EP2S130F1020C3NGA vs EP2S180F1020C3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1020C3NGA sa pamamagitan ng Intel at EP2S180F1020C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2S130F1020C3NGA EP2S180F1020C3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Family Stratix II —
Logic Elements (LE) 132,540 —
Logic Array Blocks (LABs) 6,627 8,970
Embedded Memory (TriMatrix) 6,747,840 bits (6.7 Mbits) —
Embedded DSP Blocks Yes (18x18 multiplier blocks) —
User I/Os 742 —
Process Technology 90 nm —
Core Voltage 1.2 V 1.2 V
Maximum Internal Clock Frequency 778.82 MHz —
Packhaging 1020-ball FC-FBGA 1020-ball FBGA (flip-chip BGA)
Speed Grade C3 C3
Temperature Grade Commercial (0C to +85C) —
PLLs 12 (8 fast PLLs + 4 enhanced PLLs) —
Configuration Modes PS, PPS, PPA, JTAG —
Configuration Encryption 128-bit AES —
Tindminan RoHS [DATA_NEEDED: rohs status] [DATA_NEEDED: RoHS status]
On-chip Termination (OCT) Yes (series, parallel, dynamic) —
Series — Stratix II
Device Family — EP2S180
Equivalent Logic Elements (LEs) — 179,400
Embedded Memory (RAM bits) — 9,383,040
Maximum User I/Os — 742
Uri ng Pagpapasok — Surface Mount
Process Node — 90 nm, all-layer copper SRAM
Temperature na Operasyon — Commercial (0C to +85C)
DSP Blocks — Dedicated high-speed multipliers
Memory Interfaces Supported — DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards — LVDS, LVPECL, SSTL, HSTL
Configuration Method — SRAM-based (volatile, requires boot device)
Development Toolchain — Quartus II / Quartus Prime

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita