5CSEBA4U23C7SN vs 5CSEBA4U23C7N Perbandingan

Perbandingan bersamaan detil 5CSEBA4U23C7SN dari Intel dan 5CSEBA4U23C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 5CSEBA4U23C7SN 5CSEBA4U23C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Device Logic Elements 40,000 —
Hard Processor System Dual-core ARM Cortex-A9 MPCore with CoreSight Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 800 MHz —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (Kbits) 2,460 —
DSP Blocks (18x18) 112 224
Maximum User I/Os 364 —
Paket 672-ball UBGA, 23x23 mm 672-ball UBGAs (UBGA), 23x23 mm
Ball Pitch 0.8 mm —
Process Node TSMC 28 nm low-power —
Suhu Kerja -40C to +85C (industrial) Commercial 0C to +85C (C7 speed grade)
Memory Interfaces DDR2, DDR3, LPDDR2 (hard controller) —
Peripherals (HPS) USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART —
Configuration Modes JTAG, serial passive/active —
Speed Grade C7 —
Status RoHS Compliant Compliant
Device Variant — 5CSEA4 (Logic Element density)
Logic Elements — 40,000
HPS Maximum Core Frequency — 800 MHz
Embedded Memory — Approximately 2.7 Mbits (M10K + M9K)
Core Voltage — 1.1 V
User I/O Count — 364
High-Speed Transceivers — 6 (up to 3.125 Gbps)
PCIe Hard IP — 2 Gen2 blocks
Tipe Mounting — Surface Mount (BGA)
Process Technology — TSMC 28 nm low-power
HPS Memory Interface — DDR3, DDR3L, LPDDR2 (16-bit + ECC option)

Spek dan Sumber

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