MPC860TZQ80D4 vs MPC860TVR80D4 Perbandingan
Perbandingan bersamaan detil MPC860TZQ80D4 dari NXP Semiconductors dan MPC860TVR80D4 dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | MPC860TZQ80D4 | MPC860TVR80D4 |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Akhir Hidup | Akhir Hidup |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | MPC8xx PowerQUICC, 32-bit RISC |
| Core Architecture | PowerPC 32-bit | PowerPC + CPM (RISC communications processor) |
| Core Frequency | 80 MHz | 80 MHz |
| Bus Width | 32-bit | — |
| Operating Voltage | 3.3 V | 3.3 V |
| Number of Cores | 1 | 1 |
| Cache Memory | [DATA_NEEDED: unified cache size in KB] | — |
| Serial Communications Controllers (SCC) | 4 channels | — |
| Serial Management Controllers (SMC) | 2 channels | — |
| SPI Controllers | 2 | — |
| I2C Interface | 1 | — |
| Paket | 357-BGA (PBGA), 25 x 25 mm | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Suhu Kerja | -40 C to +95 C (industrial grade per suffix T) | [DATA_NEEDED: operating temperature range] |
| Lead Status | Contains Lead (legacy PBGA) | — |
| Status RoHS | RoHS non-compliant (legacy PBGA, contains lead) | RoHS Compliant |
| Packaging | Tray | Tray |
| Process Technology | 0.25 micron CMOS | 0.32 micrometer CMOS |
| Paket / Case | — | 357-BGA (PBGA 25x25 mm) |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| Communication Controllers | — | 3 FCC, 4 SCC, 2 SMC |
| Ethernet MAC | — | 10/100 Mbps integrated |
| Memory Controller | — | DRAM, SRAM, Flash, EDO support |
| Lead Free Status | — | Lead Free |