EP3SL70F484I3 vs EP3SL50F484I3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F484I3 sa pamamagitan ng Intel at EP3SL50F484I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL70F484I3 EP3SL50F484I3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili NRND
Family Stratix III L Stratix III L (Low Power)
Logic Elements 67,500 —
Adaptive Logic Modules (ALMs) 33,000 —
Logic Array Blocks (LABs) 2,700 1,900
Total Embedded Memory 2,699,264 bits (337 KB) —
M9K Memory Blocks 288 —
M144K Memory Blocks 12 —
DSP Blocks (18x18 multipliers) 384 —
User I/O Pins 296 —
Transceivers Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] Stratix III L — supports high-speed serial transceivers per family datasheet
PLLs 8 (4 enhanced PLLs + 4 fast PLLs) —
Process Node TSMC 40 nm —
Speed Grade -3 (mid-tier) —
Temperature na Operasyon -40C to +100C (industrial) 0 °C to +85 °C (commercial)
Packhaging 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Configuration Modes FPP, AS, PS, JTAG, AES encryption —
Design Software Quartus II (legacy) —
Tindminan RoHS Compliant —
Device Logic Elements — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/O — 296
Process Technology — 65 nm
Core Voltage — 1.1 V
Internal Operating Frequency — 500 MHz
Uri ng Pagpapasok — Surface Mount
Lead-Free / RoHS — [DATA_NEEDED: lead-free/RoHS status]
Level ng MSL — [DATA_NEEDED: MSL level]
Configuration Scheme — SRAM-based (volatile, requires external config device)

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