NT5CC256M16CP-EK - 4Gb DDR3L SDRAM 256Mx16 | Nanya Technology
MPN: NT5CC256M16CP-EK ✓ פעילNT5CC256M16CP-EK סקירה
DDR3L (Double Data Rate 3 Low Voltage) SDRAM is a type of synchronous dynamic random-access memory that operates at a lower voltage (1.35V) compared to standard DDR3 (1.5V), reducing power consumption by up to 20% while maintaining similar performance. It is part of the DRAM memory hierarchy, which includes SRAM, DRAM, and flash memory, and is widely used in main memory, graphics, and embedded applications.
Key features include a 4Gb density, 256M x 16 organization, 96-ball TFBGA package, and support for both DDR3 and DDR3L operation. The device operates over a temperature range of 0°C to +95°C (TC) and includes features such as auto self-refresh, auto precharge, asynchronous reset, data mask, write leveling, dynamic on-chip termination, and ZQ calibration. These features enhance signal integrity and system reliability.
The NT5CC256M16CP-EK uses an 8n-prefetch architecture with 8 internal memory banks, differential clock inputs (CK, CK#), and programmable CAS latency (CL), write latency (CWL), and additive latency. It supports burst lengths of 8 and 4 with burst chop, and includes on-die termination (ODT) for improved signal quality. The device is RoHS compliant and lead-free.
Typical applications include servers, networking equipment, industrial computing, automotive infotainment, and consumer electronics such as set-top boxes and smart TVs. Its low-voltage operation makes it ideal for power-sensitive designs, while its high-speed interface supports demanding data-intensive workloads.
When designing with this device, ensure proper decoupling capacitors near the power pins and follow the layout guidelines in the datasheet to minimize signal integrity issues. The ZQ calibration pin requires a 240-ohm resistor to ground for proper impedance calibration.
חלופות תחליף ישיר עבור NT5CC256M16CP-EK — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם NT5CC256M16CP-EK (אותו גורם צורה וטביעת רגל) — שונים ב Package, Supply Voltage, Data Rate, Density, Operating Temperature.
NT5CC256M16ER-EK
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←NT5CC256M16DP-EK
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
NT5CC256M16EP-EK
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
MT41K256M16HA-125
✅ Drop-In ⚠️ מפרטים לא מאומתים✗ אזל מהמלאי
$6.3636 / יחידה
הצג גיליון נתונים ←K4B4G1646E-BYMA
✅ Drop-In ⚠️ מפרטים לא מאומתים✗ אזל מהמלאי
$14.3182 / יחידה
הצג גיליון נתונים ←NT5CC256M16CP-EK דירוגים מרביים ומאפיינים חשמליים
| סוג זיכרון | DDR3L SDRAM |
| Density | 4Gb |
| ארגון | 256M x 16 |
| מתח אספקה | 1.35V (DDR3L) / 1.5V (DDR3) |
| קצב נתונים | 2133 Mb/s per pin |
| מארז | 96-ball TFBGA |
| טמפרטורת פעולה | 0°C to +95°C (TC) |
| Number of Banks | 8 |
| Refresh Cycles | 8192 |
| CAS Latency (CL) | Programmable (e.g., 9, 10, 11, 12, 13) |
| Write Latency (CWL) | 5, 6, 7, 8, 9 |
| Burst Length | 8 and 4 (with burst chop) |
| ממשק | Differential clock (CK, CK#) |
| RoHS | Compliant |
| Lead-Free | Yes |
תצורת פינים של NT5CC256M16CP-EK
| פין A1 | VDD — Power supply (1.35V/1.5V) |
| פין A2 | DQ0 — Data input/output 0 |
| פין A3 | DQ1 — Data input/output 1 |
| פין A4 | VSS — Ground |
| פין A5 | DQ2 — Data input/output 2 |
| פין A6 | DQ3 — Data input/output 3 |
| פין A7 | VDD — Power supply |
| פין A8 | DQ4 — Data input/output 4 |
| פין A9 | DQ5 — Data input/output 5 |
| פין A10 | VSS — Ground |
| פין A11 | DQ6 — Data input/output 6 |
| פין A12 | DQ7 — Data input/output 7 |
| פין B1 | VSS — Ground |
| פין B2 | DQ8 — Data input/output 8 |
| פין B3 | DQ9 — Data input/output 9 |
| פין B4 | VDD — Power supply |
| פין B5 | DQ10 — Data input/output 10 |
| פין B6 | DQ11 — Data input/output 11 |
| פין B7 | VSS — Ground |
| פין B8 | DQ12 — Data input/output 12 |
| פין B9 | DQ13 — Data input/output 13 |
| פין B10 | VDD — Power supply |
| פין B11 | DQ14 — Data input/output 14 |
| פין B12 | DQ15 — Data input/output 15 |
| פין C1 | VDDQ — DQ power supply |
| פין C2 | VSSQ — DQ ground |
| פין C3 | VDDQ — DQ power supply |
| פין C4 | VSSQ — DQ ground |
| פין C5 | VDDQ — DQ power supply |
| פין C6 | VSSQ — DQ ground |
| פין C7 | VDDQ — DQ power supply |
| פין C8 | VSSQ — DQ ground |
| פין C9 | VDDQ — DQ power supply |
| פין C10 | VSSQ — DQ ground |
| פין C11 | VDDQ — DQ power supply |
| פין C12 | VSSQ — DQ ground |
| פין D1 | A0 — Address input 0 |
| פין D2 | A1 — Address input 1 |
| פין D3 | A2 — Address input 2 |
| פין D4 | A3 — Address input 3 |
| פין D5 | A4 — Address input 4 |
| פין D6 | A5 — Address input 5 |
| פין D7 | A6 — Address input 6 |
| פין D8 | A7 — Address input 7 |
| פין D9 | A8 — Address input 8 |
| פין D10 | A9 — Address input 9 |
| פין D11 | A10/AP — Address input 10 / Auto-precharge |
| פין D12 | A11 — Address input 11 |
| פין E1 | A12 — Address input 12 |
| פין E2 | A13 — Address input 13 |
| פין E3 | A14 — Address input 14 |
| פין E4 | A15 — Address input 15 |
| פין E5 | BA0 — Bank address 0 |
| פין E6 | BA1 — Bank address 1 |
| פין E7 | BA2 — Bank address 2 |
| פין E8 | RAS# — Row address strobe |
| פין E9 | CAS# — Column address strobe |
| פין E10 | WE# — Write enable |
| פין E11 | CS# — Chip select |
| פין E12 | CKE — Clock enable |
| פין F1 | ODT — On-die termination |
| פין F2 | CK — Clock (positive) |
| פין F3 | CK# — Clock (negative) |
| פין F4 | VDD — Power supply |
| פין F5 | VSS — Ground |
| פין F6 | VDD — Power supply |
| פין F7 | VSS — Ground |
| פין F8 | VDD — Power supply |
| פין F9 | VSS — Ground |
| פין F10 | VDD — Power supply |
| פין F11 | VSS — Ground |
| פין F12 | VDD — Power supply |
| פין G1 | DM0 — Data mask 0 |
| פין G2 | DM1 — Data mask 1 |
| פין G3 | DM2 — Data mask 2 |
| פין G4 | DM3 — Data mask 3 |
| פין G5 | VSS — Ground |
| פין G6 | VDD — Power supply |
| פין G7 | VSS — Ground |
| פין G8 | VDD — Power supply |
| פין G9 | VSS — Ground |
| פין G10 | VDD — Power supply |
| פין G11 | VSS — Ground |
| פין G12 | VDD — Power supply |
| פין H1 | DQS0 — Data strobe 0 (positive) |
| פין H2 | DQS0# — Data strobe 0 (negative) |
| פין H3 | DQS1 — Data strobe 1 (positive) |
| פין H4 | DQS1# — Data strobe 1 (negative) |
| פין H5 | DQS2 — Data strobe 2 (positive) |
| פין H6 | DQS2# — Data strobe 2 (negative) |
| פין H7 | DQS3 — Data strobe 3 (positive) |
| פין H8 | DQS3# — Data strobe 3 (negative) |
| פין H9 | VSS — Ground |
| פין H10 | VDD — Power supply |
| פין H11 | VSS — Ground |
| פין H12 | VDD — Power supply |
| פין J1 | RESET# — Asynchronous reset |
| פין J2 | TDQS — Termination data strobe |
| פין J3 | TDQS# — Termination data strobe (negative) |
| פין J4 | ZQ — ZQ calibration |
| פין J5 | VDD — Power supply |
| פין J6 | VSS — Ground |
| פין J7 | VDD — Power supply |
| פין J8 | VSS — Ground |
| פין J9 | VDD — Power supply |
| פין J10 | VSS — Ground |
| פין J11 | VDD — Power supply |
| פין J12 | VSS — Ground |
יישומים טיפוסיים
NT5CC256M16CP-EK מתאים עבור 6 יישוםs: Server Memory, Networking Equipment, Industrial Computing, Automotive Infotainment, Consumer Electronics, Embedded Systems.
Server Memory
The NT5CC256M16CP-EK provides high-density, low-power memory for server applications. Its 4Gb density and 2133 Mb/s data rate support demanding workloads, while DDR3L operation reduces power consumption in data centers. The 96-ball TFBGA package enables compact module designs, and features like ECC support (if available) enhance reliability. When used in registered DIMMs, it pairs with a register clock driver (RCD) to buffer address and control signals, ensuring signal integrity at high speeds. The low voltage also reduces thermal load, improving system cooling efficiency.
מומלץ
Networking Equipment
In networking equipment such as routers and switches, the NT5CC256M16CP-EK provides fast, low-power memory for packet buffering and routing tables. Its high data rate (2133 Mb/s) ensures low latency, while DDR3L voltage reduces power in always-on network devices. The device's on-die termination (ODT) and write leveling features improve signal integrity on high-speed buses, critical for reliable data transmission. It can be used in conjunction with a network processor or FPGA to handle data plane tasks. The 96-ball TFBGA package allows for dense PCB layouts, saving board space in compact networking hardware.
מומלץ
Industrial Computing
The NT5CC256M16CP-EK is suitable for industrial PCs and embedded systems that require reliable operation over extended temperature ranges (0°C to +95°C). Its low power consumption is beneficial for fanless designs, and the high data rate supports real-time data processing. The device's auto self-refresh and ZQ calibration features ensure stable operation in varying thermal conditions. It can be paired with an industrial-grade processor or FPGA for applications like machine vision and process control. The 96-ball TFBGA package provides robust solder joints for vibration-prone environments.
מומלץ
Automotive Infotainment
In automotive infotainment systems, the NT5CC256M16CP-EK provides high-bandwidth memory for navigation, multimedia, and instrument cluster displays. Its DDR3L operation reduces power consumption, which is critical in vehicles. The device supports a wide temperature range, making it suitable for cabin environments. Features like write leveling and dynamic ODT ensure reliable operation in noisy automotive electrical environments. It can be used with an automotive-grade application processor or SoC. The 96-ball TFBGA package is compact, fitting into space-constrained head units.
מומלץ
Consumer Electronics
The NT5CC256M16CP-EK is used in consumer devices like set-top boxes, smart TVs, and gaming consoles. Its high data rate enables smooth video streaming and responsive user interfaces, while DDR3L voltage reduces power consumption in always-on devices. The device's small TFBGA package allows for slim product designs. It can be paired with a media processor or SoC for video decoding and rendering. Features like auto precharge and burst chop improve memory efficiency, reducing latency in real-time applications.
מומלץ
Embedded Systems
For general embedded systems, the NT5CC256M16CP-EK offers a balance of performance and power efficiency. Its 4Gb density is suitable for applications requiring large memory footprints, such as data logging and complex algorithms. The device's low voltage and wide temperature range make it versatile for various environments. It can be interfaced with a wide range of microcontrollers and FPGAs that support DDR3L. The 96-ball TFBGA package is easy to route on multi-layer PCBs. Features like on-die termination simplify PCB design by reducing the need for external termination resistors.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור NT5CC256M16CP-EK — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | NT5CC256M16ER-EK | NT5CC256M16DP-EK | MT41K256M16HA-125 |
|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball FBGA |
| Brand | Nanya Technology | Nanya Technology | Nanya Technology | Micron Technology |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V (DDR3L) | 1.35V (DDR3L) | 1.35V (DDR3L) | 1.35V (DDR3L) |
| Data Rate | 2133 Mb/s | 2133 Mb/s | 2133 Mb/s | 2133 Mb/s |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Number of Banks | 8 | 8 | 8 | 8 |
מבדילים עיקריים
- Low-voltage DDR3L operation (לעומתStandard DDR3 parts)
- Wide temperature range (לעומתCommercial-only DDR3L parts)
- High data rate (לעומתOlder DDR3L parts with lower speed grades)
הערות תכנון
For high-speed DDR3L signals, maintain controlled impedance of 40-60 ohms for data lines and 50-75 ohms for address/control lines. Keep trace lengths matched within +/- 50 mils for DQ/DQS groups. Use a solid ground plane beneath the memory device and minimize vias on high-speed traces. Refer to the Nanya layout guidelines in the datasheet for specific recommendations.
Decouple VDD and VDDQ with 0.1uF and 1uF ceramic capacitors placed as close to the balls as possible. Use a 10uF bulk capacitor per power rail. The ZQ pin requires a 240-ohm +/- 1% resistor to ground for impedance calibration. Ensure the VREF voltage is clean and properly bypassed.
The NT5CC256M16CP-EK operates up to +95°C TC. For high-density systems, ensure adequate airflow or heatsinking to keep the case temperature within limits. The 96-ball TFBGA package has a thermal resistance that depends on PCB copper area; use thermal vias under the package to improve heat dissipation.
מידע על תאימות
RoHS compliant and lead-free per datasheet and distributor listings. AEC-Q100 not specified for this part number; automotive grade may require specific suffix.
