H5CG44AGBDX018N - 16Gb DDR5-5600 SDRAM x4 | SK Hynix
Référence : H5CG44AGBDX018N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
H5CG44AGBDX018N Présentation
DDR5 SDRAM is the fifth generation of double-data-rate synchronous dynamic random-access memory, the component class that serves as main system memory between the processor and storage hierarchy. Within that hierarchy, DDR5 DRAM -> SDRAM -> semiconductor memory -> memory IC. DDR5 doubles the bank groups of DDR4, lowers the operating voltage, and integrates on-die ECC and a PMIC on the memory module rather than the chip; the die itself delivers higher per-pin data rates than any previous generation.
Key features of the H5CG44AGBDX018N include the DDR5-5600 speed grade (5600 MT/s per pin), a x4 organization (4G addressable locations of 4 bits), and 16Gb total density per die, enabling high-capacity DIMMs and soldered-down memory with fewer packages. The x4 organization is specifically favored in registered DIMMs with strong error-protection schemes and in storage controllers, because x4 devices pair naturally with chipkill-class correction strategies.
The device uses SK Hynix advanced DRAM process technology with on-die termination, a differential clocking interface, and the standard DDR5 command/address architecture with two independent channels per DIMM footprint. Signal integrity is supported by programmable termination values and a DQS-based strobe-aligned interface, allowing reliable operation at 5600 MT/s on carefully length-matched fly-by topologies.
Typical applications include data-center RDIMM and LRDIMM modules, industrial computing modules, embedded controllers requiring high-bandwidth volatile memory, and replacement sourcing for server-memory repair and refurbishment programs.
Design consideration: DDR5 signal integrity depends heavily on trace length matching, reference-plane continuity, and controller training routines; always enable write leveling and per-rank read training at DDR5-5600 speeds.
This page synthesizes distributor availability, same-family drop-in alternatives, and procurement guidance not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour H5CG44AGBDX018N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec H5CG44AGBDX018N (même facteur de forme et même empreinte) — différant par Data Rate, Organization, Density, Interface, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
H5CG44AGBDX018
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.48 / unité
Voir la fiche technique →H5CG46AGBDX017N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$91.73 / unité
Voir la fiche technique →H5CG48AGBDX018N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$87.42 / unité
Voir la fiche technique →H5CG44AGBDX018N Spécifications
| Type de mémoire | DDR5 SDRAM |
| Density | 16 Gb |
| Organisation de la mémoire | 4G x 4 |
| Speed Grade | DDR5-5600 |
| Débit de données | 5600 MT/s |
| Boîtier | FBGA |
| Type de montage | Surface Mount |
| Interface | DDR5 (DQS strobe-aligned, on-die termination) |
| Bit Width per Die | 4 bit |
| Product Family | SK Hynix H5CG series DDR5 |
| Application Domain | Servers, computing modules, industrial controllers |
Guide de configuration des broches du H5CG44AGBDX018N fbga
Configuration des broches du H5CG44AGBDX018N (boîtier fbga). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour H5CG44AGBDX018N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
H5CG44AGBDX018N convient pour 6 applications: Server RDIMM Main Memory, Industrial Computing Modules, Firmware Boot and Embedded Logging Buffers, Data Storage Controllers, Workstation and Desktop Memory Modules, Replacement Sourcing and Server Refurbishment.
Server RDIMM Main Memory
The H5CG44AGBDX018N fits server registered DIMM designs where 16Gb x4 DDR5-5600 die are the industry-standard building block. Its x4 organization aligns with chipkill-class error protection on RDIMM/LRDIMM buses, and the 5600 MT/s speed grade supports current server memory-controller bandwidth of roughly 45 GB/s per channel at DDR5-5600. Sixteen packages deliver a 32 GB module; the FBGA footprint matches standard DDR5 die land patterns. Designers benefit from on-die termination and the DDR5 fly-by command/address topology, but must length-match data groups and validate training at full speed. Supply is quote-based through distributors such as PCXco and WIN Source as of 2026-09-05.
Recommandé
Industrial Computing Modules
Embedded computing modules (COMs, edge servers, factory controllers) use the H5CG44AGBDX018N as soldered-down main memory where SODIMM sockets are undesirable. The 16Gb density gives 2 GB per package, so a 4 GB industrial design needs only two FBGA parts, saving board area and improving vibration reliability versus socketed modules. The DDR5-5600 rating provides headroom above typical industrial memory clocks, and DDR5's lower operating voltage reduces module heat in sealed enclosures. Designers must confirm the datasheet temperature range against enclosure ambient and enable controller training for the populated die. Distributor data explicitly lists industrial controllers as a target application for this part.
Recommandé
Firmware Boot and Embedded Logging Buffers
Systems that boot firmware into DRAM and log operational data use the H5CG44AGBDX018N as a high-bandwidth working buffer ahead of non-volatile storage. The x4 16Gb die provides 2 GB of buffer space per package, enough to absorb burst log writes from industrial controllers before flushing to NAND or NOR flash. DDR5-5600 bandwidth (about 2.8 GB/s per x4 package) minimizes write-queue latency, and DDR5's bank-group architecture improves random-access efficiency for logging workloads. Pair the DRAM with an SPI NOR boot flash and a memory controller that supports DDR5 training, and size refresh-aware power states to conserve energy during idle logging periods.
Recommandé
Data Storage Controllers
RAID controllers, NVMe switches, and enterprise storage processors rely on x4 DDR5 DRAM for write caches and metadata tables. The H5CG44AGBDX018N's x4 organization is preferred in storage controllers because narrow-width devices work best with strong error-correction coverage across wide buses; losing one device affects fewer bits and correction remains effective. At DDR5-5600, a 72-bit RDIMM-style bus built from these die moves about 50 GB/s, sufficient to saturate multi-port NVMe front ends. FBGA packaging supports the high layer counts typical of controller boards, and quote-based availability through IBS Electronics and Fusion Worldwide suits controller program volumes as of 2026-09-05.
Recommandé
Workstation and Desktop Memory Modules
High-end desktop and workstation platforms using x4 die (via RDIMM-style or CUDIMM designs) benefit from the H5CG44AGBDX018N's DDR5-5600 speed grade, which matches mainstream Intel and AMD memory-controller support. Sixteen packages populate a 32 GB unbuffered or registered module, and the x4 organization keeps per-bit cost low for large-capacity configurations. DDR5's two independent 32-bit subchannels per module improve small-packet efficiency for content-creation workloads compared with DDR4's single 64-bit channel. Designers must verify the platform's QVL (qualified vendor list) accepts SK Hynix H5CG44 die and configure SPD data correctly for the populated module configuration.
Recommandé
Replacement Sourcing and Server Refurbishment
Server repair, refurbishment, and second-source programs procure the H5CG44AGBDX018N to remanufacture or repair DDR5 modules whose original die were damaged or obsolete. Because the part is an active SK Hynix product with broker stock (HKInventory lists 50,000-unit offers as of 2026-09-05), refurbishers can match original die markings and preserve module qualification. The critical practice is matching the exact suffix code (N vs non-N) and date-code class to the original population to keep module SPD and vendor lists intact. XAIPART supports RFQ-based sourcing with traceability, which is essential for enterprise refurbishment contracts requiring component provenance documentation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour H5CG44AGBDX018N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | H5CG44AGBDX018 | H5CG46AGBDX017N | H5CG48AGBDX018N |
|---|---|---|---|---|
| Package | FBGA | FBGA - same | FBGA - same family | FBGA - same family |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Organization | 4G x 4 | 4G x 4 | x4 family | x4 family |
| Lifecycle Status | active | active | active | active |
Principaux différenciateurs
- Exact-die drop-in replacement within SK Hynix catalog (vs H5CG44AGBDX018)
- x4 organization for error-protected buses (vs H5CG48AGBDX018N)
- DDR5-5600 speed grade headroom (vs H5CG46AGBDX017N)
Notes de conception
DDR5-5600 demands disciplined layout: length-match data groups (DQ/DM/DQS) within tight skew budgets, route command/address on the fly-by topology with per-DIMM termination, and maintain continuous reference planes under all DDR5 traces. Enable controller write leveling, read training, and per-rank VrefDQ training during bring-up; the H5CG44AGBDX018N's on-die termination values should be programmed per SK Hynix recommendations in the datasheet rather than copied from DDR4 designs, as DDR5 termination tables differ.
DDR5 operates at a lower supply voltage class than DDR4, and DDR5 modules place the PMIC on the module instead of the chipset. For soldered-down H5CG44AGBDX018N designs, provide a dedicated 1.1 V-class VDD rail with low-impedance decoupling at each FBGA ball group, plus separate VDDQ rails per the datasheet power-distribution table. Calculate total current from the number of populated packages; a 16-package 32 GB design requires proportionally more rail current and bulk capacitance than a 2-package embedded design.
Do not assume suffix interchangeability without qualification: H5CG44AGBDX018N and H5CG44AGBDX018 share the same die but the suffix encodes packaging attributes that some procurement contracts track. Also avoid mixing density/speed codes (H5CG46, H5CG48) within one memory channel, since memory training expects uniform populations. Finally, when sourcing from brokers, verify date codes and request traceability, as DRAM is a common counterfeit target in spot markets.
Informations de conformité
Compliance status was not stated in the retrieved distributor data; request material declarations from SK Hynix via RFQ.
