EP3SL70F484I3 vs EP3SL50F484I3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F484I3 disebabkan oleh Intel dan EP3SL50F484I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F484I3 EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 - Stratix III L FPGA, 67.5K LE, 484-FBGA | Intel

EP3SL70F484I3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F484I3 EP3SL50F484I3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family Stratix III L Stratix III L (Low Power)
Logic Elements 67,500 —
Adaptive Logic Modules (ALMs) 33,000 —
Logic Array Blocks (LABs) 2,700 1,900
Total Embedded Memory 2,699,264 bits (337 KB) —
M9K Memory Blocks 288 —
M144K Memory Blocks 12 —
DSP Blocks (18x18 multipliers) 384 —
User I/O Pins 296 —
Transceivers Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] Stratix III L — supports high-speed serial transceivers per family datasheet
PLLs 8 (4 enhanced PLLs + 4 fast PLLs) —
Process Node TSMC 40 nm —
Speed Grade -3 (mid-tier) —
Suhu Operasi -40C to +100C (industrial) 0 °C to +85 °C (commercial)
Kemasan 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch 484-ball FC-FBGA (Flip-Chip FineLine BGA)
Configuration Modes FPP, AS, PS, JTAG, AES encryption —
Design Software Quartus II (legacy) —
Status RoHS Compliant —
Device Logic Elements — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/O — 296
Process Technology — 65 nm
Core Voltage — 1.1 V
Internal Operating Frequency — 500 MHz
Jenis Pemasangan — Surface Mount
Lead-Free / RoHS — [DATA_NEEDED: lead-free/RoHS status]
Aras MSL — [DATA_NEEDED: MSL level]
Configuration Scheme — SRAM-based (volatile, requires external config device)

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