EPM9320BC356-15 - MAX 9000 CPLD, 320 Macro, 15ns, BGA-356 | Altera
Référence : EPM9320BC356-15 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $52.63 | $52,63 |
| 10 | $47.5 | $475,00 |
| 100 | $42 | $4 200,00 |
| 500 | $36.5 | $18 250,00 |
| 1 000 | $31.2 | $31 200,00 |
EPM9320BC356-15 Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL-like macrocell arrays with a programmable interconnect network. CPLDs sit in the programmable logic hierarchy above simple PLDs (SPLDs) and below FPGAs, offering deterministic timing, fast input-to-output response, and instant-on behavior. The MAX 9000 series is built on EEPROM process technology, retaining configuration without external memory and supporting thousands of erase/program cycles. This positions the MAX 9000 family between low-density SPLDs and SRAM-based FPGAs in the programmable logic taxonomy.
Key features of the EPM9320BC356-15 include 320 macrocells, a 15 ns maximum pin-to-pin delay, 5.0-V VCC operation (4.75 V to 5.25 V), JTAG-ISP compliance per IEEE 1149.1, and high-density programmable logic in a 356-ball LBGA package. The MAX architecture provides predictable, deterministic timing suitable for control logic, bus interfacing, and glue-logic replacement.
The third-generation MAX architecture implements a unified interconnect that routes signals across Logic Array Blocks (LABs) with consistent propagation delays, making static timing analysis straightforward. Built-in JTAG boundary-scan test circuitry supports IEEE 1149.1 testing, while the EEPROM-based configuration cells provide instant-on operation at power-up with no boot time and no external configuration memory required.
Typical applications include high-speed glue logic, bus interfacing and protocol bridging, state-machine controllers, and address decoding in microprocessor and DSP systems. The MAX 9000 series is widely used in telecommunications equipment, industrial control systems, and legacy designs where deterministic timing and instant-on behavior are mandatory.
When designing with the EPM9320BC356-15, ensure 5.0-V tolerance on all I/O signals and respect the commercial temperature grade. Use the Altera MAX+PLUS II or Quartus design tools for development. Note that the MAX 9000 family is mature, and lifecycle status should be verified with distributors before committing to new designs.
This page synthesizes distributor pricing, MAX 9000 family drop-in alternatives, and practical design notes not found in a single manufacturer datasheet or distributor catalog page.
Alternatives de remplacement direct pour EPM9320BC356-15 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM9320BC356-15 (même facteur de forme et même empreinte) — différant par Package, Mounting Type, Usable Gates, Operating Temperature, Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM9320ABC356-10
✅ Remplacement direct✓ En stock
$54 / unité
Voir la fiche technique →EPM9320ALI84-10N
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EPM9320ALC84-15
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EPM9320ARI208-10
✅ Remplacement direct✓ En stock
$27.2 / unité
Voir la fiche technique →EPM9320ARC208-10
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →EPM7512BTC144-7
✅ Remplacement direct✓ En stock
$20.75 / unité
Voir la fiche technique →EPM9320BC356-15 Valeurs maximales et caractéristiques électriques
| Family | MAX 9000 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Architecture | Multiple Array MatriX (MAX) - third generation |
| Macrocells | 320 |
| Pin-to-Pin Delay (max) | 15 ns |
| Process Technology | CMOS EEPROM |
| Supply Voltage (VCC) | 4.75 V to 5.25 V (5.0 V typical) |
| In-System Programmability | Yes (5.0-V ISP via JTAG) |
| JTAG Interface | IEEE Std. 1149.1 compliant |
| Boîtier | 356-ball LBGA (BGA-356, 35x35 mm) |
| Type de montage | Surface Mount |
| Programmable Type | In System Programmable |
| Operating Temperature Grade | Commercial |
Guide de configuration des broches du EPM9320BC356-15 356-ball lbga (bga-356, 35x35 mm)
Configuration des broches du EPM9320BC356-15 (boîtier 356-ball lbga (bga-356, 35x35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM9320BC356-15.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM9320BC356-15 convient pour 6 applications: High-Speed Glue Logic, Bus Interface and Protocol Bridging, Address Decoding and Chip-Select Generation, Industrial Control and Automation, Telecommunications Backplane Logic, Legacy Computing System Support.
High-Speed Glue Logic
The EPM9320BC356-15's 15 ns deterministic pin-to-pin delay and 320 macrocells make it well suited for high-speed glue logic between microprocessors, DSPs, ASICs, and memory subsystems. The MAX architecture delivers predictable timing that static timing analysis handles cleanly, avoiding the iterative place-and-route closure cycles required by FPGAs. With 5.0-V I/O tolerance, the part drops directly into legacy TTL-level buses. For new designs the -10 speed grade (EPM9320ABC356-10) is preferred where the budget allows; the -15 grade remains the workhorse for cost-sensitive glue-logic replacement.
Recommandé
Bus Interface and Protocol Bridging
The EPM9320BC356-15 excels at bus interface and protocol bridging tasks, where its 320 macrocells provide ample headroom for state machines, FIFOs, and byte-order conversion logic. The JTAG-ISP support (IEEE 1149.1) allows field reconfiguration of bridge logic without board removal, which is invaluable for deployed telecom and industrial equipment. The 5.0-V tolerance simplifies interfacing with legacy PCI, ISA, and proprietary backplanes. Engineers designing multi-standard bridges should plan I/O bank utilization carefully given the BGA-356 footprint's high pin density.
Recommandé
Address Decoding and Chip-Select Generation
Address decoding and chip-select generation are classic MAX 9000 applications where the EPM9320BC356-15's 320 macrocells and fast 15 ns propagation delay handle deep decode trees without timing penalties. The EEPROM-based configuration boots instantly at power-up, eliminating the configuration time of SRAM FPGAs - critical in systems that must respond to a host CPU's boot sequence within microseconds. With 5.0-V I/O, the part can drive legacy peripheral chips directly. Engineers building large decode trees should review the Quartus II fitter reports for macrocell utilization efficiency.
Recommandé
Industrial Control and Automation
Industrial control and automation systems rely on the EPM9320BC356-15 for deterministic state-machine control of motor drives, PLCs, and sensor interfaces. The MAX architecture's predictable timing simplifies IEC 61131-3 functional safety certification, while the commercial temperature grade suits factory-floor enclosures. EEPROM-based configuration survives brown-outs and power cycles without external boot memory. For new industrial designs, confirm the part's lifecycle status (NRND) before committing and verify the JTAG-ISP chain remains compatible with the production test fixtures.
Recommandé
Telecommunications Backplane Logic
Telecommunications backplanes depend on the EPM9320BC356-15 for fast, deterministic backplane glue logic, clock distribution steering, and TDM bus multiplexing. The 15 ns pin-to-pin delay accommodates legacy T1/E1 framer interfacing and proprietary backplane protocols up to several tens of MHz. Combined with 5.0-V tolerance and JTAG-ISP, the part remains in service across many carrier-grade systems still deployed in 2026. The BGA-356 package provides robust thermal performance and mechanical reliability required for telecom central-office environments.
Recommandé
Legacy Computing System Support
The EPM9320BC356-15 is a critical support part for legacy computing systems that depend on a 5.0-V CPLD with 320 macrocells and BGA-356 footprint. These include industrial PCs, military/aerospace retrofits, and medical equipment with long service lives where the original component must be replaced with a pin-compatible part. The mature MAX 9000 family has a robust secondary-market supply chain through distributors like fpgax.net and altera-micro.com. Engineers maintaining these systems should plan lifecycle risk mitigation and consider pin-compatible MAX II upgrades where PCB rework is feasible.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM9320BC356-15 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM9320ABC356-10 | EPM9320ALI84-10N | EPM9320ALC84-15 | EPM9320ARI208-10 | EPM9320ARC208-10 | EPM7512BTC144-7 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | BGA-356 | BGA-356 (same) | BGA-356 (logic-equivalent footprint) | BGA-356 (logic-equivalent footprint) | BGA-356 (logic-equivalent footprint) | BGA-356 (logic-equivalent footprint) | BGA-356 (same family footprint) |
| Family | MAX 9000 | MAX 9000 | MAX 9000 | MAX 9000 | MAX 9000 | MAX 9000 | MAX 7000 |
| Macrocells | 320 | 320 | 320 | 320 | 320 | 320 | 512 |
| Pin-to-Pin Delay (ns) | 15 | 10 | 10 | 15 | 10 | 10 | 7 |
| Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| In-System Programmability | Yes (JTAG 1149.1) | Yes (JTAG 1149.1) | Yes (JTAG 1149.1) | Yes (JTAG 1149.1) | Yes (JTAG 1149.1) | Yes (JTAG 1149.1) | Yes (JTAG 1149.1) |
Principaux différenciateurs
- Faster 10 ns speed grade in the same die and BGA-356 footprint (vs EPM9320ABC356-10)
- Smaller BGA-84 package option with the same silicon (vs EPM9320ALI84-10N)
- Higher macrocell density in the same MAX family (vs EPM7512BTC144-7)
Notes de conception
The EPM9320BC356-15 requires a single 5.0-V VCC supply within 4.75 V to 5.25 V. Place a 0.1 uF decoupling capacitor close to every VCC ball, plus a single 10 uF bulk tantalum or ceramic capacitor near the package. The MAX 9000 family draws higher in-rush current during ISP programming - budget the regulator for at least 500 mA peak to avoid VCC droop during JTAG-ISP. Power sequencing is not required thanks to EEPROM-based configuration.
The BGA-356 (35x35 mm) package requires a 4- or 6-layer PCB with a continuous ground plane under the device for signal return paths and thermal dissipation. Use 0.5 mm ball pitch escape routing with microvia-in-pad or dog-bone fanout. BGA-356 reworking requires X-ray inspection or BGA rework station; plan assembly and prototype rework logistics accordingly. Maintain solid thermal vias under the center ball array to spread heat from the silicon die to inner copper planes.
Do not assume the EPM9320BC356-15 is 3.3-V tolerant - the MAX 9000 family is a 5.0-V-only part, and applying 3.3-V signals exceeding the VCC rail will forward-bias the I/O clamp diodes. When bridging to 3.3-V logic, use external level shifters such as the 74LVC245 or 74ACT245. Also verify the JTAG chain order in multi-device ISP configurations - the MAX 9000 must be placed correctly in the BSDL scan chain to avoid programming failures.
Informations de conformité
Compliance data not present in verified web sources for this legacy Altera CPLD. RoHS and lead-free status should be verified with the manufacturer or distributor per the specific date code; MAX 9000 family pre-dates widespread RoHS transition.
