EP2S130F1020C3NGA vs EP2S180F1020C3 比較
詳細並排比較 EP2S130F1020C3NGA 由 Intel 與 EP2S180F1020C3 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2S130F1020C3NGA | EP2S180F1020C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | NRND | Obsolete |
| Family | Stratix II | — |
| Logic Elements (LE) | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | 8,970 |
| Embedded Memory (TriMatrix) | 6,747,840 bits (6.7 Mbits) | — |
| Embedded DSP Blocks | Yes (18x18 multiplier blocks) | — |
| User I/Os | 742 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Maximum Internal Clock Frequency | 778.82 MHz | — |
| 封裝 | 1020-ball FC-FBGA | 1020-ball FBGA (flip-chip BGA) |
| Speed Grade | C3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | — |
| PLLs | 12 (8 fast PLLs + 4 enhanced PLLs) | — |
| Configuration Modes | PS, PPS, PPA, JTAG | — |
| Configuration Encryption | 128-bit AES | — |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| On-chip Termination (OCT) | Yes (series, parallel, dynamic) | — |
| Series | — | Stratix II |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| 安裝類型 | — | Surface Mount |
| Process Node | — | 90 nm, all-layer copper SRAM |
| 工作溫度 | — | Commercial (0C to +85C) |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |