EP2SGX30DF780I3N vs EP2SGX30DF780I5N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2SGX30DF780I3N disebabkan oleh Intel dan EP2SGX30DF780I5N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2SGX30DF780I3N | EP2SGX30DF780I5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Logic Elements | 33,880 | — |
| Logic Cells | 33,380 | 33,880 (33,380 logic elements) |
| Configurable Logic Blocks (CLBs) | 33,880 | — |
| Total Memory Bits | 1,369,728 | — |
| Maximum Core Frequency | 622.08 MHz | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | — |
| User I/O Pins | 361 | — |
| Kemasan | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Operating Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Speed Grade | I3 | I5 |
| Logic Array Blocks (LABs) | — | 33,880 |
| Core Voltage | — | 1.2 V |
| Internal Clock Frequency (max) | — | 622.08 MHz |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Number of Pins / Balls | — | 780 |
| Package Type | — | FC-FBGA-780 (Flip-Chip Fine-pitch BGA) |
| Package Size | — | 29 x 29 mm, 1.0 mm pitch |
| Suhu Operasi | — | -40C to +85C (Industrial) |
| Lead-Free / RoHS | — | Lead Free (per Kynix listing) |
| Temperature Grade Suffix | — | Industrial |