EPM3256ATI144-10N - MAX 3000A CPLD, 256 Macro, 144-TQFP | Altera
Référence : EPM3256ATI144-10N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $16.4 | $164,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $11.8 | $5 900,00 |
| 1 000 | $10.25 | $10 250,00 |
EPM3256ATI144-10N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays with a central interconnect matrix, occupying the architectural niche between small SPLDs and high-density FPGAs. CPLDs are characterized by deterministic timing, instant-on EEPROM configuration, and superior glue-logic integration for bus decoding, state-machine encoding, and peripheral interfacing. Within the broader programmable logic taxonomy, the EPM3256 sits at: programmable logic device -> CPLD -> MAX 3000A family -> low-density, EEPROM-based, 3.3 V segment.
Key features include 3.3 V in-system programmability (ISP) compliant with IEEE Std. 1532, IEEE Std. 1149.1 JTAG boundary-scan test with advanced pin-locking, and 100% TTL emulation. The JTAG-based ISP allows field upgrades without removing the device from the board, while the boundary-scan chain supports structural test in compliance with IEEE 1149.1. The 144-pin TQFP package has a 22 mm x 22 mm body with a 0.5 mm lead pitch for standard SMT assembly lines.
The MAX 3000A architecture supports efficient integration of SSI, MSI, and LSI logic functions, replacing multiple PALs, GALs, and 22V10-style devices with a single chip. Each macrocell contains a programmable AND/OR array with a configurable flip-flop, supporting combinatorial or registered logic with product-term sharing. The non-volatile EEPROM configuration cell means zero configuration time at power-up, a critical advantage over SRAM-based FPGAs in deterministic boot applications.
Typical applications include bus-interface bridging (e.g., 8-bit MCU to 32-bit peripheral decode), peripheral chip-select generation, state-machine controllers for industrial automation, I/O expansion for legacy MCUs, address decoding in telecom backplane designs, and glue-logic replacement in PC/104, VME, and CompactPCI systems. The 116 available user I/Os (of 144 pins) provide ample headroom for wide bus interfaces and parallel control channels.
A key design consideration when using the EPM3256ATI144-10N is that the "I" suffix denotes the industrial operating-temperature grade (-40 C to +85 C junction, with commercial-spec parts typically 0 C to +70 C per the available distributor listings), while the "N" suffix denotes lead-free / Pb-free termination. Designers migrating from earlier MAX 3000 (non-A) devices should re-validate timing paths because the MAX 3000A family added multi-voltage I/O and improved ISP timing.
This page synthesizes verified distributor pricing, same-package drop-in alternatives, and practical design notes not consolidated in the Altera datasheet alone, helping engineers shortlist a replacement and design-in the part with confidence.
Alternatives de remplacement direct pour EPM3256ATI144-10N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM3256ATI144-10N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Propagation Delay (tPD), RoHS Status, I/O Voltage Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM3256ATI144-10
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EPM3256ATC144-10N
✅ Remplacement direct✓ En stock
$14.5 / unité
Voir la fiche technique →EPM3256ATC144-10
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPM3256ATC144-10AA
✅ Remplacement direct✓ En stock
$11.6 / unité
Voir la fiche technique →EPM3256ATC144-7N
✅ Remplacement direct✓ En stock
$17.2 / unité
Voir la fiche technique →EPM3256ATI144-10N Valeurs maximales et caractéristiques électriques
| Family | MAX 3000A |
| Device Type | CPLD - Complex Programmable Logic Device |
| Macrocells | 256 |
| Usable Gates | 5,000 |
| User I/Os | 116 |
| Logic Blocks / Logic Elements | 16 |
| Propagation Delay (tPD) | 10 ns |
| Max Frequency (fMAX) | 95.2 MHz |
| Supply Voltage - Core | 3.3 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (multi-voltage) |
| In-System Programmability | Yes, IEEE Std. 1532 compliant |
| Boundary-Scan Test (BST) | Yes, IEEE Std. 1149.1 (JTAG) |
| Boîtier | 144-pin TQFP |
| Température de fonctionnement | -40 C to +85 C (industrial, "I" suffix) |
| Lead-Free / Pb-Free | Yes ("N" suffix) |
| Statut RoHS | Compliant |
| Process Technology | CMOS EEPROM-based, non-volatile |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020, typical for TQFP) |
Configuration des broches de EPM3256ATI144-10N
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | I/O — User I/O - bank 1 |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | I/O — User I/O - bank 1 |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O - bank 1 |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | I/O — User I/O - bank 1 |
| Broche 16 | I/O — User I/O - bank 1 |
| Broche 17 | I/O — User I/O - bank 1 |
| Broche 18 | I/O — User I/O - bank 1 |
| Broche 19 | I/O — User I/O - bank 1 |
| Broche 20 | I/O — User I/O - bank 1 |
| Broche 21 | I/O — User I/O - bank 1 |
| Broche 22 | GND — Ground |
| Broche 23 | VCCINT — Core supply voltage (3.3 V) |
| Broche 24 | I/O — User I/O - bank 1 |
| Broche 25 | I/O — User I/O - bank 1 |
| Broche 26 | I/O — User I/O - bank 1 |
| Broche 27 | I/O — User I/O - bank 1 |
| Broche 28 | I/O — User I/O - bank 1 |
| Broche 29 | I/O — User I/O - bank 1 |
| Broche 30 | I/O — User I/O - bank 1 |
| Broche 31 | I/O — User I/O - bank 1 |
| Broche 32 | I/O — User I/O - bank 1 |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O - bank 2 |
| Broche 35 | I/O — User I/O - bank 2 |
| Broche 36 | I/O — User I/O - bank 2 |
| Broche 37 | I/O — User I/O - bank 2 |
| Broche 38 | I/O — User I/O - bank 2 |
| Broche 39 | I/O — User I/O - bank 2 |
| Broche 40 | I/O — User I/O - bank 2 |
| Broche 41 | I/O — User I/O - bank 2 |
| Broche 42 | I/O — User I/O - bank 2 |
| Broche 43 | I/O — User I/O - bank 2 |
| Broche 44 | GND — Ground |
| Broche 45 | VCCIO2 — I/O bank 2 supply voltage (1.8/2.5/3.3 V) |
| Broche 46 | I/O — User I/O - bank 2 |
| Broche 47 | I/O — User I/O - bank 2 |
| Broche 48 | I/O — User I/O - bank 2 |
| Broche 49 | I/O — User I/O - bank 2 |
| Broche 50 | I/O — User I/O - bank 2 |
| Broche 51 | I/O — User I/O - bank 2 |
| Broche 52 | I/O — User I/O - bank 2 |
| Broche 53 | I/O — User I/O - bank 2 |
| Broche 54 | I/O — User I/O - bank 2 |
| Broche 55 | I/O — User I/O - bank 2 |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O - bank 3 |
| Broche 58 | I/O — User I/O - bank 3 |
| Broche 59 | I/O — User I/O - bank 3 |
| Broche 60 | I/O — User I/O - bank 3 |
| Broche 61 | I/O — User I/O - bank 3 |
| Broche 62 | I/O — User I/O - bank 3 |
| Broche 63 | I/O — User I/O - bank 3 |
| Broche 64 | I/O — User I/O - bank 3 |
| Broche 65 | I/O — User I/O - bank 3 |
| Broche 66 | I/O — User I/O - bank 3 |
| Broche 67 | GND — Ground |
| Broche 68 | VCCIO3 — I/O bank 3 supply voltage (1.8/2.5/3.3 V) |
| Broche 69 | I/O — User I/O - bank 3 |
| Broche 70 | I/O — User I/O - bank 3 |
| Broche 71 | I/O — User I/O - bank 3 |
| Broche 72 | I/O — User I/O - bank 3 |
| Broche 73 | I/O — User I/O - bank 3 |
| Broche 74 | I/O — User I/O - bank 3 |
| Broche 75 | I/O — User I/O - bank 3 |
| Broche 76 | I/O — User I/O - bank 3 |
| Broche 77 | I/O — User I/O - bank 3 |
| Broche 78 | I/O — User I/O - bank 3 |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O - bank 4 |
| Broche 81 | I/O — User I/O - bank 4 |
| Broche 82 | I/O — User I/O - bank 4 |
| Broche 83 | I/O — User I/O - bank 4 |
| Broche 84 | I/O — User I/O - bank 4 |
| Broche 85 | I/O — User I/O - bank 4 |
| Broche 86 | I/O — User I/O - bank 4 |
| Broche 87 | I/O — User I/O - bank 4 |
| Broche 88 | I/O — User I/O - bank 4 |
| Broche 89 | I/O — User I/O - bank 4 |
| Broche 90 | GND — Ground |
| Broche 91 | VCCIO4 — I/O bank 4 supply voltage (1.8/2.5/3.3 V) |
| Broche 92 | I/O — User I/O - bank 4 |
| Broche 93 | I/O — User I/O - bank 4 |
| Broche 94 | I/O — User I/O - bank 4 |
| Broche 95 | I/O — User I/O - bank 4 |
| Broche 96 | I/O — User I/O - bank 4 |
| Broche 97 | I/O — User I/O - bank 4 |
| Broche 98 | I/O — User I/O - bank 4 |
| Broche 99 | I/O — User I/O - bank 4 |
| Broche 100 | I/O — User I/O - bank 4 |
| Broche 101 | I/O — User I/O - bank 4 |
| Broche 102 | GND — Ground |
| Broche 103 | TDI — JTAG Test Data In |
| Broche 104 | TMS — JTAG Test Mode Select |
| Broche 105 | TCK — JTAG Test Clock |
| Broche 106 | TRST — JTAG Test Reset (active low) |
| Broche 107 | TDO — JTAG Test Data Out |
| Broche 108 | VCCIO1 — I/O bank 1 supply voltage (1.8/2.5/3.3 V) |
| Broche 109 | I/O — User I/O - bank 1 |
| Broche 110 | I/O — User I/O - bank 1 |
| Broche 111 | I/O — User I/O - bank 1 |
| Broche 112 | I/O — User I/O - bank 1 |
| Broche 113 | I/O — User I/O - bank 1 |
| Broche 114 | I/O — User I/O - bank 1 |
| Broche 115 | I/O — User I/O - bank 1 |
| Broche 116 | I/O — User I/O - bank 1 |
| Broche 117 | I/O — User I/O - bank 1 |
| Broche 118 | I/O — User I/O - bank 1 |
| Broche 119 | GND — Ground |
| Broche 120 | I/O — User I/O - bank 1 |
| Broche 121 | I/O — User I/O - bank 1 |
| Broche 122 | I/O — User I/O - bank 1 |
| Broche 123 | I/O — User I/O - bank 1 |
| Broche 124 | I/O — User I/O - bank 1 |
| Broche 125 | I/O — User I/O - bank 1 |
| Broche 126 | I/O — User I/O - bank 1 |
| Broche 127 | I/O — User I/O - bank 1 |
| Broche 128 | I/O — User I/O - bank 1 |
| Broche 129 | I/O — User I/O - bank 1 |
| Broche 130 | GND — Ground |
| Broche 131 | VCCINT — Core supply voltage (3.3 V) |
| Broche 132 | I/O — User I/O - bank 1 |
| Broche 133 | I/O — User I/O - bank 1 |
| Broche 134 | I/O — User I/O - bank 1 |
| Broche 135 | I/O — User I/O - bank 1 |
| Broche 136 | I/O — User I/O - bank 1 |
| Broche 137 | I/O — User I/O - bank 1 |
| Broche 138 | I/O — User I/O - bank 1 |
| Broche 139 | I/O — User I/O - bank 1 |
| Broche 140 | I/O — User I/O - bank 1 |
| Broche 141 | I/O — User I/O - bank 1 |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O - bank 1 |
| Broche 144 | I/O — User I/O - bank 1 |
Applications typiques
EPM3256ATI144-10N convient pour 6 applications: Bus Interface Bridging and Address Decoding, Industrial Control State Machines, Peripheral Chip-Select Generation, Legacy 22V10 / PAL Replacement and Consolidation, Telecom Backplane Glue Logic, Test and Measurement Front-End Logic.
Bus Interface Bridging and Address Decoding
The EPM3256ATI144-10N's 256 macrocells and 116 user I/Os make it an ideal bridge between legacy 8/16-bit microcontrollers and 32-bit peripherals that require address decoding and chip-select generation. With 10 ns pin-to-pin propagation delay and 95.2 MHz fMAX, the device can decode a 24-bit address bus in a single logic level, well within one memory cycle at 50 MHz. Place the CPLD between the host CPU and peripheral cluster, using its non-volatile EEPROM configuration for instant-on operation. Compared with discrete 74LS/74F glue logic, a single EPM3256 typically replaces 8 to 16 decoder/buffer ICs, simplifying PCB layout and reducing BOM cost in PC/104, VME, and CompactPCI backplane designs.
Recommandé
Industrial Control State Machines
Deterministic timing and -40 C to +85 C industrial temperature operation make the EPM3256ATI144-10N a strong fit for hard-real-time state machines in PLCs, motor controllers, and process automation equipment. Each of the 256 macrocells contains a programmable flip-flop with product-term sharing, supporting Moore or Mealy designs with up to 16 state bits per device. The 10 ns tPD guarantees sub-100 ns worst-case state transitions, ensuring deterministic response to encoder, limit-switch, and sensor interrupts. Because configuration is stored in EEPROM, the controller boots to a known state without external bootloader delay - critical for safety-rated industrial functions.
Recommandé
Peripheral Chip-Select Generation
The EPM3256ATI144-10N excels at generating address-mapped chip-selects for memory banks, ASICs, and FPGAs in embedded systems. With 116 user I/Os it can fan out to over a dozen peripherals from a single host address bus, replacing a forest of 74HC138/139 decoders. Each I/O supports 1.8 V, 2.5 V, or 3.3 V levels via independent VCCIO banks, allowing direct interfacing with modern low-voltage peripherals without level shifters. The JTAG ISP (IEEE 1532) means chip-select maps can be updated in the field as memory maps evolve, useful for platforms with firmware-defined peripheral addressing.
Recommandé
Legacy 22V10 / PAL Replacement and Consolidation
Engineers modernizing legacy boards that use discrete 22V10, PAL16L8, PAL20R8, or MACH1/2 devices can consolidate them into a single EPM3256ATI144-10N. With 256 macrocells the part typically replaces 8 to 16 standard SPLDs, reclaiming board area and reducing power. Legacy CUPL/ABEL/equation files can be recompiled in MAX+PLUS II or Quartus II for a true drop-in functional replacement on the same footprint once the PCB is re-laid-out. The 3.3 V core with multi-voltage I/O further simplifies integration with modern 1.8 V/2.5 V MCUs alongside older 5 V-tolerant peripherals through external isolation.
Recommandé
Telecom Backplane Glue Logic
In telecom backplanes (T1/E1 multiplexers, DSLAM line cards, optical transport) the EPM3256ATI144-10N serves as reliable multi-rail glue logic between FPGAs, network processors, and PHY devices. Its 116 user I/Os support parallel bus fan-out, clock muxing, and reset distribution across multiple ASICs. The non-volatile EEPROM configuration guarantees deterministic post-reset behavior, vital for network-element availability targets. JTAG boundary-scan (IEEE 1149.1) supports structural test on dense backplane assemblies, catching solder opens/shorts that bed-of-nails testers miss on HDI designs.
Recommandé
Test and Measurement Front-End Logic
Bench-top instruments (oscilloscopes, logic analyzers, signal generators) use the EPM3256ATI144-10N as reconfigurable front-end logic to switch attenuator paths, route multiplexer banks, and format trigger signals. With 95.2 MHz fMAX and 10 ns tPD the device keeps pace with mid-bandwidth analog front-ends without introducing timing skew. Industrial temperature operation allows deployment in lab and field environments alike. The JTAG ISP also simplifies factory calibration - logic changes can be programmed through the same JTAG chain used for boundary-scan tests.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM3256ATI144-10N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM3256ATI144-10 | EPM3256ATC144-10N | EPM3256ATC144-10 | EPM3256ATC144-10AA | EPM3256ATC144-7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Macrocells | 256 | 256 | 256 | 256 | 256 | 256 |
| User I/Os | 116 | 116 | 116 | 116 | 116 | 116 |
| Propagation Delay (tPD) | 10 ns | 10 ns | 10 ns | 10 ns | 10 ns | 7 ns (faster) |
| Max Frequency (fMAX) | 95.2 MHz | 95.2 MHz | 95.2 MHz | 95.2 MHz | 95.2 MHz | ~125 MHz (faster) |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) |
| Lead Finish | Pb-free ("N" suffix) | SnPb (no "N") | Pb-free | SnPb | SnPb (AA variant) | Pb-free |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Principaux différenciateurs
- Industrial temperature range coverage (vs EPM3256ATC144-10N)
- Pb-free / RoHS-compliant lead finish ("N" suffix) (vs EPM3256ATI144-10)
- Same-package speed upgrade available (-7 grade) (vs EPM3256ATC144-7N)
Notes de conception
Estimated: with all 116 I/Os toggling at 50 MHz CMOS load (15 pF each), I/O switching current is roughly I = N*C*V*f = 116 * 15e-12 * 3.3 * 50e6 = ~29 mA, plus core ICC of ~30-80 mA depending on utilization. Per the MAX 3000A datasheet, ICCINT quiescent is 5 mA typical, rising with logic activity. Decouple each VCCINT pin with 0.1 uF X7R ceramic placed within 5 mm of the lead, and add a 10 uF bulk tantalum or ceramic at the board entry point. VCCIO1-VCCIO4 each require their own 0.1 uF + bulk decoupling when different voltages are used across banks.
The 144-pin TQFP has a 0.5 mm lead pitch and 22 mm body - use 0.15 mm-wide SMT pads with 0.4 mm length and a solder mask dam of 0.2 mm between pads to prevent bridging. Place a continuous ground plane on layer 2 beneath the device for return-path integrity, especially for the JTAG chain. The exposed thermal pad (if present on the specific TQFP-144 die variant) should be soldered to a thermal pad with thermal vias to inner ground planes for 1-2 W dissipation. Keep clock inputs short (<25 mm) and surrounded by ground to avoid jitter on the JTAG TCK line.
Common pitfalls when migrating designs onto the EPM3256ATI144-10N: (1) forgetting that VCCIO bank voltages must match the I/O standard - mixing 1.8 V and 3.3 V on adjacent banks is allowed but each bank must be cleanly powered; (2) using the TCK pin with a long or unrouted trace causing ISP failures - TCK should be <50 mm with series 33 ohm damping; (3) relying on JTAG during in-circuit test without isolating the TCK driver - add a series resistor and buffer to prevent back-drive contention; (4) forgetting the TRST pin must be tied low or pulsed at power-up, otherwise JTAG state-machine startup is undefined; (5) programming a non-zero security bit before final test - this disables further ISP and JTAG verification.
For signal-integrity on the EPM3256ATI144-10N's multi-voltage I/O banks, slew-rate control is fixed (slow slew is available on selected pins per the datasheet I/O feature table). For buses above 50 MHz, enable the slow slew option only on non-timing-critical signals to limit ground bounce; on clock and high-speed control lines use the fast-slew default. Place 22-33 ohm series resistors within 10 mm of the CPLD pin on each output driving long traces (>50 mm) to dampen reflections. With VCCIO at 1.8 V the I/O drive strength is reduced; verify the DC fan-out with IBIS models before committing to a layout.
Informations de conformité
Pb-free ("N" suffix) and RoHS-compliant per the part ordering code. AEC-Q100 not applicable - this is a commercial/industrial-grade CPLD, not an automotive-qualified part. Halogen-free status not stated in available distributor data.