EP3SL70F484I3 vs EP3SL50F484I3 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SL70F484I3 tarafından Intel ve EP3SL50F484I3 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP3SL70F484I3 | EP3SL50F484I3 |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | NRND |
| Family | Stratix III L | Stratix III L (Low Power) |
| Logic Elements | 67,500 | — |
| Adaptive Logic Modules (ALMs) | 33,000 | — |
| Logic Array Blocks (LABs) | 2,700 | 1,900 |
| Total Embedded Memory | 2,699,264 bits (337 KB) | — |
| M9K Memory Blocks | 288 | — |
| M144K Memory Blocks | 12 | — |
| DSP Blocks (18x18 multipliers) | 384 | — |
| User I/O Pins | 296 | — |
| Transceivers | Up to 12 (3.75 Gbps) [DATA_NEEDED: confirm exact count for F484 package] | Stratix III L — supports high-speed serial transceivers per family datasheet |
| PLLs | 8 (4 enhanced PLLs + 4 fast PLLs) | — |
| Process Node | TSMC 40 nm | — |
| Speed Grade | -3 (mid-tier) | — |
| İşletim Sıcaklığı | -40C to +100C (industrial) | 0 °C to +85 °C (commercial) |
| Paket | 484-ball Flip-Chip BGA (FBGA-484), 1.0 mm pitch | 484-ball FC-FBGA (Flip-Chip FineLine BGA) |
| Configuration Modes | FPP, AS, PS, JTAG, AES encryption | — |
| Design Software | Quartus II (legacy) | — |
| RoHS Durumu | Compliant | — |
| Device Logic Elements | — | 47,500 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/O | — | 296 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.1 V |
| Internal Operating Frequency | — | 500 MHz |
| Montaj Türü | — | Surface Mount |
| Lead-Free / RoHS | — | [DATA_NEEDED: lead-free/RoHS status] |
| MSL Seviyesi | — | [DATA_NEEDED: MSL level] |
| Configuration Scheme | — | SRAM-based (volatile, requires external config device) |