EP3SE260F1517C4LN vs EP3SE260F1517I4LN तुलना
विस्तृत दोनों ओर की तुलना EP3SE260F1517C4LN द्वारा Intel और EP3SE260F1517I4LN द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ अंतिम खरीदIntel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | EP3SE260F1517C4LN | EP3SE260F1517I4LN |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | अंतिम बार खरीदें |
| Series | Stratix III E | — |
| Family | Stratix III E (Enhanced) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | — |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | 40 nm CMOS |
| पैकेज / केस | 1517-BBGA, FCBGA (FC-FBGA) | — |
| माउंटिंग प्रकार | Surface Mount (flip-chip) | — |
| ऑपरेटिंग तापमान | 0C to +85C (commercial grade per 'C' suffix) | -40C to +100C (case, industrial) |
| नमी संवेदनशीलता स्तर (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | I4 (industrial, 4th tier) |
| Lead-Free / Halogen-Free | Yes (LN suffix) | — |
| RoHS स्थिति | Compliant | — |
| Embedded Memory Bits | — | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| पैकेज | — | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Power Option | — | L (low-power) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |