5CSEBA4U23C7SN vs 5CSEBA4U23C7N 比較

詳細並排比較 5CSEBA4U23C7SN 由 Intel 與 5CSEBA4U23C7N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 5CSEBA4U23C7SN 5CSEBA4U23C7N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family Cyclone V SE SoC FPGA Cyclone V SE SoC FPGA
Device Logic Elements 40,000 —
Hard Processor System Dual-core ARM Cortex-A9 MPCore with CoreSight Dual ARM Cortex-A9 MPCore with CoreSight
HPS Maximum Frequency 800 MHz —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory (Kbits) 2,460 —
DSP Blocks (18x18) 112 224
Maximum User I/Os 364 —
封裝 672-ball UBGA, 23x23 mm 672-ball UBGAs (UBGA), 23x23 mm
Ball Pitch 0.8 mm —
Process Node TSMC 28 nm low-power —
工作溫度 -40C to +85C (industrial) Commercial 0C to +85C (C7 speed grade)
Memory Interfaces DDR2, DDR3, LPDDR2 (hard controller) —
Peripherals (HPS) USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART —
Configuration Modes JTAG, serial passive/active —
Speed Grade C7 —
RoHS 狀態 Compliant Compliant
Device Variant — 5CSEA4 (Logic Element density)
Logic Elements — 40,000
HPS Maximum Core Frequency — 800 MHz
Embedded Memory — Approximately 2.7 Mbits (M10K + M9K)
Core Voltage — 1.1 V
User I/O Count — 364
High-Speed Transceivers — 6 (up to 3.125 Gbps)
PCIe Hard IP — 2 Gen2 blocks
安裝類型 — Surface Mount (BGA)
Process Technology — TSMC 28 nm low-power
HPS Memory Interface — DDR3, DDR3L, LPDDR2 (16-bit + ECC option)

資料表與資源

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