MPC860TZQ80D4 vs MPC860TVR80D4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC860TZQ80D4 disebabkan oleh NXP Semiconductors dan MPC860TVR80D4 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MPC860TZQ80D4 | MPC860TVR80D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | MPC8xx PowerQUICC, 32-bit RISC |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Frequency | 80 MHz | 80 MHz |
| Bus Width | 32-bit | — |
| Operating Voltage | 3.3 V | 3.3 V |
| Number of Cores | 1 | 1 |
| Cache Memory | [DATA_NEEDED: unified cache size in KB] | — |
| Serial Communications Controllers (SCC) | 4 channels | — |
| Serial Management Controllers (SMC) | 2 channels | — |
| SPI Controllers | 2 | — |
| I2C Interface | 1 | — |
| Kemasan | 357-BGA (PBGA), 25 x 25 mm | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | -40 C to +95 C (industrial grade per suffix T) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead (legacy PBGA) | — |
| Status RoHS | RoHS non-compliant (legacy PBGA, contains lead) | RoHS Compliant |
| Packaging | Tray | Tray |
| Process Technology | 0.25 micron CMOS | 0.32 micrometer CMOS |
| Kemasan / Case | — | 357-BGA (PBGA 25x25 mm) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Memory Controller | — | DRAM, SRAM, Flash, EDO support |
| Lead Free Status | — | Lead Free |