EP2SGX30DF780I3N vs EP2SGX30DF780I5N Perbandingan
Perbandingan bersamaan detil EP2SGX30DF780I3N dari Intel dan EP2SGX30DF780I5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2SGX30DF780I3N | EP2SGX30DF780I5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,380 | 33,880 (33,380 logic elements) |
| Configurable Logic Blocks (CLBs) | 33,880 | — |
| Total Memory Bits | 1,369,728 | — |
| Maximum Core Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| User I/O Pins | 361 | — |
| Paket | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Speed Grade | I3 | I5 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Core Voltage | — | 1.2 V |
| Internal Clock Frequency (max) | — | 622.08 MHz |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Number of Pins / Balls | — | 780 |
| Package Type | — | FC-FBGA-780 (Flip-Chip Fine-pitch BGA) |
| Package Size | — | 29 x 29 mm, 1.0 mm pitch |
| Suhu Kerja | — | -40C to +85C (Industrial) |
| Lead-Free / RoHS | — | Lead Free (per Kynix listing) |
| Temperature Grade Suffix | — | Industrial |