10M50DAF484I7P vs 10M50DAF256I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DAF484I7P disebabkan oleh Intel dan 10M50DAF256I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M50DAF484I7P | 10M50DAF256I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Product Family | MAX 10 | — |
| Logic Elements (LE) | 50,000 | 50,000 |
| Embedded Memory (bits) | 1,677,312 | — |
| Embedded Memory Blocks | M9K (and M144K) | — |
| 18x18 Multipliers | 312 | — |
| User I/O Pins (max) | 360 | — |
| Kemasan | 484-ball FineLine BGA (F484) | 256-LBGA (17 mm x 17 mm) |
| Pitch | 1.0 mm | — |
| Process Node | 55 nm embedded flash (TSMC) | — |
| On-die Configuration Flash | Yes (non-volatile, instant-on) | — |
| On-die ADC | Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs | — |
| PLLs | 8 (general-purpose, fractional on selected devices) | On-chip (4 typical for 10M50 family) |
| Global Clock Networks | 20 | — |
| Speed Grade | 7 (slowest industrial bin, highest margin) | — |
| Suhu Operasi | -40C to +100C (Tj, industrial) | -40C to +100C (Industrial) |
| Configuration Modes | Internal flash, JTAG, dual-boot image support | — |
| Status RoHS | Compliant | Compliant |
| Family | — | MAX 10 |
| Adaptive Logic Modules (ALM) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (M9K bits) | — | 1,677,312 |
| DSP Blocks (18 x 18 multipliers) | — | 4 |
| Maximum User I/O | — | 178 |
| Configuration Memory | — | Internal non-volatile flash (dual-boot) |
| Integrated ADC | — | 12-bit SAR, up to 17 analog inputs |
| Core Voltage | — | 1.2 V |
| Process Technology | — | TSMC 55 nm embedded flash |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Tray Quantity | — | 90 per tray (typical for 256-BGA) |
| Configuration Mode | — | Internal flash (instant-on) |