10M50DAF484I7P vs 10M50DAF256I7G Perbandingan

Perbandingan bersamaan detil 10M50DAF484I7P dari Intel dan 10M50DAF256I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10M50DAF484I7P 10M50DAF256I7G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Paket 484-ball FineLine BGA (F484) 256-LBGA (17 mm x 17 mm)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) On-chip (4 typical for 10M50 family)
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Suhu Kerja -40C to +100C (Tj, industrial) -40C to +100C (Industrial)
Configuration Modes Internal flash, JTAG, dual-boot image support —
Status RoHS Compliant Compliant
Family — MAX 10
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (M9K bits) — 1,677,312
DSP Blocks (18 x 18 multipliers) — 4
Maximum User I/O — 178
Configuration Memory — Internal non-volatile flash (dual-boot)
Integrated ADC — 12-bit SAR, up to 17 analog inputs
Core Voltage — 1.2 V
Process Technology — TSMC 55 nm embedded flash
Tipe Mounting — Surface Mount (BGA)
Tray Quantity — 90 per tray (typical for 256-BGA)
Configuration Mode — Internal flash (instant-on)

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