EPM2210GF256C5N - MAX II CPLD, 2210 LEs, 256-FBGA | Intel / Altera
MPN: EPM2210GF256C5N ✓ פעילEPM2210GF256C5N סקירה
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device containing multiple macrocells interconnected through a programmable interconnect matrix. Within the broader semiconductor taxonomy, a CPLD sits between simple PAL/GAL devices and larger FPGAs - it is non-volatile (retains configuration without external flash), instant-on (configures in microseconds rather than milliseconds), and well-suited to glue-logic, bus-bridging and control-plane tasks. MAX II devices belong to the power management IC's sibling family of programmable logic, fabricated on a 0.18-µm process node and storing their configuration in on-chip Flash memory.
Key features include 2210 Logic Elements, 272 maximum user I/Os, 8 Kbits of user Flash memory, on-chip oscillator, and 4-input look-up table (LUT) based logic with a MultiTrack interconnect architecture. The C5 speed grade provides predictable timing suitable for glue logic, I/O expansion, and bus-interface applications.
The MAX II architecture combines a non-volatile Flash configuration block with a LUT-based logic fabric, allowing instant-on behavior without an external configuration PROM. The MultiTrack interconnect minimizes routing congestion for wide buses, and the device supports in-system programmability via JTAG (IEEE 1149.1) with the Altera/Quartus toolchain.
Typical applications include I/O expansion and voltage-translation bridges in industrial control boards, power-sequencing and supervisory logic in networking switches, instant-on glue logic replacing discrete 74-series logic in cost-sensitive consumer electronics, and bus-interface management between microcontrollers and peripheral ICs.
When designing with this part, note that the GF256 package supports vertical migration within the same footprint across the EPM570, EPM1270, and EPM2210 density points, allowing board reuse with software-driven density scaling. Decoupling follows standard FPGA/CPLD guidelines: bulk capacitors on each supply rail plus high-frequency ceramic decoupling adjacent to each power pin.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that complement - but are not found within - the manufacturer datasheet alone.
חלופות תחליף ישיר עבור EPM2210GF256C5N — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EPM2210GF256C5N (אותו גורם צורה וטביעת רגל) — שונים ב Operating Temperature, Package, Family, Programming Interface, Macrocells.
EPM2210GF256I5N
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
EPM2210GF256C4N
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
EPM1270GF256C5N
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
EPM1270F256C5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM2210F256C5N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM570GF256C5N
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPM2210GF256C5N דירוגים מרביים ומאפיינים חשמליים
| Family | MAX II |
| Logic Elements | 2210 |
| מארז | 256-ball FineLine BGA (GF256) |
| Speed Grade | C5 |
| Temperature Grade | Commercial (N) |
| Process Node | 0.18 µm |
| Configuration Memory | Non-volatile on-chip Flash |
| Maximum User I/O Pins | 272 |
| User Flash Memory | 8 Kbits |
| On-chip Oscillator | Yes |
| Multi-volt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V |
| Programmable Interconnect | MultiTrack |
| In-system Programming | JTAG (IEEE 1149.1) |
| Logic Block Architecture | 4-input LUT |
| סוג הרכבה | Surface Mount (BGA) |
תצורת פינים של EPM2210GF256C5N
| פין A1 | I/O — User I/O - bank 1 |
| פין A2 | I/O — User I/O - bank 1 |
| פין A3 | VCCIO1 — I/O bank 1 supply |
| פין A4 | I/O — User I/O - bank 1 |
| פין B1 | GND — Ground |
| פין B2 | I/O — User I/O - bank 1 |
| פין B3 | I/O — User I/O - bank 1 |
| פין B4 | GND — Ground |
| פין C1 | I/O — User I/O - bank 2 |
| פין C2 | I/O — User I/O - bank 2 |
| פין C3 | VCCIO2 — I/O bank 2 supply |
| פין C4 | I/O — User I/O - bank 2 |
| פין D1 | GND — Ground |
| פין D2 | TDI — JTAG test data in |
| פין D3 | TCK — JTAG test clock |
| פין D4 | TMS — JTAG test mode select |
| פין E1 | I/O — User I/O - bank 3 |
| פין E2 | TDO — JTAG test data out |
| פין E3 | GND — Ground |
| פין E4 | I/O — User I/O - bank 3 |
| פין F1 | VCCINT — Core supply (1.8V) |
| פין F2 | I/O — User I/O - bank 3 |
| פין F3 | I/O — User I/O - bank 3 |
| פין F4 | VCCIO3 — I/O bank 3 supply |
| פין G1 | I/O — User I/O - bank 4 |
| פין G2 | I/O — User I/O - bank 4 |
| פין G3 | GND — Ground |
| פין G4 | I/O — User I/O - bank 4 |
| פין H1 | VCCIO4 — I/O bank 4 supply |
| פין H2 | I/O — User I/O - bank 4 |
| פין H3 | I/O — User I/O - bank 4 |
| פין H4 | GND — Ground |
| פין J1 | I/O — User I/O - bank 5 |
| פין J2 | GND — Ground |
| פין J3 | I/O — User I/O - bank 5 |
| פין J4 | VCCIO5 — I/O bank 5 supply |
| פין K1 | I/O — User I/O - bank 5 |
| פין K2 | I/O — User I/O - bank 5 |
| פין K3 | I/O — User I/O - bank 5 |
| פין K4 | I/O — User I/O - bank 5 |
| פין L1 | nCONFIG — Configuration control (active low) |
| פין L2 | nSTATUS — Configuration status (active low) |
| פין L3 | CONF_DONE — Configuration done indicator |
| פין L4 | I/O — User I/O - bank 6 |
| פין M1 | I/O — User I/O - bank 6 |
| פין M2 | VCCIO6 — I/O bank 6 supply |
| פין M3 | I/O — User I/O - bank 6 |
| פין M4 | GND — Ground |
| פין N1 | I/O — User I/O - bank 7 |
| פין N2 | I/O — User I/O - bank 7 |
| פין N3 | I/O — User I/O - bank 7 |
| פין N4 | VCCIO7 — I/O bank 7 supply |
| פין P1 | GND — Ground |
| פין P2 | I/O — User I/O - bank 7 |
| פין P3 | I/O — User I/O - bank 7 |
| פין P4 | I/O — User I/O - bank 8 |
| פין R1 | VCCIO8 — I/O bank 8 supply |
| פין R2 | I/O — User I/O - bank 8 |
| פין R3 | GND — Ground |
| פין R4 | I/O — User I/O - bank 8 |
| פין T1 | I/O — User I/O - bank 8 |
| פין T2 | I/O — User I/O - bank 8 |
| פין T3 | I/O — User I/O - bank 8 |
| פין T4 | GND — Ground |
| פין U1 | I/O — User I/O - bank 1 |
| פין U2 | GND — Ground |
| פין U3 | I/O — User I/O - bank 1 |
| פין U4 | VCCINT — Core supply (1.8V) |
| פין V1 | I/O — User I/O - bank 1 |
| פין V2 | I/O — User I/O - bank 1 |
| פין V3 | I/O — User I/O - bank 1 |
| פין V4 | I/O — User I/O - bank 1 |
| פין W1 | VCCIO1 — I/O bank 1 supply |
| פין W2 | I/O — User I/O - bank 1 |
| פין W3 | I/O — User I/O - bank 1 |
| פין W4 | GND — Ground |
| פין Y1 | I/O — User I/O - bank 2 |
| פין Y2 | I/O — User I/O - bank 2 |
| פין Y3 | GND — Ground |
| פין Y4 | I/O — User I/O - bank 2 |
| פין AA1 | I/O — User I/O - bank 2 |
| פין AA2 | VCCIO2 — I/O bank 2 supply |
| פין AA3 | I/O — User I/O - bank 2 |
| פין AA4 | I/O — User I/O - bank 2 |
| פין AB1 | GND — Ground |
| פין AB2 | I/O — User I/O - bank 2 |
| פין AB3 | I/O — User I/O - bank 2 |
| פין AB4 | GND — Ground |
יישומים טיפוסיים
EPM2210GF256C5N מתאים עבור 6 יישוםs: Industrial I/O Expansion and Voltage Bridging, Power-Sequencing and Supervisory Logic in Networking Switches, Glue-Logic Consolidation in Consumer Electronics, Microcontroller Bus Interface Management, Automotive Infotainment Auxiliary Logic, Test and Measurement Equipment Front-End Logic.
Industrial I/O Expansion and Voltage Bridging
The EPM2210GF256C5N fits industrial I/O expansion boards because it offers 272 user I/Os with multi-volt bank support (1.5V / 1.8V / 2.5V / 3.3V) and 2210 logic elements in a single BGA. Designers place it between a host MCU and legacy peripherals, translating 3.3V CMOS to 1.8V LVDS without external level shifters. Its instant-on non-volatile Flash configuration means the board powers up in a known valid state within microseconds, eliminating the FPGA-style 'unconfigured' window that complicates hot-swap and PoL sequencing.
מומלץ
Power-Sequencing and Supervisory Logic in Networking Switches
Networking switches need deterministic power-up ordering across many DC-DC rails, and the EPM2210GF256C5N delivers 2210 LUTs and 8 Kbits of user Flash for storing rail-enable state machines. It replaces dozens of 74-series logic chips with one programmable device and provides JTAG-based in-system reprogrammability for late-stage BOM changes. The 256-ball BGA package saves PCB area versus discrete logic, while the instant-on architecture guarantees that downstream regulators see a valid enable signal before they reach regulation.
מומלץ
Glue-Logic Consolidation in Consumer Electronics
Consumer designs traditionally use multiple 74HC/74LVC chips for bus steering, address decoding, and interrupt arbitration. The EPM2210GF256C5N absorbs all of these functions in a single 2210-LE CPLD, cutting BOM cost and PCB area while adding JTAG-driven debug visibility. The non-volatile Flash configuration means consumer devices work out-of-the-box with no firmware-loading step, critical for instant-on appliances and HDMI accessories. MultiTrack interconnect timing closure is straightforward below 200 MHz, fitting consumer audio/video sample-rate domains.
מומלץ
Microcontroller Bus Interface Management
When a microcontroller lacks enough GPIO or specialized peripherals, the EPM2210GF256C5N acts as a programmable bus companion that implements custom parallel ports, PWM generators, or quadrature decoders in 2210 LUTs. The GF256 BGA exposes enough I/O to serve as a 32-bit bus expander with spare pins for interrupts and chip-selects. Multi-volt I/O banks let the CPLD talk 1.8V to a low-power MCU while driving 3.3V peripherals directly, removing the need for level-translator ICs and reducing BOM count.
מומלץ
Automotive Infotainment Auxiliary Logic
In automotive head units and instrument clusters, the EPM2210GF256C5N can serve as auxiliary glue logic handling CAN-to-LIN bridging, display backlight PWM, and audio sample-rate routing. The 256-ball BGA tolerates the automotive underhood thermal environment when paired with the industrial-grade EPM2210GF256I5N variant, and the MAX II non-volatile architecture provides the deterministic startup required for ASIL-rated systems. JTAG access supports end-of-line programming and field firmware updates without external PROMs.
מומלץ
Test and Measurement Equipment Front-End Logic
Bench instruments like oscilloscopes and logic analyzers need flexible front-end signal routing, and the EPM2210GF256C5N delivers 272 user I/Os with the timing predictability that instrument designers prefer over FPGA fabric. Multi-volt I/O banks accept 1.5V to 3.3V probes directly, and the 2210-LE capacity absorbs channel-multiplexer state machines without external logic. The non-volatile instant-on behavior eliminates the calibration/firmware load window that plagues FPGA-based instruments.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EPM2210GF256C5N — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EPM2210GF256I5N | EPM2210GF256C4N | EPM1270GF256C5N | EPM2210F256C5N | EPM570GF256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-ball FineLine BGA (GF256) - same | 256-pin FineLine BGA (F256) - verify ball map | 256-ball FineLine BGA (GF256) - same |
| Logic Elements | 2210 | 2210 | 2210 | 1270 (-43%) | 2210 | 570 (-74%) |
| Speed Grade | C5 | I5 (slower, industrial) | C4 (slower) | C5 | C5 | C5 |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial |
| Maximum User I/O | 272 | 272 | 272 | 212 | 212 | 212 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| On-chip Oscillator | Yes | Yes | Yes | Yes | Yes | Yes |
מבדילים עיקריים
- Highest logic element density in MAX II family (לעומתEPM1270GF256C5N)
- C5 speed grade is the fastest MAX II timing option (לעומתEPM2210GF256C4N)
- Vertical migration support across MAX II family (לעומתEPM570GF256C5N)
הערות תכנון
Estimated: The EPM2210GF256C5N requires separate VCCINT (1.8V core) and VCCIOx (per-bank I/O supply at 1.5V / 1.8V / 2.5V / 3.3V) rails. Place a 100 µF bulk capacitor plus 0.1 µF and 1 nF ceramic decoupling on each VCCIOx bank pin to suppress switching noise during MultiTrack interconnect transitions. Total core current at full toggle activity approaches 100 mA; budget at least 200 mA headroom on the 1.8V LDO feeding VCCINT.
Route the JTAG chain (TCK, TMS, TDI, TDO) as a 4-wire daisy chain with 4.7 kΩ pull-ups on TCK, TMS, and TDI. Place JTAG header within 6 inches of the device and keep traces matched within 1 inch. For the GF256 FineLine BGA, use at least 4-layer PCB with continuous ground planes under the package and 0.5 mm via-in-pad recommended for thermal relief.
Do not confuse the GF256 (256-ball FineLine BGA, 17x17 grid with depopulated corners) with the F256 (256-pin FineLine BGA, different ball pattern). EPM2210GF256C5N and EPM2210F256C5N are NOT pin-compatible - the GF vs F suffix denotes distinct ball maps per the MAX II device handbook. Always verify the exact datasheet pinout before PCB swap.
מידע על תאימות
RoHS/REACH compliance status not explicitly stated in verified web data; verify with manufacturer datasheet or distributor compliance letter before production use. Part is not AEC-Q100 qualified - for automotive applications consider the industrial-grade EPM2210GF256I5N variant with additional qualification testing.
