5CSEBA4U23C7SN vs 5CSEBA4U23C7N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CSEBA4U23C7SN disebabkan oleh Intel dan 5CSEBA4U23C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ AktifIntel
5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7N ✓ AktifPengandingan Spesifikasi
| Parametr | 5CSEBA4U23C7SN | 5CSEBA4U23C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | 224 |
| Maximum User I/Os | 364 | — |
| Kemasan | 672-ball UBGA, 23x23 mm | 672-ball UBGAs (UBGA), 23x23 mm |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Suhu Operasi | -40C to +85C (industrial) | Commercial 0C to +85C (C7 speed grade) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| Status RoHS | Compliant | Compliant |
| Device Variant | — | 5CSEA4 (Logic Element density) |
| Logic Elements | — | 40,000 |
| HPS Maximum Core Frequency | — | 800 MHz |
| Embedded Memory | — | Approximately 2.7 Mbits (M10K + M9K) |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 364 |
| High-Speed Transceivers | — | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 2 Gen2 blocks |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Memory Interface | — | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |