MT41K256M16TW-093:P - 4Gbit DDR3L SDRAM 256Mx16 | Micron
Référence : MT41K256M16TW-093:P ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.23 | $22,23 |
| 10 | $20.5 | $205,00 |
| 100 | $18.75 | $1 875,00 |
| 500 | $17 | $8 500,00 |
| 1 000 | $15.5 | $15 500,00 |
MT41K256M16TW-093:P Présentation
DDR3L SDRAM is a low-voltage variant of DDR3 memory, designed to operate at 1.35V while remaining backward-compatible with standard 1.5V DDR3. This reduction in voltage significantly lowers power consumption, making it ideal for power-sensitive applications such as laptops, servers, and industrial electronics. DDR3L is part of the DDR SDRAM family, which uses double data rate architecture to transfer data on both edges of the clock, effectively doubling throughput.
Key features include a differential bidirectional data strobe, 8n-bit prefetch architecture, on-die termination (ODT), and ZQ calibration. The device supports auto self-refresh, auto precharge, asynchronous reset, and write leveling, ensuring reliable operation in high-speed systems. The 1.35V operation reduces power dissipation by up to 20% compared to standard DDR3, making it suitable for energy-efficient designs.
The MT41K256M16TW-093:P utilizes Micron's advanced DRAM process technology, providing high-speed data transfer with low latency. The 8n-prefetch architecture enables burst lengths of 8, improving memory bandwidth efficiency. The device also features dynamic on-chip termination, which adjusts termination impedance during writes to improve signal integrity, and write leveling for improved timing margins in multi-rank systems.
Typical applications include DDR3L memory modules for laptops, servers, networking equipment, and embedded systems. Its 4Gbit density and x16 organization make it ideal for applications requiring high memory capacity with a narrow bus, such as industrial PCs, routers, and test equipment. The 1.35V operation is particularly beneficial in battery-powered devices where power efficiency is critical.
When designing with this component, ensure proper decoupling capacitors are placed near the power pins to minimize noise. The FBGA package requires careful PCB layout to maintain signal integrity at high frequencies. Refer to the Micron DDR3L datasheet for detailed timing and layout guidelines.
Alternatives de remplacement direct pour MT41K256M16TW-093:P — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MT41K256M16TW-093:P (même facteur de forme et même empreinte) — différant par Package, Memory Type, Supply Voltage, Clock Frequency, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MT41K256M16TW-107:P
✅ Remplacement direct✓ En stock
$16 / unité
Voir la fiche technique →MT41K256M16TW-093 IT:P
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K256M16HA-125:E
✅ Remplacement direct✓ En stock
$3.1 / unité
Voir la fiche technique →MT41K256M16HA-107G:E
✅ Remplacement direct✓ En stock
$4 / unité
Voir la fiche technique →MT41K256M16RE-125:D
✅ Remplacement direct✓ En stock
$4.19 / unité
Voir la fiche technique →MT41K256M16LY-107:N
✅ Remplacement direct✓ En stock
$8.1 / unité
Voir la fiche technique →MT41K256M16TW-107 AUT:P TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K256M16TW-107 IT:P TR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT41K256M16TW-093:P Valeurs maximales et caractéristiques électriques
| Type de mémoire | SDRAM - DDR3L |
| Taille de mémoire | 4 Gbit |
| Organisation de la mémoire | 256 M x 16 |
| Largeur du bus de données | 16 bit |
| Fréquence d'horloge maximale | 1.066 GHz |
| Access Time | 20 ns |
| Tension d'alimentation | 1.35 V (1.5 V compatible) |
| Boîtier / Format | 96-FBGA (8x14) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0°C to +95°C |
| Statut RoHS | Compliant |
| REACH Status | Compliant |
| Series | MT41K256M16 |
| Product Category | DRAM |
| Type | SDRAM - DDR3L |
Configuration des broches de MT41K256M16TW-093:P
| Broche A1 | VDD — Power supply |
| Broche A2 | DQ0 — Data input/output 0 |
| Broche A3 | DQ1 — Data input/output 1 |
| Broche A4 | VSS — Ground |
| Broche A5 | DQ2 — Data input/output 2 |
| Broche A6 | DQ3 — Data input/output 3 |
| Broche A7 | VDD — Power supply |
| Broche A8 | DQ4 — Data input/output 4 |
| Broche A9 | DQ5 — Data input/output 5 |
| Broche A10 | VSS — Ground |
| Broche A11 | DQ6 — Data input/output 6 |
| Broche A12 | DQ7 — Data input/output 7 |
| Broche B1 | VSS — Ground |
| Broche B2 | DQ8 — Data input/output 8 |
| Broche B3 | DQ9 — Data input/output 9 |
| Broche B4 | VDD — Power supply |
| Broche B5 | DQ10 — Data input/output 10 |
| Broche B6 | DQ11 — Data input/output 11 |
| Broche B7 | VSS — Ground |
| Broche B8 | DQ12 — Data input/output 12 |
| Broche B9 | DQ13 — Data input/output 13 |
| Broche B10 | VDD — Power supply |
| Broche B11 | DQ14 — Data input/output 14 |
| Broche B12 | DQ15 — Data input/output 15 |
Applications typiques
MT41K256M16TW-093:P convient pour 6 applications: Laptop Memory Modules, Networking Equipment, Industrial PCs, Embedded Systems, Test and Measurement Equipment, Server Memory.
Laptop Memory Modules
The MT41K256M16TW-093:P is ideal for laptop memory modules (SO-DIMMs) due to its 1.35V low-voltage operation, which reduces power consumption and extends battery life. Its 4Gbit density and x16 organization allow compact module designs with high capacity. The 1.066 GHz clock speed supports fast data transfer for multitasking and multimedia applications. When used in SO-DIMMs, it provides a balance of performance and power efficiency, making it a popular choice for ultrabooks and thin-and-light laptops.
Recommandé
Networking Equipment
In networking equipment such as routers and switches, the MT41K256M16TW-093:P provides high-bandwidth memory for packet buffering and routing tables. Its 1.066 GHz clock and 16-bit data bus enable fast data throughput, while the 1.35V operation reduces heat generation in dense chassis. The FBGA package allows high-density PCB layouts, essential for compact network appliances. Its reliability and wide temperature range make it suitable for 24/7 operation in enterprise environments.
Recommandé
Industrial PCs
The MT41K256M16TW-093:P is well-suited for industrial PCs that require robust memory in harsh environments. Its 0°C to +95°C operating temperature range ensures reliable performance in factory floors and outdoor installations. The 1.35V operation minimizes power dissipation, reducing thermal stress on surrounding components. With 4Gbit capacity, it supports demanding industrial applications such as machine vision and process control. The FBGA package provides excellent shock and vibration resistance, critical for industrial settings.
Recommandé
Embedded Systems
For embedded systems like single-board computers and IoT gateways, the MT41K256M16TW-093:P offers a balance of performance and power efficiency. Its 1.35V operation is ideal for battery-powered devices, while the 1.066 GHz clock ensures responsive processing. The x16 organization simplifies PCB routing, reducing design complexity. The device's support for auto self-refresh and power-down modes helps conserve energy in idle states, extending battery life in portable embedded applications.
Recommandé
Test and Measurement Equipment
In test and measurement equipment such as oscilloscopes and logic analyzers, the MT41K256M16TW-093:P provides high-speed memory for data acquisition and waveform storage. Its 1.066 GHz clock enables fast sampling rates, while the 4Gbit capacity allows long recording times. The 1.35V operation reduces power consumption, which is beneficial for portable instruments. The FBGA package's small footprint helps in designing compact, high-performance test equipment.
Recommandé
Server Memory
The MT41K256M16TW-093:P can be used in server memory modules (RDIMMs) for entry-level servers and workstations. Its 4Gbit density and x16 organization allow high-capacity modules, while the 1.35V operation reduces power consumption in data centers. The 1.066 GHz clock supports high-bandwidth applications such as virtualization and database processing. The device's reliability and error-handling features make it suitable for 24/7 server operation.
Recommandé
Données de référence d'ingénierie pour MT41K256M16TW-093:P — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MT41K256M16TW-107:P | MT41K256M16HA-125:E | MT41K256M16HA-107G:E |
|---|---|---|---|---|
| Package | 96-FBGA (8x14) | 96-FBGA (8x14) | 96-FBGA (8x14) | 96-FBGA (8x14) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Size | 4 Gbit | 4 Gbit | 4 Gbit | 4 Gbit |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Max Clock Frequency | 1.066 GHz | 933 MHz | 800 MHz | 933 MHz |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns |
| Supply Voltage | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
Principaux différenciateurs
- Higher maximum clock frequency (1.066 GHz) compared to alternatives (vs MT41K256M16TW-107:P)
- Standard temperature grade (0°C to +95°C) with industrial option available (vs MT41K256M16TW-093 IT:P)
- Newer die revision with improved performance (vs MT41K256M16HA-125:E)
Notes de conception
For high-speed DDR3L signals, maintain controlled impedance of 40-60 ohms for data lines and 80-100 ohms for address/command lines. Keep trace lengths matched within 100 mils to minimize skew. Use ground planes beneath the FBGA package to reduce noise and improve signal integrity.
Decouple the VDD pins with 0.1uF and 1uF ceramic capacitors placed as close to the pins as possible. Use a 10uF bulk capacitor on the VDD rail to handle transient currents. Ensure the VDD supply is stable and within 1.35V ± 0.1V to meet DDR3L specifications.
The FBGA package has a thermal resistance of approximately 30°C/W. For typical operation, ensure adequate airflow or a heatsink if the ambient temperature exceeds 70°C. Monitor junction temperature to stay within the 95°C maximum rating.
Informations de conformité
RoHS and REACH compliant per distributor data. AEC-Q100 not applicable for standard grade; automotive variants available.
