10M04SAM153I7G vs 10M08SAM153I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M04SAM153I7G disebabkan oleh Intel dan 10M08SAM153I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M04SAM153I7G | 10M08SAM153I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX 10 (10M04) | — |
| Family | MAX® 10 FPGA | MAX 10 |
| Logic Elements (LEs) | 4,000 | — |
| Embedded Memory (bits) | 193,536 | — |
| User I/O Count | 112 | — |
| Process Technology | 55 nm (embedded flash, TSMC) | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage Support | 3.0 V / 3.3 V LVCMOS | — |
| Kemasan | 153-ball MBGA (Micro FineLine BGA) | 153-MBGA (VFBGA), 8 x 8 mm, 0.5 mm pitch |
| Package Pitch | [DATA_NEEDED: package ball pitch] | — |
| Suhu Operasi | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (Industrial) |
| Configuration Method | On-die flash, instant-on | Internal flash, JTAG |
| PLLs | [DATA_NEEDED: PLL count] | 4 (periphery) |
| Multiplier Blocks (18×18) | [DATA_NEEDED: multiplier count] | — |
| ADC Block | [DATA_NEEDED: ADC presence on this density] | 12-bit, 1 MSPS (1 hard IP block) |
| User Flash | [DATA_NEEDED: user flash size] | — |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Logic Elements (LE) | — | 8,000 |
| Embedded Memory (M9K blocks) | — | 378 Kbit |
| Maximum User I/O | — | 112 |
| DSP Blocks (18x18 multipliers) | — | 24 |
| Speed Grade | — | I7 (industrial, 7) |
| On-die Flash Configuration | — | Yes (instant-on, dual-boot) |
| Global Clocks | — | 20 |
| User Flash Memory (UFM) | — | Up to 736 Kbyte |
| Aras MSL | — | 3 (168 hours) |