EP3SE260F1517C4LN vs EP3SE260F1517I4LN Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SE260F1517C4LN tarafından Intel ve EP3SE260F1517I4LN tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Son Satın AlmaIntel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | EP3SE260F1517C4LN | EP3SE260F1517I4LN |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | Son Alış Zamanı |
| Series | Stratix III E | — |
| Family | Stratix III E (Enhanced) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | — |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Paket / Kas | 1517-BBGA, FCBGA (FC-FBGA) | — |
| Montaj Türü | Surface Mount (flip-chip) | — |
| İşletim Sıcaklığı | 0C to +85C (commercial grade per 'C' suffix) | -40C to +100C (case, industrial) |
| Nem Hassasiyet Seviyesi (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | I4 (industrial, 4th tier) |
| Lead-Free / Halogen-Free | Yes (LN suffix) | — |
| RoHS Durumu | Compliant | — |
| Embedded Memory Bits | — | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Paket | — | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Power Option | — | L (low-power) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |