EP2S130F1020C3NGA vs EP2S180F1020C3 Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP2S130F1020C3NGA tarafından Intel ve EP2S180F1020C3 tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EP2S130F1020C3NGA | EP2S180F1020C3 |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | NRND | Obsolete |
| Family | Stratix II | — |
| Logic Elements (LE) | 132,540 | — |
| Logic Array Blocks (LABs) | 6,627 | 8,970 |
| Embedded Memory (TriMatrix) | 6,747,840 bits (6.7 Mbits) | — |
| Embedded DSP Blocks | Yes (18x18 multiplier blocks) | — |
| User I/Os | 742 | — |
| Process Technology | 90 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Maximum Internal Clock Frequency | 778.82 MHz | — |
| Paket | 1020-ball FC-FBGA | 1020-ball FBGA (flip-chip BGA) |
| Speed Grade | C3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | — |
| PLLs | 12 (8 fast PLLs + 4 enhanced PLLs) | — |
| Configuration Modes | PS, PPS, PPA, JTAG | — |
| Configuration Encryption | 128-bit AES | — |
| RoHS Durumu | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| On-chip Termination (OCT) | Yes (series, parallel, dynamic) | — |
| Series | — | Stratix II |
| Device Family | — | EP2S180 |
| Equivalent Logic Elements (LEs) | — | 179,400 |
| Embedded Memory (RAM bits) | — | 9,383,040 |
| Maximum User I/Os | — | 742 |
| Montaj Türü | — | Surface Mount |
| Process Node | — | 90 nm, all-layer copper SRAM |
| İşletim Sıcaklığı | — | Commercial (0C to +85C) |
| DSP Blocks | — | Dedicated high-speed multipliers |
| Memory Interfaces Supported | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | — | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | — | SRAM-based (volatile, requires boot device) |
| Development Toolchain | — | Quartus II / Quartus Prime |