10M50DAF484I7P vs 10M50DAF256I7G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 10M50DAF484I7P sa pamamagitan ng Intel at 10M50DAF256I7G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 10M50DAF484I7P 10M50DAF256I7G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Product Family MAX 10 —
Logic Elements (LE) 50,000 50,000
Embedded Memory (bits) 1,677,312 —
Embedded Memory Blocks M9K (and M144K) —
18x18 Multipliers 312 —
User I/O Pins (max) 360 —
Packhaging 484-ball FineLine BGA (F484) 256-LBGA (17 mm x 17 mm)
Pitch 1.0 mm —
Process Node 55 nm embedded flash (TSMC) —
On-die Configuration Flash Yes (non-volatile, instant-on) —
On-die ADC Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs —
PLLs 8 (general-purpose, fractional on selected devices) On-chip (4 typical for 10M50 family)
Global Clock Networks 20 —
Speed Grade 7 (slowest industrial bin, highest margin) —
Temperature na Operasyon -40C to +100C (Tj, industrial) -40C to +100C (Industrial)
Configuration Modes Internal flash, JTAG, dual-boot image support —
Tindminan RoHS Compliant Compliant
Family — MAX 10
Adaptive Logic Modules (ALM) — [DATA_NEEDED: ALM count]
Embedded Memory (M9K bits) — 1,677,312
DSP Blocks (18 x 18 multipliers) — 4
Maximum User I/O — 178
Configuration Memory — Internal non-volatile flash (dual-boot)
Integrated ADC — 12-bit SAR, up to 17 analog inputs
Core Voltage — 1.2 V
Process Technology — TSMC 55 nm embedded flash
Uri ng Pagpapasok — Surface Mount (BGA)
Tray Quantity — 90 per tray (typical for 256-BGA)
Configuration Mode — Internal flash (instant-on)

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