5CSEBA4U23C7SN vs 5CSEBA4U23C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng 5CSEBA4U23C7SN sa pamamagitan ng Intel at 5CSEBA4U23C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
5CSEBA4U23C7SN - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7SN ✓ NakahandaIntel
5CSEBA4U23C7N - Cyclone V SE SoC FPGA, 40K LE, Dual ARM Cortex-A9 | Intel
5CSEBA4U23C7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | 5CSEBA4U23C7SN | 5CSEBA4U23C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone V SE SoC FPGA | Cyclone V SE SoC FPGA |
| Device Logic Elements | 40,000 | — |
| Hard Processor System | Dual-core ARM Cortex-A9 MPCore with CoreSight | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Kbits) | 2,460 | — |
| DSP Blocks (18x18) | 112 | 224 |
| Maximum User I/Os | 364 | — |
| Packhaging | 672-ball UBGA, 23x23 mm | 672-ball UBGAs (UBGA), 23x23 mm |
| Ball Pitch | 0.8 mm | — |
| Process Node | TSMC 28 nm low-power | — |
| Temperature na Operasyon | -40C to +85C (industrial) | Commercial 0C to +85C (C7 speed grade) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 (hard controller) | — |
| Peripherals (HPS) | USB 2.0 OTG, GbE MAC, CAN, SPI, I2C, UART | — |
| Configuration Modes | JTAG, serial passive/active | — |
| Speed Grade | C7 | — |
| Tindminan RoHS | Compliant | Compliant |
| Device Variant | — | 5CSEA4 (Logic Element density) |
| Logic Elements | — | 40,000 |
| HPS Maximum Core Frequency | — | 800 MHz |
| Embedded Memory | — | Approximately 2.7 Mbits (M10K + M9K) |
| Core Voltage | — | 1.1 V |
| User I/O Count | — | 364 |
| High-Speed Transceivers | — | 6 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 2 Gen2 blocks |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Process Technology | — | TSMC 28 nm low-power |
| HPS Memory Interface | — | DDR3, DDR3L, LPDDR2 (16-bit + ECC option) |