4) |
| Broche 57 | I/O — User I/O pin (Bank 4) |
| Broche 58 | I/O — User I/O pin (Bank 4) |
| Broche 59 | I/O — User I/O pin (Bank 4) |
| Broche 60 | I/O — User I/O pin (Bank 4) |
| Broche 61 | GND — Ground |
| Broche 62 | I/O — User I/O pin (Bank 4) |
| Broche 63 | I/O — User I/O pin (Bank 4) |
| Broche 64 | I/O — User I/O pin (Bank 4) |
| Broche 65 | I/O — User I/O pin (Bank 4) |
| Broche 66 | I/O — User I/O pin (Bank 4) |
| Broche 67 | I/O — User I/O pin (Bank 4) |
| Broche 68 | I/O — User I/O pin (Bank 4) |
| Broche 69 | I/O — User I/O pin (Bank 4) |
| Broche 70 | I/O — User I/O pin (Bank 4) |
| Broche 71 | I/O — User I/O pin (Bank 4) |
| Broche 72 | I/O — User I/O pin (Bank 4) |
| Broche 73 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche 74 | TMS — JTAG Test Mode Select |
| Broche 75 | TCK — JTAG Test Clock |
| Broche 76 | GND — Ground |
| Broche 77 | VCCINT — Core supply 3.3 V (3.0-3.6 V) |
| Broche 78 | I/O — User I/O pin (Bank 4) |
| Broche 79 | I/O — User I/O pin (Bank 4) |
| Broche 80 | I/O — User I/O pin (Bank 4) |
| Broche 81 | I/O — User I/O pin (Bank 4) |
| Broche 82 | I/O — User I/O pin (Bank 1) |
| Broche 83 | I/O — User I/O pin (Bank 1) |
| Broche 84 | I/O — User I/O pin (Bank 1) |
| Broche 85 | I/O — User I/O pin (Bank 1) |
| Broche 86 | I/O — User I/O pin (Bank 1) |
| Broche 87 | I/O — User I/O pin (Bank 1) |
| Broche 88 | I/O — User I/O pin (Bank 1) |
| Broche 89 | I/O — User I/O pin (Bank 1) |
| Broche 90 | I/O — User I/O pin (Bank 1) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O pin (Bank 1) |
| Broche 93 | I/O — User I/O pin (Bank 1) |
| Broche 94 | I/O — User I/O pin (Bank 1) |
| Broche 95 | I/O — User I/O pin (Bank 1) |
| Broche 96 | I/O — User I/O pin (Bank 1) |
| Broche 97 | I/O — User I/O pin (Bank 1) |
| Broche 98 | I/O — User I/O pin (Bank 1) |
| Broche 99 | I/O — User I/O pin (Bank 1) |
| Broche 100 | I/O — User I/O pin (Bank 1) |
| Broche 101 | I/O — User I/O pin (Bank 1) |
| Broche 102 | I/O — User I/O pin (Bank 2) |
| Broche 103 | I/O — User I/O pin (Bank 2) |
| Broche 104 | I/O — User I/O pin (Bank 2) |
| Broche 105 | I/O — User I/O pin (Bank 2) |
| Broche 106 | I/O — User I/O pin (Bank 2) |
| Broche 107 | GND — Ground |
| Broche 108 | I/O — User I/O pin (Bank 2) |
| Broche 109 | I/O — User I/O pin (Bank 2) |
| Broche 110 | I/O — User I/O pin (Bank 2) |
| Broche 111 | I/O — User I/O pin (Bank 2) |
| Broche 112 | I/O — User I/O pin (Bank 2) |
| Broche 113 | I/O — User I/O pin (Bank 2) |
| Broche 114 | I/O — User I/O pin (Bank 2) |
| Broche 115 | I/O — User I/O pin (Bank 3) |
| Broche 116 | I/O — User I/O pin (Bank 3) |
| Broche 117 | I/O — User I/O pin (Bank 3) |
| Broche 118 | I/O — User I/O pin (Bank 3) |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O pin (Bank 3) |
| Broche 121 | I/O — User I/O pin (Bank 3) |
| Broche 122 | I/O — User I/O pin (Bank 3) |
| Broche 123 | I/O — User I/O pin (Bank 3) |
| Broche 124 | I/O — User I/O pin (Bank 3) |
| Broche 125 | I/O — User I/O pin (Bank 3) |
| Broche 126 | I/O — User I/O pin (Bank 3) |
| Broche 127 | I/O — User I/O pin (Bank 4) |
| Broche 128 | I/O — User I/O pin (Bank 4) |
| Broche 129 | I/O — User I/O pin (Bank 4) |
| Broche 130 | I/O — User I/O pin (Bank 4) |
| Broche 131 | I/O — User I/O pin (Bank 4) |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O pin (Bank 4) |
| Broche 134 | I/O — User I/O pin (Bank 4) |
| Broche 135 | VCCIO — I/O bank supply voltage |
| Broche 136 | VCCIO — I/O bank supply voltage |
| Broche 137 | VCCINT — Core supply 3.3 V |
| Broche 138 | TDO — JTAG Test Data Out |
| Broche 139 | GND — Ground |
| Broche 140 | I/O — User I/O pin (Bank 4) |
| Broche 141 | I/O — User I/O pin (Bank 4) |
| Broche 142 | I/O — User I/O pin (Bank 4) |
| Broche 143 | I/O — User I/O pin (Bank 4) |
| Broche 144 | I/O — User I/O pin (Bank 4) |
Applications typiques
EPM3256ATI144-10 convient pour 6 applications: Microcontroller Bus-Interface Glue Logic, Address Decoding and Chip-Select Generation, Peripheral Controllers (UART/SPI/I2C Bridges), State Machine and Sequencer Controllers, PCI Add-in Card Auxiliary Logic, Legacy System Sustainment and Last-Time-Buy.
Microcontroller Bus-Interface Glue Logic
The EPM3256ATI144-10 fits microcontroller bus-interface bridge designs where 256 macrocells and 116 user I/Os are needed to consolidate scattered 74-series logic into a single non-volatile device. With 10 ns tpd and 95.2 MHz fmax it comfortably bridges 33 MHz address/data buses. Its instant-on EEPROM eliminates FPGA boot delays on power-up, ensuring deterministic bus arbitration at reset. Pin count supports wide 32-bit data plus 24-bit address plus control signal decoding on a single device.
Recommandé
Address Decoding and Chip-Select Generation
The 256 macrocells of the EPM3256ATI144-10 support wide address decoding trees for memory-mapped systems with up to 32-bit address buses, generating dozens of chip-select signals with predictable combinational delay. MultiVolt I/O (1.8/2.5/3.3/5.0 V) lets a single CPLD interface modern 1.8 V memory controllers and legacy 5 V peripherals without external level shifters. JTAG ISP allows last-minute CS map updates during board bring-up.
Recommandé
Peripheral Controllers (UART/SPI/I2C Bridges)
Industrial control boards use the EPM3256ATI144-10 to implement multi-channel UART, SPI, and I2C controllers with hardware state machines rather than firmware bit-banging. The 116 user I/Os support up to a dozen full-duplex serial channels, and the deterministic 10 ns tpd simplifies worst-case latency analysis. Industrial -40 to +85°C operation suits factory floor equipment. JTAG boundary-scan plus ISP simplifies field firmware upgrades via the IEEE Std. 1532 flow.
Recommandé
State Machine and Sequencer Controllers
The MAX 3000A architecture is optimized for finite state machines (FSMs) and sequencers, making the EPM3256ATI144-10 ideal for motor-control sequencers, instrumentation state machines, and protocol sequencers. Each of the 256 macrocells holds a registered state bit, supporting FSMs with up to 32 states without logic splitting. EEPROM configuration guarantees deterministic startup, critical for safety sequencing where FPGA boot is unacceptable.
Recommandé
PCI Add-in Card Auxiliary Logic
The PCI-compatible I/O drivers and 3.3V/5V-tolerant MultiVolt interface make the EPM3256ATI144-10 a traditional choice for legacy PCI add-in cards requiring auxiliary glue logic, EEPROM emulation, or local bus decoding. The 116 I/Os accommodate PCI 32-bit data/address plus auxiliary GPIO. Industrial temperature supports outdoor PCI instrumentation. Designers should pair with PCI bridge ASICs and verify against PCI Local Bus Specification 2.2 timing.
Recommandé
Legacy System Sustainment and Last-Time-Buy
Many industrial and aerospace programs continue to use the EPM3256ATI144-10 in long-lifecycle systems (factory controllers, medical instrumentation, military-grade boards) where redesign is cost-prohibitive. The industrial -40 to +85°C range and EEPROM-based non-volatile configuration suit 15 to 20 year field deployments. Sustainment teams should secure last-time-buy inventory, identify pin-compatible MAX 3000A variants (EPM3256ATC144-10N) for cross-stock, and qualify modern MAX II replacements where PCB rework is feasible.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3256ATI144-10 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM3256ATC144-10N | EPM3256ATC144-10AA | EPM3256ATC144-10 | EPM3256ATC144-7N | EPM3128ATI144-10N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-TQFP (20x20 mm) | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same | 144-TQFP (20x20 mm) - same |
| Number of Macrocells | 256 | 256 | 256 | 256 | 256 | 128 (-50%) |
| Propagation Delay (tpd max) | 10 ns | 10 ns | 10 ns | 10 ns | 7.5 ns (faster) | 10 ns |
| Operating Temperature | -40°C to +85°C (industrial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | 0°C to +70°C (commercial) | -40°C to +85°C (industrial) |
| User I/Os | 116 | 116 | 116 | 116 | 116 | 96 |
| VCCINT Supply | 3.0 to 3.6 V (3.3 V nom) | 3.0 to 3.6 V | 3.0 to 3.6 V | 3.0 to 3.6 V | 3.0 to 3.6 V | 3.0 to 3.6 V |
| Series | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A | MAX 3000A |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature range (-40°C to +85°C) (vs EPM3256ATC144-10N)
- Highest macrocell count in the 144-TQFP MAX 3000A family (vs EPM3128ATI144-10N)
- 10 ns propagation delay with full I/O count (vs EPM3256ATC144-7N)
Notes de conception
The EPM3256ATI144-10 operates from a single 3.3 V VCCINT supply (3.0 to 3.6 V). Decouple VCCINT and each VCCIO bank with 0.1 µF ceramic capacitors placed within 5 mm of each supply pin, plus a bulk 10 µF tantalum per bank. MultiVolt I/O banks must each have their own VCCIO rail (1.8/2.5/3.3/5.0 V) — do not tie VCCIO banks together if your design uses mixed voltages. IccINT during ISP programming is approximately 50% higher than in user mode; ensure regulator headroom.
The 144-TQFP (20x20 mm) has 0.5 mm pitch leads — use 0.15 mm trace/space design rules with 0.25 mm via drill minimum. Provide a solid ground pour under the device for thermal spreading and signal-integrity. Place JTAG header or test points for TDI/TDO/TMS/TCK near the board edge to simplify ISP programming and boundary-scan test. Add 10 kΩ pull-ups on TDI, TMS, and TCK per IEEE 1149.1 to keep the JTAG TAP controller in known state at power-up.
Do not use I/O pins before JTAG programming finishes — leaving pins floating during ISP can cause bus contention. For unused I/O pins, configure them as outputs driving low (not high-Z) in the Quartus II pin assignment. Do not exceed 24 mA sink current per I/O (per the MAX 3000A datasheet recommendation). For new designs, migrate to MAX II (EPM240T144C5N) or MAX V (5M240ZT100C5N) families — they offer more logic density, lower power, and active production status.
Informations de conformité
Compliance information not present in verified web data. EPM3256ATI144-10 is an obsolete CPLD; RoHS status for this specific part was not found in DigiKey/Mouser/Octopart listings. Check Intel/legacy Altera documentation for original compliance declarations.
