MPC860TZQ80D4 vs MPC860TVR80D4 तुलना
विस्तृत दोनों ओर की तुलना MPC860TZQ80D4 द्वारा NXP Semiconductors और MPC860TVR80D4 द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MPC860TZQ80D4 - 80MHz PowerQUICC MPU, 357-BGA | NXP
MPC860TZQ80D4 ✗ जीवन की समाप्तिNXP Semiconductors
MPC860TVR80D4 - 80 MHz PowerQUICC MPC8xx MPU | NXP
MPC860TVR80D4 ✗ जीवन की समाप्तिविशेषता तुलना
| पैरामीटर | MPC860TZQ80D4 | MPC860TVR80D4 |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | उत्पादन बंद | उत्पादन बंद |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | MPC8xx PowerQUICC, 32-bit RISC |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Frequency | 80 MHz | 80 MHz |
| Bus Width | 32-bit | — |
| Operating Voltage | 3.3 V | 3.3 V |
| Number of Cores | 1 | 1 |
| Cache Memory | [DATA_NEEDED: unified cache size in KB] | — |
| Serial Communications Controllers (SCC) | 4 channels | — |
| Serial Management Controllers (SMC) | 2 channels | — |
| SPI Controllers | 2 | — |
| I2C Interface | 1 | — |
| पैकेज | 357-BGA (PBGA), 25 x 25 mm | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| ऑपरेटिंग तापमान | -40 C to +95 C (industrial grade per suffix T) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead (legacy PBGA) | — |
| RoHS स्थिति | RoHS non-compliant (legacy PBGA, contains lead) | RoHS Compliant |
| Packaging | Tray | Tray |
| Process Technology | 0.25 micron CMOS | 0.32 micrometer CMOS |
| पैकेज / केस | — | 357-BGA (PBGA 25x25 mm) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Memory Controller | — | DRAM, SRAM, Flash, EDO support |
| Lead Free Status | — | Lead Free |