EP2S130F1020C3NGA vs EP2S180F1020C3 Perbandingan
Perbandingan bersamaan detil EP2S130F1020C3NGA dari Intel dan EP2S180F1020C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S130F1020C3NGA | EP2S180F1020C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix II | — |
| Logic Elements (LE) | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | 8,970 |
| Embedded Memory (TriMatrix) | 6,747,840 bits (6.7 Mbits) | — |
| Embedded DSP Blocks | Yes (18x18 multiplier blocks) | — |
| User I/Os | 742 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Maximum Internal Clock Frequency | 778.82 MHz | — |
| Paket | 1020-ball FC-FBGA | 1020-ball FBGA (flip-chip BGA) |
| Speed Grade | C3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | — |
| PLLs | 12 (8 fast PLLs + 4 enhanced PLLs) | — |
| Configuration Modes | PS, PPS, PPA, JTAG | — |
| Configuration Encryption | 128-bit AES | — |
| Status RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| On-chip Termination (OCT) | Yes (series, parallel, dynamic) | — |
| Series | — | Stratix II |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Tipe Mounting | — | Surface Mount |
| Process Node | — | 90 nm, all-layer copper SRAM |
| Suhu Kerja | — | Commercial (0C to +85C) |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |