EP3SE260F1517C4LN vs EP3SE260F1517I4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517C4LN disebabkan oleh Intel dan EP3SE260F1517I4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517C4LN - Stratix III E FPGA 255K LE, 1517-BGA | Intel
EP3SE260F1517C4LN ⚠ Bahagian terakhir untuk beliIntel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517C4LN | EP3SE260F1517I4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III E | — |
| Family | Stratix III E (Enhanced) | Stratix III E (Enhanced) |
| Logic Elements | 255,000 | 255,000 |
| Number of LABs/CLBs | 10,200 | — |
| Total Memory Bits | 16,672,768 (16.67 Mbit) | — |
| Number of I/O | 976 | — |
| Number of Gates | [DATA_NEEDED: gate count not published in web data] | — |
| Voltage - Supply | 0.9 V to 1.1 V core | — |
| Operating Frequency | 375 MHz to 450 MHz (per family) | — |
| Process Technology | 65 nm | 40 nm CMOS |
| Kemasan / Case | 1517-BBGA, FCBGA (FC-FBGA) | — |
| Jenis Pemasangan | Surface Mount (flip-chip) | — |
| Suhu Operasi | 0C to +85C (commercial grade per 'C' suffix) | -40C to +100C (case, industrial) |
| Tingkat sensitiviti Air Nama (MSL) | 3 (168 Hours) | — |
| Packaging | Tray | — |
| Speed Grade | C4 | I4 (industrial, 4th tier) |
| Lead-Free / Halogen-Free | Yes (LN suffix) | — |
| Status RoHS | Compliant | — |
| Embedded Memory Bits | — | 16,672,768 bits (~2,044 KBytes) |
| Logic Array Blocks (LABs) | — | 10,200 |
| User I/O Count | — | 976 |
| Kemasan | — | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) |
| Power Option | — | L (low-power) |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Transceivers | — | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps |
| DSP Blocks (18x18 multipliers) | — | Up to 384 (family-level, device-specific count not in provided data) |
| Partial Reconfiguration | — | Supported |
| Memory Interface Support | — | DDR3, DDR2, QDR II+ (hardened PHY) |
| Configuration Scheme | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |