EP3SL70F484I3 vs EP3SL50F484I3 तुलना
विस्तृत दोनों ओर की तुलना EP3SL70F484I3 द्वारा Intel और EP3SL50F484I3 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SL70F484I3 | EP3SL50F484I3 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | NRND |
| Family | Stratix III L | Stratix III L (Low Power) |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 1,900 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | Stratix III L — supports high-speed serial transceivers per family datasheet |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | — |
| ऑपरेटिंग तापमान | -40C to +100C (industrial) | 0 °C to +85 °C (commercial) |
| पैकेज | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| RoHS स्थिति | Compliant | — |
| Device Logic Elements | — | 47,500 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/O | — | 296 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Internal Operating Frequency | — | 500 MHz |
| माउंटिंग प्रकार | — | Surface Mount |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free/RoHS status] |
| MSL स्तर | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |