10M04SAM153I7G vs 10M08SAM153I7G Perbandingan
Perbandingan bersamaan detil 10M04SAM153I7G dari Intel dan 10M08SAM153I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M04SAM153I7G | 10M08SAM153I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 (10M04) | — |
| Family | MAX® 10 FPGA | MAX 10 |
| Logic Elements (LEs) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | — |
| User I/O Count | 112 | — |
| Process Technology | 55 nm (embedded flash, TSMC) | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage Support | 3.0 V / 3.3 V LVCMOS | — |
| Paket | 153-ball MBGA (Micro FineLine BGA) | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch |
| Package Pitch | [DATA_NEEDED: package ball pitch] | — |
| Suhu Kerja | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (Industrial) |
| Configuration Method | On-die flash, instant-on | Internal flash, JTAG |
| PLLs | [DATA_NEEDED: PLL count] | 4 (periphery) |
| Multiplier Blocks (18×18) | [DATA_NEEDED: multiplier count] | — |
| ADC Block | [DATA_NEEDED: ADC presence on this density] | 12-bit, 1 MSPS (1 hard IP block) |
| User Flash | [DATA_NEEDED: user flash size] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | 378 Kbit |
| Maximum User I/O | — | 112 |
| DSP Blocks (18x18 multipliers) | — | 24 |
| Speed Grade | — | I7 (industrial, 7) |
| On-die Flash Configuration | — | Yes (instant-on, dual-boot) |
| Global Clocks | — | 20 |
| User Flash Memory (UFM) | — | Up to 736 Kbyte |
| Level MSL | — | 3 (168 hours) |