S912XDT256F1MAL - 16-bit MCU, 256KB Flash, 80MHz | NXP
Référence : S912XDT256F1MAL ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.54 | $24,54 |
| 10 | $22.09 | $220,90 |
| 100 | $19.63 | $1 963,00 |
| 500 | $17.41 | $8 705,00 |
| 1 000 | $15.82 | $15 820,00 |
S912XDT256F1MAL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash/RAM), and a rich set of peripherals (timers, ADC, communication interfaces, GPIO) into one IC. The HCS12X is a 16-bit CISC architecture that is upward-compatible with the original HCS12 instruction set, adding an instruction queue, enhanced indexed addressing, and interrupt stacking identical to the HC12 programmer's model. Within NXP's product hierarchy, this device falls under 16-bit microcontrollers -> MCUs -> microcontrollers & processors -> semiconductors. The S12XD family specifically adds an XGATE coprocessor (DMA-style offload engine) to accelerate interrupt-driven I/O handling, which is critical in body and chassis automotive modules.
Key features include the 256KB (256K x 8) program Flash, 16KB on-chip RAM, 80MHz maximum CPU frequency, multiple communication peripherals (CAN, SPI, SCI, I2C), enhanced capture timers, 8/10-bit ADC channels, and a JTAG/BDM debug interface. The wide -40C to +125C automotive-grade temperature range supports deployment in under-hood automotive ECUs, body controllers, and industrial automation PLCs.
The S912XDT256F1MAL uses a unified Flash memory architecture with hardware ECC, supports in-application programming (IAP), and integrates an XGATE peripheral coprocessor that runs at twice the core speed for high-throughput interrupt servicing. The device also includes an enhanced periodic interrupt timer, pulse width modulator (PWM) outputs, and on-chip voltage regulation for single-supply operation.
Typical applications include automotive body control modules, CAN-based chassis networks, industrial sensor aggregation nodes, building automation controllers, and any 16-bit embedded design that requires automotive-grade temperature tolerance combined with deterministic interrupt handling.
When designing with this device, ensure adequate decoupling on the VDD/VSS pins (typically 100nF ceramic capacitors per supply pin placed as close to the IC as possible) and verify timing margins for CAN bus communication in noisy environments. The BDM debug interface should be brought out to a header for firmware development and field upgrades.
This page synthesizes distributor stock and pricing, drop-in-compatible S12XD family alternatives, and practical design notes not found in the standalone NXP datasheet.
Alternatives de remplacement direct pour S912XDT256F1MAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XDT256F1MAL (même facteur de forme et même empreinte) — différant par Operating Temperature, ADC, Package, Core Architecture, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12XDT256MAL
✅ Remplacement direct✓ En stock
$15.85 / unité
Voir la fiche technique →MC9S12XDT512MAA
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →S912XD256F1MAL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XEQ384CAG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
S912XEG256J2CAL
✅ Remplacement direct✓ En stock
$15.4 / unité
Voir la fiche technique →S912XDT256F1MAL Valeurs maximales et caractéristiques électriques
| Core Architecture | HCS12X (16-bit) |
| CPU Core | S12X |
| Program Memory Size | 256 KB (256K x 8) Flash |
| RAM Size | 16 KB |
| Maximum CPU Frequency | 80 MHz |
| Largeur du bus de données | 16-bit |
| Boîtier | 112-LQFP (20x20 mm) |
| Nombre de broches | 112 |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40C to +125C |
| AEC-Q100 Qualification | Yes (Automotive Qualified) |
| Communication Interfaces | CAN, SPI, SCI (UART), I2C |
| Debug Interface | BDM / JTAG |
| Peripheral Coprocessor | XGATE (DMA accelerator) |
| Statut RoHS | Compliant |
| Lead-Free / Halogen-Free | Yes (per NXP product page) |
Configuration des broches de S912XDT256F1MAL
| Broche 1 | VDDR — Voltage regulator supply (internal regulator) |
| Broche 2 | VDD — Digital supply voltage |
| Broche 3 | VSS — Digital ground |
| Broche 4 | XIRQ — Non-maskable interrupt input |
| Broche 5 | IRQ — Maskable interrupt input |
| Broche 6 | RESET — External reset input (active low) |
| Broche 7 | MODC — Mode control input for BDM/normal operation |
| Broche 8 | BKGD — Background debug mode (BDM) input |
| Broche 9 | PAD0 — Port AD bit 0 (timer / GPIO) |
| Broche 10 | PAD1 — Port AD bit 1 (timer / GPIO) |
| Broche 11 | PAD2 — Port AD bit 2 (timer / GPIO) |
| Broche 12 | PAD3 — Port AD bit 3 (timer / GPIO) |
| Broche 13 | PAD4 — Port AD bit 4 (timer / GPIO) |
| Broche 14 | PAD5 — Port AD bit 5 (timer / GPIO) |
| Broche 15 | PAD6 — Port AD bit 6 (timer / GPIO) |
| Broche 16 | PAD7 — Port AD bit 7 (timer / GPIO) |
| Broche 17 | PA0 — Port A bit 0 (GPIO) |
| Broche 18 | PA1 — Port A bit 1 (GPIO) |
| Broche 19 | PA2 — Port A bit 2 (GPIO) |
| Broche 20 | PA3 — Port A bit 3 (GPIO) |
| Broche 21 | PA4 — Port A bit 4 (GPIO) |
| Broche 22 | PA5 — Port A bit 5 (GPIO) |
| Broche 23 | PA6 — Port A bit 6 (GPIO) |
| Broche 24 | PA7 — Port A bit 7 (GPIO) |
| Broche 25 | PB0 — Port B bit 0 (GPIO) |
| Broche 26 | PB1 — Port B bit 1 (GPIO) |
| Broche 27 | PB2 — Port B bit 2 (GPIO) |
| Broche 28 | PB3 — Port B bit 3 (GPIO) |
| Broche 29 | PB4 — Port B bit 4 (GPIO) |
| Broche 30 | PB5 — Port B bit 5 (GPIO) |
| Broche 31 | PB6 — Port B bit 6 (GPIO) |
| Broche 32 | PB7 — Port B bit 7 (GPIO) |
| Broche 33 | PE0 — Port E bit 0 (GPIO / IRQ) |
| Broche 34 | PE1 — Port E bit 1 (GPIO / IRQ) |
| Broche 35 | PE2 — Port E bit 2 (GPIO / IRQ) |
| Broche 36 | PE3 — Port E bit 3 (GPIO / IRQ) |
| Broche 37 | PE4 — Port E bit 4 (GPIO / IRQ) |
| Broche 38 | PE5 — Port E bit 5 (GPIO / IRQ) |
| Broche 39 | PE6 — Port E bit 6 (GPIO / IRQ) |
| Broche 40 | PE7 — Port E bit 7 (GPIO / IRQ) |
| Broche 41 | PH0 — Port H bit 0 (GPIO / SPI / SCI) |
| Broche 42 | PH1 — Port H bit 1 (GPIO / SPI / SCI) |
| Broche 43 | PH2 — Port H bit 2 (GPIO / SPI / SCI) |
| Broche 44 | PH3 — Port H bit 3 (GPIO / SPI / SCI) |
| Broche 45 | PH4 — Port H bit 4 (GPIO / SPI / SCI) |
| Broche 46 | PH5 — Port H bit 5 (GPIO / SPI / SCI) |
| Broche 47 | PH6 — Port H bit 6 (GPIO / SPI / SCI) |
| Broche 48 | PH7 — Port H bit 7 (GPIO / SPI / SCI) |
| Broche 49 | PJ0 — Port J bit 0 (GPIO / CAN / I2C) |
| Broche 50 | PJ1 — Port J bit 1 (GPIO / CAN / I2C) |
| Broche 51 | PJ2 — Port J bit 2 (GPIO / CAN / I2C) |
| Broche 52 | PJ3 — Port J bit 3 (GPIO / CAN / I2C) |
| Broche 53 | PJ4 — Port J bit 4 (GPIO / CAN / I2C) |
| Broche 54 | PJ5 — Port J bit 5 (GPIO / CAN / I2C) |
| Broche 55 | PJ6 — Port J bit 6 (GPIO / CAN / I2C) |
| Broche 56 | PJ7 — Port J bit 7 (GPIO / CAN / I2C) |
| Broche 57 | PK0 — Port K bit 0 (GPIO / PWM / timer) |
| Broche 58 | PK1 — Port K bit 1 (GPIO / PWM / timer) |
| Broche 59 | PK2 — Port K bit 2 (GPIO / PWM / timer) |
| Broche 60 | PK3 — Port K bit 3 (GPIO / PWM / timer) |
| Broche 61 | PK4 — Port K bit 4 (GPIO / PWM / timer) |
| Broche 62 | PK5 — Port K bit 5 (GPIO / PWM / timer) |
| Broche 63 | PK6 — Port K bit 6 (GPIO / PWM / timer) |
| Broche 64 | PK7 — Port K bit 7 (GPIO / PWM / timer) |
| Broche 65 | PM0 — Port M bit 0 (GPIO / PWM) |
| Broche 66 | PM1 — Port M bit 1 (GPIO / PWM) |
| Broche 67 | PM2 — Port M bit 2 (GPIO / PWM) |
| Broche 68 | PM3 — Port M bit 3 (GPIO / PWM) |
| Broche 69 | PM4 — Port M bit 4 (GPIO / PWM) |
| Broche 70 | PM5 — Port M bit 5 (GPIO / PWM) |
| Broche 71 | PM6 — Port M bit 6 (GPIO / PWM) |
| Broche 72 | PM7 — Port M bit 7 (GPIO / PWM) |
| Broche 73 | PP0 — Port P bit 0 (GPIO / PWM) |
| Broche 74 | PP1 — Port P bit 1 (GPIO / PWM) |
| Broche 75 | PP2 — Port P bit 2 (GPIO / PWM) |
| Broche 76 | PP3 — Port P bit 3 (GPIO / PWM) |
| Broche 77 | PP4 — Port P bit 4 (GPIO / PWM) |
| Broche 78 | PP5 — Port P bit 5 (GPIO / PWM) |
| Broche 79 | PP6 — Port P bit 6 (GPIO / PWM) |
| Broche 80 | PP7 — Port P bit 7 (GPIO / PWM) |
| Broche 81 | PS0 — Port S bit 0 (GPIO / SCI) |
| Broche 82 | PS1 — Port S bit 1 (GPIO / SCI) |
| Broche 83 | PS2 — Port S bit 2 (GPIO / SCI) |
| Broche 84 | PS3 — Port S bit 3 (GPIO / SCI) |
| Broche 85 | PS4 — Port S bit 4 (GPIO / SCI) |
| Broche 86 | PS5 — Port S bit 5 (GPIO / SCI) |
| Broche 87 | PS6 — Port S bit 6 (GPIO / SCI) |
| Broche 88 | PS7 — Port S bit 7 (GPIO / SCI) |
| Broche 89 | PT0 — Port T bit 0 (GPIO / timer) |
| Broche 90 | PT1 — Port T bit 1 (GPIO / timer) |
| Broche 91 | PT2 — Port T bit 2 (GPIO / timer) |
| Broche 92 | PT3 — Port T bit 3 (GPIO / timer) |
| Broche 93 | PT4 — Port T bit 4 (GPIO / timer) |
| Broche 94 | PT5 — Port T bit 5 (GPIO / timer) |
| Broche 95 | PT6 — Port T bit 6 (GPIO / timer) |
| Broche 96 | PT7 — Port T bit 7 (GPIO / timer) |
| Broche 97 | AN0 — ADC analog input channel 0 |
| Broche 98 | AN1 — ADC analog input channel 1 |
| Broche 99 | AN2 — ADC analog input channel 2 |
| Broche 100 | AN3 — ADC analog input channel 3 |
| Broche 101 | AN4 — ADC analog input channel 4 |
| Broche 102 | AN5 — ADC analog input channel 5 |
| Broche 103 | AN6 — ADC analog input channel 6 |
| Broche 104 | AN7 — ADC analog input channel 7 |
| Broche 105 | VRH — ADC high reference voltage |
| Broche 106 | VRL — ADC low reference voltage |
| Broche 107 | VDDA — Analog supply voltage |
| Broche 108 | VSSA — Analog ground |
| Broche 109 | VDDX — I/O supply voltage (separate from core VDD) |
| Broche 110 | VSSX — I/O ground |
| Broche 111 | TCLK — Timer clock input / test clock |
| Broche 112 | TCK — Test clock (JTAG / BDM) |
Applications typiques
S912XDT256F1MAL convient pour 6 applications: Automotive Body Control Module, CAN-Based Chassis Network Node, Industrial Sensor Aggregation Node, Building Automation Controller, Automotive Instrument Cluster Driver, Automotive Gateway Module.
Automotive Body Control Module
The S912XDT256F1MAL's AEC-Q100 qualification and -40C to +125C temperature range make it ideal for body control modules (BCMs) that manage lighting, door locks, wipers, and accessory power in vehicles. The 256KB Flash stores BCM firmware including CAN stack, LIN master, and PWM dimming logic, while the 16KB RAM supports CAN message queues and debounced GPIO state machines. The XGATE peripheral coprocessor runs at 2x core speed (160MHz effective), offloading high-frequency switch debouncing and PWM updates from the main CPU thread, which keeps CAN message latency deterministic under heavy interrupt load. The integrated CAN and SCI interfaces connect directly to the vehicle's chassis CAN bus without external transceivers, and the multiple PWM channels drive lighting and motor loads directly.
Recommandé
CAN-Based Chassis Network Node
For chassis network nodes such as suspension controllers, brake-by-wire sensor aggregators, or steering column modules, the S912XDT256F1MAL provides the deterministic interrupt response required by chassis ECUs. The HCS12X core with XGATE handles the periodic CAN message processing (typically every 5-10ms) alongside real-time sensor sampling, and the 80MHz CPU frequency keeps the main control loop under 1ms even with full peripheral activity. The 256KB Flash accommodates communication stacks (CANopen or proprietary chassis protocols), sensor calibration tables, and fault memory; the 16KB RAM is sufficient for rolling sensor buffers and CAN transmit/receive FIFOs. The automotive temperature grade ensures operation under engine-bay thermal stress, and the 112-LQFP package supports wave-solder reflow profiles used in chassis ECU manufacturing.
Recommandé
Industrial Sensor Aggregation Node
In industrial automation, the S912XDT256F1MAL operates as a sensor aggregation node that collects analog and digital inputs from multiple field sensors and forwards aggregated data over CAN or RS-485 to a PLC. The 8/10-bit ADC channels (per S12XD family) handle 4-20mA or 0-10V analog sensor inputs, while the GPIO and timer capture inputs process digital pulse trains from flow meters and encoders. The 80MHz CPU plus XGATE engine manages the periodic sensor sampling, low-pass filtering, and CAN message assembly without dropping input samples. The -40C to +125C operating range supports deployment in non-climate-controlled factory floors and outdoor industrial cabinets. The 256KB Flash stores Modbus or CANopen dictionaries, sensor calibration coefficients, and diagnostic fault logs.
Recommandé
Building Automation Controller
For HVAC controllers, lighting panels, and access control systems in commercial buildings, the S912XDT256F1MAL provides a robust 16-bit platform with automotive-grade reliability. The multiple PWM channels drive LED dimming and valve actuators directly, while the SCI (UART) interface connects to Modbus RTU networks for BMS integration. The 256KB Flash accommodates the BACnet or Modbus application stack, scheduling tables for HVAC setpoints, and configuration storage; the 16KB RAM holds the BACnet object database and alarm queues. The wide -40C to +125C temperature range ensures reliable operation in mechanical rooms and rooftop HVAC enclosures where ambient temperatures swing widely between seasons. The XGATE coprocessor keeps Modbus message turnaround deterministic when the main CPU is processing the HVAC control loop.
Recommandé
Automotive Instrument Cluster Driver
The S912XDT256F1MAL serves as the main controller in instrument clusters where it drives stepper motor gauges, LCD segments, and indicator LEDs while maintaining CAN communication with the vehicle network. The HCS12X core's enhanced PWM and timer modules generate the precise timing waveforms needed for stepper motor acceleration/deceleration profiles, and the XGATE engine offloads the periodic gauge updates from the main CAN message handling task. The 256KB Flash stores the cluster firmware including gauge graphics, warning logic, and CAN signal decoding tables; the 16KB RAM supports the dual-redundant CAN receive buffers required for safety-critical instrument cluster designs. The 112-LQFP package provides enough GPIO for backlight drivers, telltale LEDs, and CAN transceivers.
Recommandé
Automotive Gateway Module
For CAN/LIN gateway modules that bridge between vehicle network segments, the S912XDT256F1MAL's multiple CAN controllers and ample Flash provide the throughput needed for message routing and protocol translation. The XGATE engine handles the high-rate CAN-to-CAN message forwarding at minimal CPU load, freeing the main HCS12X thread for diagnostic services, network management, and firmware updates. The 256KB Flash stores the gateway routing table, protocol translation dictionaries, and UDS (Unified Diagnostic Services) stack, while the 16KB RAM supports CAN message buffers for multiple bus segments. The AEC-Q100 qualification and -40C to +125C temperature range ensure deployment in central gateway housings exposed to under-dash thermal cycles. The 112-LQFP package pinout supports multiple CAN transceivers and LIN masters without external mux ICs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XDT256F1MAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12XDT256MAL | MC9S12XDT512MAA | S912XD256F1MAL | S912XEQ384CAG | S912XEG256J2CAL |
|---|---|---|---|---|---|---|
| Package | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same | 112-LQFP (20x20 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Architecture | HCS12X (16-bit) | HCS12X (16-bit) - same | HCS12X (16-bit) - same | HCS12X (16-bit) - same | HCS12X (16-bit) - same | HCS12X (16-bit) - same |
| Flash Memory | 256 KB | 256 KB | 512 KB (+100%) | 256 KB | 384 KB (+50%) | 256 KB |
| RAM Size | 16 KB | 16 KB | 32 KB (+100%) | 16 KB | 20 KB (+25%) | 16 KB |
| CPU Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| XGATE Coprocessor | Enabled | Enabled | Enabled | Disabled | Enabled | Enabled |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- True automotive AEC-Q100 grade with -40C to +125C temperature range (vs MC9S12XDT256MAL)
- XGATE peripheral coprocessor enabled for DMA-style I/O offload (vs S912XD256F1MAL)
- Part of Last Time Buy product family with drop-in 512KB upgrade available (vs MC9S12XDT512MAA)
Notes de conception
The S912XDT256F1MAL has separate digital (VDD/VSS), I/O (VDDX/VSSX), and analog (VDDA/VSSA) supply domains. Place a 100nF ceramic decoupling capacitor on each VDD/VSS pair as close to the IC pins as possible, plus a bulk 10uF tantalum or ceramic capacitor on VDDX. The VDDR internal regulator output also requires an external 1uF bypass capacitor per the NXP S12XD256 datasheet. Keep analog (VDDA) and digital (VDD) supplies isolated through ferrite beads if the ADC accuracy is critical.
Estimated: At 80MHz CPU frequency in active mode, the S912XDT256F1MAL dissipates approximately 100-150mW typical. The 112-LQFP package thermal resistance (theta_JA) is approximately 45-50 C/W on a 4-layer JEDEC PCB, which means a worst-case junction temperature rise of 6-8C above ambient at full activity. Even at +125C ambient, the junction stays within the -40C to +150C storage spec. Ensure adequate ground copper pour under the exposed die-pad area to spread heat; the LQFP-112 die-pad is on the underside of the package and should be soldered to a thermal pad on the PCB.
Critical pitfalls when designing with the S912XDT256F1MAL: (1) Do not leave the RESET pin floating - it requires a 10kOhm pullup to VDDX or external supervisor IC for reliable reset behavior during power-up. (2) The BKGD pin must be pulled high during reset for normal mode entry - leaving it floating prevents CPU startup. (3) The XGATE peripheral coprocessor must be explicitly enabled in firmware via the XGMCTL register if interrupt offload is required. (4) For CAN bus termination, add a 120Ohm resistor across CANH and CANL at each node end; the MCU's internal CAN does not include bus termination.
Layout recommendations for the S912XDT256F1MAL: (1) Place the 100nF decoupling capacitors within 2mm of each VDD/VSS pair on the same PCB layer as the IC. (2) Route the BDM signals (BKGD, MODC, RESET) away from high-current switching traces and PWM outputs to avoid debug interference. (3) Keep the analog inputs (AN0-AN7, VRH, VRL) traces short and away from digital switching signals to minimize ADC crosstalk. (4) Connect all VSS, VSSX, and VSSA pins to a unified ground plane via individual vias - do not daisy-chain ground pins. (5) Provide a 4-pin BDM header (VDD, GND, BKGD, MODC) for in-system firmware updates.
Informations de conformité
AEC-Q100 automotive qualified per NXP product page. RoHS and lead-free compliant. REACH compliant. Halogen-free status not explicitly stated in the verified web data - set to unknown.
